Method for forming cover layer over wire joint

• US 4,822,434 A
• Filed: 11/30/1987
• Issued: 04/18/1989
• Est. Priority Date: 07/10/1986
• Status: Expired due to Term

• Current Assignee: Yazaki Corporation
• Original Assignee: Yazaki Corporation
• Inventors: Naruse, Koji, Okazaki, Toshio, Sawaki, Atsushi, Ono, Mamoru
• Primary Examiner(s): Dawson, Robert A.
• Application Number:
  US07/126,391
• Time in Patent Office: 505 Days
• Field of Search: 156/48, 156/49, 156/55, 156/56, 156/158, 156/275.5, 156/275.7, 264/22, 264/272.14, 264/337, 523/173
• US Class Current: 156/48
• CPC Class Codes: B29C 2035/0827 using UV radiation
• CPC Class Codes: B29C 35/0805 using electromagnetic radiation
• CPC Class Codes: B29C 35/0888 using transparant moulds
• CPC Class Codes: B29C 39/10 incorporating preformed parts or layers, e.g. casting around inserts or for coating articles coating a surface by casting in general B05D1/30, B29C39/126 takes precedence
• CPC Class Codes: B29C 70/74 Moulding material on a relatively small portion of the preformed part, e.g. outsert moulding B29C70/845 takes precedence
• CPC Class Codes: H01R 4/70 Insulation of connections end caps H01R4/22
• CPC Class Codes: H02G 1/145 Moulds
• CPC Class Codes: H02G 15/003 Filling materials, e.g. solid or fluid insulation

Abstract

The invention provides an improved method for forming a cover layer over a joint of electrical wires. Portions of insulation layers of wires to be joined are stripped and the bared conductors of the wires assembled in a desired configuration to form a joint. The joint is placed in a transparent mold and the mold is filled with a photosetting resin. Radiation of an appropriate wavelength is then passed through the mold to harden the resin.

Claims

1. A method for forming a cover layer over a joint of electrical wires, comprising the steps of:

assembling a plurality of electrical wires to form a joint;

placing said joint in a transparent mold;

filling said mold with a photosetting resin;

applying radiation through said mold to harden said resin; and

removing said mold after said resin is hardened.

2. The method for forming a cover layer of claim 1, wherin said mold has top and bottom parts, and said step of filling said mold comprises injecting liquid resin material through a resin injecting port in said top part.

3. The method for forming a cover layer of claim 1, wherein said photsetting resin is of a type which adheres to insulation layers of said wires when hardened.

4. The method for forming a cover layer of claim 1, further comprising an initial step of stripping portions of insulation layers from said wires, and wherein, in said step of placing said joint in said mold, remaining portions of said insulation layers are positioned at edge portions of said mold so that said resin adhere to said remaining portions.

5. A method for forming a cover layer over a joint of electrical wires, comprising the steps of:

assembling a plurality of electrical wires to form a joint;

wrapping said joint with an insulating electrical tape;

placing said joint in a transparent mold;

filling said mold with a photosetting resin; and

applying radiation through said mold to harden said resin.

6. The method for forming a cover layer of claim 5, wherein said mold is formed from a thin transparent sheet and is left as a part of said cover layer.