Process for sharpening cutting-off tools and cutting-off process
First Claim
1. In a process for sharpening a cut-off tool for cutting off slices or wafers from work-pieces, the cut-off tool having a cutting layer which is applied to the cutting edge and has a bonded cutting grain, wherein the cut-off tool is sharpened by sawing into a solid sharpening substance, the improvement which comprises:
- during the sharpening, providing an oscillating movement, transverse to the cutting edge, between the cutting edge and the solid sharpening substance, during the period in which the cutting layer of the cutting edge penetrates into the solid sharpening substance.
1 Assignment
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Accused Products
Abstract
Cutting-off tools whose cutting edge has a cutting layer with a bonded cutting grain are sharpened by sawing momentarily into a solid sharpening substance, in which case, in addition to a relative movement between cutting edge and solid material corresponding to the sawing operation, an oscillating relative movement transversely thereto is also performed. The process is used with particular advantage in combination with processes for the centerhole sawing of semiconductor or oxidic material.
19 Citations
6 Claims
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1. In a process for sharpening a cut-off tool for cutting off slices or wafers from work-pieces, the cut-off tool having a cutting layer which is applied to the cutting edge and has a bonded cutting grain, wherein the cut-off tool is sharpened by sawing into a solid sharpening substance, the improvement which comprises:
- during the sharpening, providing an oscillating movement, transverse to the cutting edge, between the cutting edge and the solid sharpening substance, during the period in which the cutting layer of the cutting edge penetrates into the solid sharpening substance.
- View Dependent Claims (2, 3, 4, 5, 6)
Specification