Test apparatus for printed circuit boards

• US 4,820,975 A
• Filed: 12/29/1987
• Issued: 04/11/1989
• Est. Priority Date: 01/14/1987
• Status: Expired due to Term

• Current Assignee: International Computers Limited (Fujitsu Limited)
• Original Assignee: International Computers Limited (Fujitsu Limited)
• Inventors: Diggle, Brian
• Primary Examiner(s): Tokar, Michael J.
• Application Number:
  US07/138,864
• Time in Patent Office: 469 Days
• Field of Search: 324/158 R, 324/158 F, 324/158 D, 324/73 R, 324/73 PC, 358/107, 356/399, 356/400, 356/401
• US Class Current: 324/750.22
• CPC Class Codes: G01R 1/07335 for double-sided contacting or for testing boards with surface-mounted devices (SMD's)
• CPC Class Codes: G01R 31/2805 Bare printed circuit boards

Abstract

Test apparatus is described for testing a printed circuit board (PCB). The apparatus includes two test heads, one for each side of the board. Each test head carries an array of spring loaded probes for making electrical contact with the pads on the PCB. Each head also includes two optical fiber image guides for viewing alignment marks at diagonally opposite corners of the PCB, so as to indicate the degree of misalignment between the head and the PCB. The alignment can be adjusted by means of linear drive mechanisms which allow the position of the head to be adjusted in two dimensions relative to the PCB.

Claims

1. A method of testing a printed circuit board utilising test apparatus comprising at least one test head having an array of probes for contacting pads on the printed circuit board, the method comprising the steps of:

providing at least two alignment marks at spaced-apart positions on the printed circuit board;

simultaneously conveying images of the alignment marks along corresponding optical fibre image guides mounted in fixed relationship to the test head; and

bringing both the conveyed images into alignment with associated fixed reference points.

3. Apparatus according to claim 1 wherein said alignment marks are at diagonally opposite corners of the printed circuit board.

4. Apparatus according to claim 1 including a television camera connected to each image guide for converting the images conveyed by the image guide into electrical signals.

5. Apparatus according to claim 4 including a television monitor associated with each television camera and means for connecting said electrical signals to the respective monitors.

6. Apparatus according to claim 5 wherein each television monitor includes a fixed graticule for defining said fixed reference points.

7. Apparatus according to claim 4 wherein said television cameras are colour cameras.

8. Apparatus according to claim 1 including a light source and optical fibre light guides arranged to convey light from the light source to the surface of the printed circuit board in the vicinity of the alignment marks.

2. Test apparatus for testing a printed circuit board, the apparatus having at least one test head carrying an array of probes for contacting pads on the printed circuit board, the apparatus including:

at least two spaced-apart optical fibre image guides, mounted in fixed relationship to the test head, for simultaneously conveying images of two corresponding alignment marks on the printed circuit board; and

means for adjusting the position of the test head relative to the printed circuit board in two directions in a plane parallel to that of the printed circuit board to enable the conveyed images to be brought into alignment with respective fixed reference points.

9. Apparatus according to claim 2 wherein said means for adjusting the position of the test head included a first linear drive means for moving the test head in a first direction, and two further linear drive means for moving the test head in a second direction perpendicular to the first direction and, by differential operation of the two further drive means, to rotate the test head about an axis perpendicular to the first and second directions.