Method of producing semiconductor device having multilayer conductive lines
First Claim
1. A method of forming a multilayer structure of a semiconductor device comprising a contact layer in contact with a semiconductor substrate, a barrier layer formed on the contact layer and a conductive layer formed on the barrier layer, comprising the steps of:
- (a) mixing refractory metal nitride powder and refractory metal powder to produce a refractory metal nitride mixture;
(b) sintering the refractory metal nitride mixture to form a target of combined refractory metal nitride; and
(c) sputtering the target in an atmosphere substantially excluding nitrogen gas to deposit the combined refractory metal nitride on the contact layer.
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Abstract
A triple-layer electrode structure or a multilayer interconnecting structure of a semiconductor device comprising a contact (a lower conductive) layer of aluminum or its alloy which comes into contact with a silicon substrate, a barrier layer of refractory metal nitride (e.g. titanium nitride) and refractory metal (e.g., tungsten), and a (upper) conductive layer of aluminum or its alloy. The TiN-W barrier layer prevents overdissolution of silicon into aluminum in spite of heat-treatment at a relatively elevated temperature. The barrier layer is formed by sintering a mixture of refractory metal nitride powder and refractory metal powder to form a target which is sputter deposited on the contact layer in an atomsphere excluding gaseous nitrogen.
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Citations
3 Claims
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1. A method of forming a multilayer structure of a semiconductor device comprising a contact layer in contact with a semiconductor substrate, a barrier layer formed on the contact layer and a conductive layer formed on the barrier layer, comprising the steps of:
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(a) mixing refractory metal nitride powder and refractory metal powder to produce a refractory metal nitride mixture; (b) sintering the refractory metal nitride mixture to form a target of combined refractory metal nitride; and (c) sputtering the target in an atmosphere substantially excluding nitrogen gas to deposit the combined refractory metal nitride on the contact layer. - View Dependent Claims (2, 3)
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Specification