Apertured ring for exhausting plasma reactor gases

• US 4,820,371 A
• Filed: 12/15/1987
• Issued: 04/11/1989
• Est. Priority Date: 12/15/1987
• Status: Expired due to Term

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Rose, Alan D.
• Primary Examiner(s): Powell, William A.
• Application Number:
  US07/132,306
• Time in Patent Office: 483 Days
• Field of Search: 118/728, 118/50.1, 118/620, 204/192.12, 204/192.32, 204/192.3, 204/298, 156/345, 156/643, 156/646, 427/38, 427/39
• US Class Current: 156/345.51
• CPC Class Codes: H01J 37/3244 Gas supply means

Abstract

An annular ring (38) adapted for use in a plasma reaction chamber. The annular ring (38) includes a central opening aperture for laterally retaining a semiconductor slice (40) within the chamber. Spaced around the ring are a plurality of gas exhaust ports (58) for providing a back pressure within the chamber, for removing gases therefrom. Different rings can be provided with different central opening apertures to accommodate the processing of different sized slices. Alternative arrangements of the ring (38) provide for mask openings (68) to mask selected areas of the slice (40) and prevent plasma reactions thereat.

Claims

1. Apparatus adapted for use with a plasma reactor of the type having a reaction chamber for dispensing a gas, and a semiconductor slice holder for subjecting a semiconductor slice to the gas, comprising:

a ring having an outside dimension for engaging a sidewall of the reaction chamber, an inside dimension defining a central opening aperture for receiving therein and laterally confining the semiconductor slice.

2. The apparatus of claim 1, wherein said ring includes a plurality of exhaust ports for exhausting the gas from the reaction chamber.

3. The apparatus of claim 2, wherein said ring is annular shaped with said exhaust ports spaced therearound.

4. The apparatus of claim 1, wherein said ring is an insulator which does not support a plasma reaction.

5. The apparatus of claim 1, wherein said reaction chamber apparatus includes a cylindrical collimator, and wherein said ring includes an annular relief for receiving therein said collimator.

6. The apparatus of claim 1, wherein said ring incldes a central mask opening which covers at least a portion of said slice to prevent said gases from reaching said portion.

7. The apparatus of claim 6, wherein said ring includes a recessed area therein for laterally supporting said slice while yet covering a portion of said slice.

8. The apparatus of claim 6, wherein said control mask opening includes a square mask opening.

9. The apparatus of claim 8, wherein said central opening aperture is annular shaped for supporting a round slice therein.

10. The apparatus of claim 1, further including a plurality of said rings, each including a different sized central opening aperture for supporting therein a different sized slice.

11. Apparatus for use with a plasma reactor of the type for processing semiconductor slices, comprising:

a reaction chamber for generating a plasma reaction;

an inlet for inputting a gas into said chamber;

a support ring for laterally supporting a slice within said chamber, said ring having a plurality of ports for exhausting the gas from said chamber at a plane above said slice, said ports being sized to produce a back pressure in said chamber to thereby enhance uniformity of material deposition as a result of said plasma reaction.

12. The apparatus of claim 11, wherein said ring includes an annular part for spacing said slice from a sidewall of said chamber.

13. The apparatus of claim 12, further including a plurality of said rings, each ring having a different radial width of said annular part to accommodate slices of different diameters.

14. The apparatus of claim 11, wherein said ring is electrically insulating.

15. The apparatus of claim 14, wherein said annular ring includes a mask opening of a different size than a central opening aperture, and said mask opening being smaller than a surface area of the slice.

16. Apparatus adapted for use with a plasma reactor of the type having a reaction chamber for dispensing a gas, and a semiconductor slice holder for subjecting a semiconductor slice to the gas, comprising:

an electrically insulating ring providing a space between the slice and a sidewall of said chamber, said ring having a plurality of exhaust ports spaced therearound for exhausting gas from an area above said slice to the outside of said chamber.

17. The apparatus of claim 16, wherein said ring includes an annular central opening for laterally retaining said slice within said chamber, and a mask opening for masking a portion of said slice to prevent said gases from reaching said slice.

18. The apparatus of claim 16, wherein said ring is constructed of a material which does not support a plasma reaction and thus substantially no plasma reaction deposits form on said ring.