Low profile opto-device assembly with specific optoelectronic lead mount

• US 4,818,859 A
• Filed: 06/01/1987
• Issued: 04/04/1989
• Est. Priority Date: 06/01/1987
• Status: Expired due to Term

• Current Assignee: Carroll Touch Incorporated
• Original Assignee: Carroll Touch Incorporated
• Inventors: Hough, Stewart E.
• Primary Examiner(s): WILLIS, DAVIS L
• Assistant Examiner(s): Ruoff, Jessie
• Application Number:
  US07/057,065
• Time in Patent Office: 673 Days
• Field of Search: 250/221, 250/222.1, 250/239, 250/231, 250/214 C, 339/17, 339/125, 339/210 R, 350/96.20, 350/96.21, 340/555, 340/556, 340/557
• US Class Current: 250/221
• CPC Class Codes: G01V 8/20 using multiple transmitters or receivers
• CPC Class Codes: G06F 3/0421 by interrupting or reflecting a light beam, e.g. optical touch-screen
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/10106 Light emitting diode [LED]
• CPC Class Codes: H05K 2201/10446 Mounted on an edge
• CPC Class Codes: H05K 2201/10757 Bent leads

Abstract

A low profile opto-device panel assembly suitable for use in an input detection apparatus used as an input device in conjunction with a visual display is disclosed. Arrays of light emitting devices and light detecting devices are juxtaposed along the internal edge of a peripheral frame printed circuit board to reduce the overall height of the panel assembly. Alignment housings surrounding each of the arrays of opto-devices are attached to the printed circuit board and extend inwardly of the sides of the peripheral frame printed circuit board. The opto-devices disposed in the alignment housings along the internal edge of the printed circuit boards are mechanically and electrically interconnected to the printed circuit board by bent leads which extend along the upper surface of the printed circuit board and into conventional printed circuit board holes.

Claims

1. An opto-device assembly comprising:

a substrate having an upper surface and a lower surface with opposed first and second peripheral edges extending between the upper and lower surfaces and interconnection means adjacent the first peripheral edge of the substrate; and

at least one opto-device having a body and leads extending from the body, the opto-device assembly being characterized in that at least a portion of each lead extends along the upper surface of the substrate between the interconnection means and the first peripheral edge of the substrate, the opto-device body being juxtaposed to the first peripheral edge with at least a portion of the opto-device body extending below the upper surface of the substrate.

2. The opto-device assembly of claim 1 wherein the substrate comprises a printed circuit board.

3. The opto-device assembly of claim 2 wherein a housing member is attached to the printed circuit board and extends from the lower surface of the printed circuit board to a position above the upper surface thereof, the housing member also being juxtaposed to the first peripheral edge of the printed circuit board;

each opto-device being positioned within the housing member.

4. The opto-device assembly of claim 3 wherein a plurality of opto-devices are positioned side-by-side along the first peripheral edge of the printed circuit board.

5. The opto-device assembly of claim 4 wherein the first peripheral edge of the printed circuit board has a recess extending along a portion of its length, the opto-devices being positioned within the recess, the housing member being attached to the printed circuit board adjacent the recess.

6. The opto-device assembly of claim 5 wherein the printed circuit board comprises a frame extending at least partially around a central opening, the first peripheral edge of the printed circuit board being adjacent the central opening.

7. The opto-device assembly of claim 6 wherein the frame is rectangular, each side of the rectangular frame having a recess extending between but not to each corner of the rectangular frame;

the housing member comprising a plurality of separate linear members.

8. The opto-device assembly of claim 7 wherein each linear member is attached to the printed circuit board adjacent the corners of the printed circuit board.

9. The opto-device assembly of claim 3 wherein the housing member is open between opposite faces.

10. The opto-device assembly of claim 3 wherein the housing includes means for aligning each opto-device relative to the printed circuit board.

11. The opto-device assembly of claim 2 wherein the interconnection means comprises holes in the printed circuit board, the leads of each opto-device being bent intermediate a free end thereof and the opto-device body, the portion of each lead adjacent the free end thereof extending through the holes in the printed circuit board.

12. An opto-device panel assembly for use in an input detection apparatus of the type used to detect the intrusion of an opaque element into an irradiated field, the panel assembly being configured to extend around but not into the irradiated field and comprising:

an array of opto-devices having leads extending from a body, the opto-devices comprising a plurality of light emitting devices aligned with an array of light detecting devices;

a peripheral frame comprising an interconnection substrate, the opto-devices being mounted on the frame with light emitting devices being spaced from aligned light detecting devices, the frame being open between corresponding arrays of light emitting devices and light detecting devices, the substrate having an internal peripheral edge, the opto-device panel being characterized in that the opto-devices are disposed with at least a portion of the leads extending along an upper surface of the substrate to the internal peripheral edge of the substrate and secured to circuits thereon and with the opto-device body being disposed within the internal peripheral edge of the substrate, at least a portion of the body of each opto-device extending below the upper surface of the substrate to reduce the height of the opto-device panel assembly.

13. The opto-device panel assembly of claim 12 wherein the substrate comprises a printed circuit board.