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Low profile opto-device assembly with specific optoelectronic lead mount

  • US 4,818,859 A
  • Filed: 06/01/1987
  • Issued: 04/04/1989
  • Est. Priority Date: 06/01/1987
  • Status: Expired due to Term
First Claim
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1. An opto-device assembly comprising:

  • a substrate having an upper surface and a lower surface with opposed first and second peripheral edges extending between the upper and lower surfaces and interconnection means adjacent the first peripheral edge of the substrate; and

    at least one opto-device having a body and leads extending from the body, the opto-device assembly being characterized in that at least a portion of each lead extends along the upper surface of the substrate between the interconnection means and the first peripheral edge of the substrate, the opto-device body being juxtaposed to the first peripheral edge with at least a portion of the opto-device body extending below the upper surface of the substrate.

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