Process for coating synthetic optical substrates

• US 4,815,962 A
• Filed: 12/11/1987
• Issued: 03/28/1989
• Est. Priority Date: 12/11/1987
• Status: Expired due to Term

• Current Assignee: Senshin Capital LLC (Intellectual Ventures LLC)
• Original Assignee: Polaroid Corporation (PLR IP Holdings LLC)
• Inventors: Cardone, Paul A.
• Primary Examiner(s): NOT, DEFINED
• Application Number:
  US07/131,641
• Time in Patent Office: 473 Days
• Field of Search: 427/38, 427/39, 427/40, 427/164, 427/248.1, 427/322, 427/331
• US Class Current: 427/525
• CPC Class Codes: C23C 14/022 by means of bombardment with energetic particles or radiation
• CPC Class Codes: C23C 14/24 Vacuum evaporation

Abstract

A process for coating a synthetic resin optical substrate by subjecting the surface of the substrate to low temperature ion bombardment prior to coating in order to open the chemical bonds on the surface of the substrate and coating the substrate surface before the bonds return to their normal or closed condition. The substrate may also be subjected to low temperature ion bombardment during and after coating to further improve coating adherence and abrasion resistance characteristics.

Claims

1. In a process for vapor deposition coating a heat sensitive synthetic resin substrate surface having a plurality of chemical bonds, the improvement wherein prior to vapor deposition coating of the substrate, the process comprises the step of:

opening at least some of the chemical bonds on the surface of the substrate by passive bombardment of the surface with ions of a relatively large molecule inert gas.

2. The process of claim 1, further comprising:

coating the substrate by vapor deposition while at least some of the chemical bonds are still open.

3. A process for coating a synthetic resin substrate surface having a plurality of chemical bonds, comprising the steps of:

subjecting the surface of the substrate to a low temperature bombardment of ions of an inert gas for a period sufficient to open the chemical bonds on the substrate surface; and

coating the open-bonded substrate surface.

4. The process of claim 3, wherein said coating is an optical coating.

5. The process of claim 3, wherein said inert gas is a Group VIIIA gas.

6. The process of claim 3, wherein said inert gas is argon.

7. The process of claim 3, further comprising:

subjecting said substrate surface to low temperature ion bombardment during coating.

8. The process of claim 7, further comprising:

subjecting said substrate surface to ion bombardment after coating.

9. A process for coating optical surfaces on synthetic resin workpieces, said process including the steps of:

loading the workpieces and a coating evaporant in a closed chamber;

evacuating the chamber to a preliminary vacuum;

filling the chamber with a large molecule inert gas to a negative fill pressure;

ionizing the gas to effect ion bombardment of the optical surfaces under conditions to dislodge contaminants and open chemical bonds at said surfaces without disrupting the bond structure of the workpieces below said surfaces;

evacuating the chamber to a purging vacuum to remove contaminants dislodged from the workpieces during said ion bombardment step; and

coating the optical surfaces by vapor deposition of the coating evaporant within a short period of time after said ion bombardment step.

10. The process of claim 9, wherein the inert gas in a Group VIIIA gas.

11. The process of claim 9, wherein said ionizing step is performed by subjecting the gas in said chamber to a voltage potential of about 500 to 3000 volts.

12. The process of claim 11, wherein said ion bombardment step is continued for at least 11/2 minutes.

13. The process of claim 12, wherein said negative fill pressure is in the range of 50 to 100 milli-Torr during said ion bombardment.

14. The process of claim 9, wherein said coating step is performed within approximately 20 minutes after said ion bombardment step.

15. The process of claim 9, wherein the workpieces are maintained at substantially ground potential at least during said ionizing and coating steps.

16. A process for applying an optical coating to the surface of a synthetic optical substrate, the process being carried out in a coating chamber and comprising the steps of:

(a) evacuating the coating chamber by reducing the pressure within the coating chamber to about 2×

10^-5 Torr or less;

(b) back-filling the coating chamber with argon gas to a pressure of about 50 to 100 milli-Torr;

(c) ionizing the argon gas with a negative potential of -500 to 3000 volts for about 11/2 to 3 minutes;

(d) purging the coating chamber by reducing the chamber pressure to about 2×

10^-5 Torr;

(e) back-filling the chamber with fresh argon gas to a pressure of about 8 to 9×

10^-5 Torr; and

,

(f) coating the substrate by vapor deposition of an evaporant coating material.

17. A process for applying an optical coating to a surface of a synthetic optical substrate, the process being performed within a coating chamber and comprising the steps of:

(a) evacuating the coating chamber by reducing the pressure within the coating chamber to about 2×

10^-5 Torr or less;

(b) back-filling the coating chamber with argon gas to a pressure of about 50 to 100 milli-Torr;

(c) ionizing the argon gas with a negative potential of -500 to -3000 volts for about 11/2 to 3 minutes;

(d) purging the coating chamber by reducing the chamber pressure to about 2×

10^-5 Torr;

(e) back-filling with fresh argon gas to a pressure of about 3×

10^-4 Torr; and

,

(f) ionizing the argon gas with a negative potential of about -1000 to -3000 volts during vapor deposition of an evaporant coating material.

18. A process for applying an optical coating to a surface of a synthetic optical substrate while the substrate is within a coating chamber, comprising the steps of:

(a) reducing the pressure within the coating chamber to about 2×

10^-5 Torr or less;

(b) back-filling with argon gas to a pressure of about 50×

10^-3 Torr;

(c) ionizing the argon gas with a negative potential of about a -500 volts for at least 11/2 minutes;

(d) reducing the pressure to about 8×

10^-6 Torr or less;

(e) evaporating a coating material;

(f) back-filling the chamber with argon gas to a pressure of about 1×

10^-2 Torr; and

,

(g) ionizing the argon gas with a negative potential of about -500 volts for approximately 30 minutes.