Processing apparatus and method

• US 4,822,450 A
• Filed: 05/18/1988
• Issued: 04/18/1989
• Est. Priority Date: 07/16/1987
• Status: Expired due to Term

• Current Assignee: Texas Instruments, Inc.
• Original Assignee: Texas Instruments, Inc.
• Inventors: Loewenstein, Lee M., Davis, Cecil J., Matthews, Robert T., Jucha, Rhett B., Hildenbrand, Randall C., Freeman, Dean W., Jones, John I.
• Primary Examiner(s): Powell, William A.
• Application Number:
  US07/198,632
• Time in Patent Office: 335 Days
• Field of Search: 156/643, 156/646, 156/653, 156/656, 156/657, 156/659.1, 156/662, 156/345, 427/38, 427/39, 427/41, 427/54.1, 118/728, 118/729, 118/50.1, 118/620, 204/192.1, 204/192.2, 204/192.23, 204/192.25, 204/192.32, 204/192.35, 204/192.36, 204/192.37, 204/298, 414/217, 414/222, 414/225, 414/226, 414/744 R, 414/744 A, 414/744 B, 414/744 C, 414/411, 414/416, 414/422, 437/228, 437/234, 437/235, 437/238, 437/241, 437/245
• US Class Current: 438/709
• CPC Class Codes: C23C 16/482 using incoherent light, UV to IR, e.g. lamps
• CPC Class Codes: C23C 16/517 using a combination of discharges covered by two or more of groups C23C16/503 - C23C16/515
• CPC Class Codes: C23C 16/54 Apparatus specially adapted for continuous coating

Abstract

A processing apparatus and method compatible with a vacuum process system for wafers, wherein an in situ source of ultraviolet light is provided to enhance chemical activity at the wafer surface, and a remote plasma source is provided in the process gas flow upstream of the wafer, to provide activated species to the wafer face, and a radiatively coupled heat source is also provided so that the wafer can be rapidly thermally cycled.

Claims

1. An apparatus for processing of wafers, comprising:

(a) a vacuum chamber;

(b) a wafer support within said vacuum chamber, said wafer support being capable of supporting a wafer;

(c) gas flow passages positioned to permit release of a desired process gas flow in proximity to the surface of the wafer;

(d) an ultraviolet energy source within said vacuum chamber separte from the wafer and positioned to illuminate the wafer with ultraviolet energy;

(e) electrodes positioned to permit generating a plasma remote from said wafer support, at least some of said gas flow passage being connected to flow the process gasses through said remote plasma electrodes; and

(f) a source of radiant energy positioned to permit illuminating the backside of the wafer.

2. The apparatus of claim 1, wherein a load lock is connected to an adjacent vacuum chamber by a vacuum port, and wherein said vacuum port is also controlled by a computer control system, and wherein said control system is programmed to prevent opening of said vacuum port until said output signal has indicated that substantially no particulate has been present in the space within the interior of said chamber for at least a predetermined period of time.

3. The apparatus of claim 1, further comprising an environmental and vacuum control device for maintaining a vacuum in a processing chamber and for removal of any particulate.

4. The apparatus of claim 1, wherein the wafer is supported in a manner such that a side on which circuit components are to be formed faces downward.

5. The apparatus of claim 1, wherein said source of radiant energy provides maximum specific power at wavelengths in the visible range.

6. The apparatus of claim 1, wherein said radiant energy source comprises a plurality of incandescent lamps.

7. The apparatus of claim 1 wherein the radiant heat source reflectors are cooled by contact with a water cooled housing.

8. The apparatus of claim 1, further comprising a transparent vacuum wall separatiang said heating source from the wafer.

9. The apparatus of claim 1, further comprising a transparent vacuum wall separating said heating source from the wafer, said transparent vacuum wall having a quartz ring fused onto it on which the wafer rests.

10. The apparatus of claim 1, wherein the quartz window comprises a thin quartz wafer which rests on an elastomer which rests on the thick quartz window.

11. The apparatus of claim 1, wherein a passage is provided for introducing a purge gas between the wafer and said transparent vacuum wall.

12. The apparatus of claim 1, wherein said vacuum wall is sealed to said process chamber by a radially elastically expandable metallic seal which includes a deformable soft portion.

13. The apparatus of claim 1, wherein said reflectors are coated with gold.

14. The apparatus of claim 1, further comprising:

(a) a gas supply;

(b) a microwave power source;

(c) a microwave cavity in which power supplied by the microwave power source excites the gas from the gas supply.

15. The apparatus of claim 1, wherein said internal ultraviolet source comprises:

(a) a ultraviolet chamber bounded on one side by the process chamber;

(b) a gas supply to the ultraviolet chamber;

(c) a thin window substantially transparent to ultraviolet light separating the process chamber from the ultraviolet chamber;

(d) an electrode for coupling radio frequency energy to a plasma inside said ultraviolet chamber.

16. The apparatus of claim 1, wherein said thin window of said ultraviolet source comprises quartz.

17. The apparatus of claim 1, wherein said thin window of said ultraviolet source comprises sapphire.

18. A method of processing wafers comprising;

(a) transferring a wafer into a process chamber;

(b) applying a pressure to said chamber less than ambient to maintain said chamber at less than ambient;

(c) providing a first gas to a plasma generating module separated from said chamber and producing a remote plasma;

(d) to said remote plasma;

(e) illuminating the wafer with ultraviolet energy from an ultraviolet energy source within said vacuum chamber separate from the wafer;

(f) illuminating the backside of the wafer with a source of radiant energy;

(g) supplying an additional process gas; and

(h) flowing the remote plasma and the additional process gas over said wafer disposed within said chamber.

19. An apparatus for processing a workpiece, comprising:

(a) a first chamber having a workpiece disposed therein;

(b) a source of radiant heat coupled to the workpiece;

(c) a second chamber within said first chamber having at least a pair of electrodes positioned to form a plasma within said second chamber adjacent said workpiece; and

(d) a third chamber for generating ultraviolet light within said first chamber and adjacent said second chamber for illuminating said workpiece.

20. The apparatus as set forth in claim 19 wherein workpiece has a face to be process facing downward.

21. The apparatus as set forth in claim 19 wherein said third chamber is in fluid communication with a fourth chamber.

22. The apparatus as set forth in claim 19 wherein said third chamber is separated from said fourth chamber by a substantially transparent window.

23. The apparatus as set forth in claim 22 wherein said substantially transparent window is comprised of quartz.

24. The apparatus as set forth in claim 22 wherein said substantially transparent window is comprised of sapphire.

25. The apparatus as set forth in claim 19 wherein said second, third, and fourth chambers are separately controlled to operate singly.

26. The apparatus as set forth in claim 19 wherein said second, third, and fourth chambers are separately controlled to operate in any combination.

27. The apparatus as set forth in claim 19 wherein said fourth chamber is located below said workpiece.

28. The apparatus as set forth in claim 19 wherein said third chamber has said pair of electrodes above and below said workpiece.

29. The apparatus as set forth in claim 19 wherein the plasma from said second chamber is introduced to the surface from below said workpiece.

30. The apparatus as set forth in claim 19 wherein the workpiece is a wafer.