High density disposable printed circuit inter-board connector

• US 4,813,128 A
• Filed: 01/13/1988
• Issued: 03/21/1989
• Est. Priority Date: 01/13/1988
• Status: Expired due to Term

• Current Assignee: CRAY Incorporated (Hewlett-Packard Enterprise Company)
• Original Assignee: CRAY Incorporated (Hewlett-Packard Enterprise Company)
• Inventors: Massopust, Dan
• Primary Examiner(s): Abrams, Neil
• Application Number:
  US07/143,572
• Time in Patent Office: 433 Days
• Field of Search: 439/874, 439/875, 439/876, 439/74, 439/75, 174/84 R, 29/830, 29/840, 29/843
• US Class Current: 29/830
• CPC Class Codes: H01R 12/523 by an interconnection through aligned holes in the boards or multilayer board
• CPC Class Codes: H01R 4/02 Soldered or welded connections H01R4/625, H01R4/723, H01R12/59 take precedence
• CPC Class Codes: H05K 1/0212 Printed circuits or mounted components having integral heating means
• CPC Class Codes: H05K 2201/10303 Pin-in-hole mounted pins
• CPC Class Codes: H05K 2201/10378 Interposers
• CPC Class Codes: H05K 2201/10424 Frame holders
• CPC Class Codes: H05K 2203/1115 Resistance heating, e.g. by current through the PCB conductors or through a metallic mask
• CPC Class Codes: H05K 3/3494 Heating methods for reflowing of solder using integral heating means H05K1/0212
• CPC Class Codes: H05K 3/368 parallel to each other H05K3/361 takes precedence
• CPC Class Codes: Y10T 29/49126 Assembling bases

Abstract

A connector frame for use in the connection of electrical circuit assemblies having pins integrally connected therewith. The connector frame is a body of electrically non-conductive, thermally conductive material having one or more apertures bored through the body, said apertures being through-plated with an electrically-conductive material having a lower melting point than any of the surrounding materials. Said body also includes at least one separate aperture in which is disposed an electrically-conductive, heat-generating wire, said wire having the capacity to generate sufficient heat to melt the electrically-conductive material disposed in the apertures to form a strong electrical and mechanical bond between the pins of the electrical circuit assemblies.

Claims

1. A method of manufacturing a connector block for use in the connection of pins between electronic circuit assemblies, said method comprising the steps of:

(a) forming a first part of a body of the connector block from an electrically non-conductive material;

(b) forming a second part of the connector body from an electrically non-conductive material;

(c) placing corresponding grooves in both the first part and the second part of the connector block;

(d) placing a low temperature solder within the grooves of the first part and the second part;

(e) attaching the first part and the second part of the connector block such that the low temperature solder is aligned in the grooves of the connector block; and

(f) placing an electrically conductive, heat generating wire in at least one of said parts of the connector block.

2. The method according to claim 1 wherein said steps (d) and (e) are reversed in order.

3. The method according to claim 2 wherein said step of placing a low temperature solder in the grooves is accomplished using through-plating.