Wafer processing apparatus

• US 4,818,327 A
• Filed: 07/16/1987
• Issued: 04/04/1989
• Est. Priority Date: 07/16/1987
• Status: Expired due to Term

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Davis, Cecil J., Matthews, Robert T.
• Primary Examiner(s): Powell, William A.
• Application Number:
  US07/074,419
• Time in Patent Office: 628 Days
• Field of Search: 156/643, 156/646, 156/653, 156/656, 156/657, 156/659.1, 156/662, 156/345, 118/728, 118/729, 118/50.1, 118/620, 427/38, 427/39, 427/41, 427/54.1, 204/192.1, 204/192.12, 204/192.23, 204/192.25, 204/192.32, 204/192.35, 204/192.36, 204/192.37, 204/298, 252/79.1, 414/217, 414/222, 414/225, 414/226, 414/744 R, 414/744 A, 414/744 B, 414/744 C, 414/411, 414/416, 414/422, 437/228, 437/234, 437/235, 437/238, 437/241, 437/245
• US Class Current: 156/345.37
• CPC Class Codes: H01L 21/67115 mainly by radiation

Abstract

A processing apparatus and method for rapid thermal processing wherein the radiant heat source is dynamically reconfigurable to change the heating distribution across the radii of the wafer. Since the radiative and conductive heat flow paths from parts of the wafer near the center are different from the heat flow paths for the parts of the wafer near the edge, the loadings will change dynamically as the wafer is heated and cooled. This temperature dependence in the relative couplings across the wafer makes it very difficult to maintain a flat temperature profile during heatup and cooldown, and failure to maintain a flat temperature profile can cause wafer damage (especially wafer warpage). The present application describes a processing apparatus and method which changes the distribution dynamically, so that a higher fraction of the total power is provided to the wafer edge regions after the wafer is at high temperature. This can be done by using (as a radiant heat source) a lamp module wherein the central portion of the lamp reflector module is mechanically moved in and out to change the center to edge distribution of heating power.

Claims

1. An apparatus for processing wafers comprising:

(a) a vacuum processing chamber;

(b) a source of radiant energy; and

(c) a reflector which radiatively couples said source of radiant energy to the wafer in a wafer support.

2. The apparatus of claim 1, wherein a load lock is connected to an adjacent vacuum processing chamber by a vacuum port, and wherein said vacuum port is also controlled by a computer control system, and wherein said control system is programmed to prevent opening of said vacuum port until an output signal has indicated that substantially no particulate has been present in the space within the interior of said processing chamber for at least a predetermined period of time.

3. The apparatus of claim 1, further comprising an environmental and vacuum control device for maintaining a vacuum in a processing chamber and for removal of any particulate.

4. The apparatus of claim 1, wherein the wafer is supported in a manner such that a side on which circuit components are to be formed faces downward.

5. The apparatus of claim 1, wherein said source of radiant energy provides maximum specific power at wavelengths in the visible range.

6. The apparatus of claim 1, wherein the shape of said reflector is dynamically controllable to alter the radial distribution of energy coupled into the wafer.

7. The apparatus of claim 1, wherein the shape of said reflector is dynamically controllable by moving a central element of said reflector toward or away from the wafer.

8. The apparatus of claim 1, wherein said radiant energy source comprises a plurality of incandenscent lamps.

9. The apparauts of claim 1 wherein the radiant heat source reflectors are cooled by contact with a water cooled housing.

10. The apparatus of claim 1, further comprising:

(a) a temperature sensor for sensing the temperature of a partially fabricated semiconductor wafer and for providing an output signal; and

(b) a computerized feedback loop for moving said reflector when the wafer temperature, as provided at the temperature sensors output reaches a desired value.

11. The apparatus of claim 1, further comprising a transparent vacuum wall separating said heating source from the wafer.

12. The apparatus of claim 11, wherein said vacuum wall is sealed to said processing chamber by a radially elastically expandable metallic seal which includes a deformable soft portion.

13. The apparatus of claim 1, wherein said reflector comprises:

(a) a plurality of stationary reflectors; and

(b) at least one movable reflector.

14. The apparatus of claim 13, wherein said reflectors are coated with gold.

15. The apparatus of claim 13, wherein said movable reflector is movable toward or away from the wafer that the distribution of radiant energy coupling to said plurality of incandenscent lamps is thereby changed radially across the wafer.

16. The apparatus of claim 13, further comprising:

(a) a temperature sensor for sensing the temperature of the wafer and for providing an output signal; and

(b) a feedback loop for changing the radial distribution of radiant energy coupling across the wafer in accordance with the instantaneous temperature of the wafer.

19. The apparatus of claim 13 further including a plurality of incandescet lamps.

17. An apparatus for processing wafers comprising:

(a) a vacuum process chamber

(b) a source of radiant energy; and

(c) a reflector thermally coupled to tranfer energy from said source of radiant energy and to a wafer and having an alterable shape to redistribut said radiant energy in response to a control signal.

18. The apparatus as set forth in claim 17 including a control system producing said control signal to alterate the shape of said reflector to a selected shape;

and at least one temperature sensor sensing the temperature of a portion of said wafer and connected to said control system.

20. An apparatus for processing a workpiece, comprising;

(a) a process chamber; and

(b) a source of radiant energy coupled to the workpiece capable of altering the shape of a radiant energy distribution in response to a control signal.

21. The apparatus as set forth in claim 20 including a control stystem producing said control signal to alterate the shape of the radiant energy distribution to a selected shape;

and at least one temperature sensor sensing the temperature of a portion of said wafer and connected to said control system.