Encapsulated blood pressure transducer

• US 4,825,876 A
• Filed: 02/23/1988
• Issued: 05/02/1989
• Est. Priority Date: 02/23/1988
• Status: Expired due to Term

• Current Assignee: Hospira Incorporated (Pfizer Inc.)
• Original Assignee: Abbott Laboratories Incorporated
• Inventors: Beard, Robert W.
• Primary Examiner(s): Coven, Edward M.
• Assistant Examiner(s): Sykes, Angela D.
• Application Number:
  US07/159,356
• Time in Patent Office: 434 Days
• Field of Search: 128/672-675, 128/748, 73/708, 73/715, 73/720, 73/740, 73/753-754, 73/756
• US Class Current: 600/488
• CPC Class Codes: A61B 5/0215 by means inserted into the body catheters A61M25/00
• CPC Class Codes: G01L 19/0084 to the outside of the housing other details about the housing see G01L19/14
• CPC Class Codes: G01L 19/143 Two part housings
• CPC Class Codes: G01L 19/147 Details about the mounting of the sensor to support or covering means
• CPC Class Codes: G01L 9/0054 integral with a semiconducting diaphragm
• CPC Class Codes: Y10S 439/93 Coupling part wherein contact is comprised of a wire or brush

Abstract

An apparatus and method for providing a blood pressure transducer suitable for use in a catheter line, for monitoring blood pressure. Two embodiments of the blood pressure transducer (20, 120) are disclosed, both of which include connectors (24) suitable for connection to a catheter line. A flow-through passage (22) extends between the two connectors, in fluid communication with a solid-state pressure transducer chip (36), which is mounted on a chip carrier (34) inside a rectangular-shaped plastic housing (30/130, 32). The chip carrier includes a plurality of formed flat leads (38) connected to the pressure transducer chip, and an extending nib (62) having a passage (66) filled with a silicon gel (64), which couples fluid pressure in the flow-through passage to a pressure sensitive diaphragm (106) on the solid-state pressure transducer chip. Electrical signals are transmitted to and from the pressure transducer chip through a multiconductor lead (40) having a plurality of conductors (42), which make electrical contact with the formed flat leads during assembly of the housing. Use of the preassembled chip carrier and of a solid-state pressure transducer chip which includes its own thermal compensation circuit greatly reduces the assembly cost of the blood pressure transducer.

Claims

1. Apparatus for measuring fluid pressure in a fluid line, comprising:

(a) a pressure transducer comprising a semiconductor circuit on which are disposed a plurality of electrical contacts, and a pressure sensitive surface, said pressure sensitive surface experiencing a strain as a pressure is applied thereto, the strain causing the pressure transducer to produce an output signal, which varies as a function of the pressure, through the plurality of electrical contacts disposed on the semiconductor circuit;

(b) a housing defining a cavity in which the pressure transducer is disposed and including a connector adapted to attach to the fluid line, the housing further including a fluid passage extending through the housing, proximate to the pressure sensitive surface of the pressure transducer and providing communication of fluid pressure between the connector and said pressure sensitive surface;

(c) a plurality of insulated electrical conductors through which electrical signals are conveyed to and from the pressure transducer; and

(d) an integrally formed chip carrier mounted in the cavity, said pressure transducer being attached to the chip carrier, said chip carrier including;

(i) a fluid interface between the fluid passage and the pressure transducer, said interface including means for transmitting fluid pressure between the fluid passage and the pressure sensitive surface;

(ii) a quick-connect electrical interface between the plurality of electrical conductors and the plurality of electrical contacts on the semiconductor circuit of the pressure transducer; and

,

(iii) means for sealing the pressure transducer within the cavity so that one side of the pressure sensitive surface is exposed to the means for transmitting fluid pressure and so that the opposite side thereof is isolated from the fluid passage and the fluid pressure therein.

2. The apparatus of claim 1, wherein the quick-connect electrical interface of the chip carrier includes a plurality of leads connected to the electrical contacts on the semiconductor circuit of the pressure transducer, and wherein the leads are formed in a "U" shape and engage the electrical conductors by spring force.

3. The apparatus of claim 2, wherein a bond area at an end of each lead is disposed on the carrier proximate the pressure transducer and is connected to the electrical contacts on the semiconductor circuit with fine wires.

4. The apparatus of claim 1, wherein the chip carrier comprises a generally planar surface, having a recess formed therein in which the pressure transducer is mounted, and an aperture formed in the recess over which the pressure sensitive surface of the pressure transducer is disposed.

5. The apparatus of claim 4, wherein the recess includes a shelf on which is disposed a plurality of lead bond areas, said bond areas being connected to a plurality of leads that extend from the chip carrier and outwardly of an end thereof.

6. The apparatus of claim 4, wherein a nib projects from a surface of the chip carrier opposite that in which the recess is formed, said nib being disposed around the aperture and extending into engagement with a receptacle formed in the housing, in fluid communication with the fluid passage.

7. The apparatus of claim 6, wherein said means for transmitting fluid pressure comprises a substantially incompressible gel, and wherein the nib is filled with the gel.

8. The apparatus of claim 1, wherein the housing comprises a first section on which the electrical conductors are terminated and a second section on which the connector is disposed, said first and second sections being sealingly joined after the chip carrier and pressure transducer are mounted in the cavity.

9. The apparatus of claim 1, wherein the pressure transducer comprises a piezoresistive type transducer, including a plurality of resistors connected in a Wheatstone bridge configuration.

10. The apparatus of claim 9, wherein the semiconductor circuit further comprises means for temperature compensating the resistance of the resistors.

11. The apparatus of claim 1, wherein the insulated electrical conductors include a resistor, which is connected in parallel with the output signal from the pressure transducer to reduce the apparent impedance of the pressure transducer relative to a device connected to monitor its output signal.

12. In a catheter system, a pressure sensing apparatus adapted to attach to a catheter and operative to produce an electrical signal indicative of the magnitude of fluid pressure in the catheter, said apparatus comprising:

(a) pressure sensing means, including a first and a second surface, for sensing a differential fluid pressure applied between the first surface and the second surface thereof and producing an electrical signal indicative of the magnitude of the fluid pressure, said second surface thereof including contact means for connecting the electrical signal to a plurality of discrete conductors;

(b) housing means for enclosing the pressure sensing means, including;

(i) connector means for providing a sealed connection to a line in fluid communication with the catheter system,

(ii) passage means for conveying a fluid from the connector means to a point within the housing means proximate the first surface of the pressure sensing means, and

(iii) an electrical cable for conveying the electrical signal from the pressure sensing apparatus; and

(c) carrier means, disposed within the housing means, for;

(i) integrally defining a sealed aperture disposed between the first surface of the pressure sensing means and the passage means, including pressure transmitting means disposed in the aperture for transmitting fluid pressure from the fluid in the passage means to the first surface of the pressure sensing means,

(ii) mounting the pressure sensing means within the housing means in sealed relationship with the fluid passage means, and

(iii) conducting the electrical signal from the plurality of discrete conductors to the electrical cable through a plurality of spring biased leads, which are disposed on the carrier means.

13. The apparatus of claim 12, wherein the electrical cable comprises a plurality of insulated wires, each wire being stripped of insulation at an end portion that is terminated in the housing means, said leads in the carrier means being formed in a "U" shaped loop that is spring biased to engage the end portions of the wires, forming a conductive contact therewith.

14. The apparatus of claim 12, wherein the housing means comprise a first and a second section, opposed mating surfaces of the first and the second section defining therebetween a cavity in which the carrier means and pressure sensing means are disposed.

15. The apparatus of claim 14, wherein the first section of the housing means is attached to the electrical cable and the second section is attached to the connector means.

16. The apparatus of claim 14, wherein the pressure sensing means are mounted on the carrier means and the plurality of discrete conductors are attached between the spring biased leads and the contact means forming an assembly, and wherein said assembly is sealed into the cavity by mating the first section of the housing means to the second section.

17. The apparatus of claim 14, wherein the carrier means include a nib disposed around said aperture proximate the first surface of the pressure sensing means and projecting into the passage means, said pressure transmitting means being disposed within said nib.

18. The apparatus of claim 17, wherein the pressure transmitting means comprise a substantially incompressible gel, which seals the aperture, preventing fluid communication between the passage means and the first surface of the pressure sensing means.

19. The apparatus of claim 17, wherein the housing means include an adhesive channel, said first and second sections of the housing means being joined with an adhesive, said adhesive flowing through the adhesive channel to join and the seal the nib to the housing means.

20. The apparatus of claim 12, wherein the pressure sensing means comprise a thin film semiconductor circuit disposed on the periphery of the second surface and a pressure sensitive diaphragm disposed on the center of the first and the second surfaces.

21. A method for assembling a pressure sensing device useful for measuring pressure in a catheter system, said pressure sensing device including a pressure transducer having a pressure sensing surface and a plurality of electrical contacts, a chip carrier, an electrical cable including a plurality of conductors, and a housing, comprising the steps of:

(a) attaching the pressure transducer to the chip carrier;

(b) bonding wires to the electrical contacts and to a plurality of lead areas disposed on the chip carrier, providing an electrically conductive path therebetween;

(c) forming a plurality of leads that are attached to the chip carrier, generally into a "U" shape;

(d) filling an aperture disposed on the clip carrier adjacent the pressure sensing surface of the pressure transducer with a substantially incompressible gel;

(e) mounting the chip carrier with the pressure transducer attached in a recess formed in a first portion of the housing, with the aperture in fluid communication with a catheter connector formed on the housing, said catheter connector adapting the housing for connection to the catheter system;

(f) positioning the cable in an opening formed within the housing so that the formed leads engage the plurality of conductors in the electrical cable; and

(g) securing a second portion of the housing to the first portion, so that the pressure transducer and chip carrier are sealed within the housing.

22. The method of claim 21, wherein the aperture is defined by a projecting nib disposed on the chip carrier, the step of mounting the chip carrier in a first portion of the housing including the step of seating the projecting nib into a mating receptacle formed on the interior of the first portion of the housing.

23. The method of claim 22, wherein the projecting nib is filled with the incompressible gel.

24. The method of claim 21, wherein the second portion of the housing is secured to the first portion thereof with an adhesive.

25. Apparatus for mounting a pressure transducer comprising:

(a) a baseplate having a recessed portion on which a generally planar surface is formed, said recessed portion including an aperture that extends through the baseplate;

(b) a plurality of electrically conductive leads that extend outwardly from an end of the baseplate, into the recessed portion; and

(c) a lead bond area disposed within the recessed portion, on which is terminated an end of each of the leads that are adapted to be electrically connected to the pressure transducer.

26. The apparatus of claim 25, wherein the baseplate is adapted to mount the pressure transducer in an automated process by its attachment to a thin flexible strip in which a plurality of similar baseplates are attached and carried.

27. The apparatus of claim 26, wherein the baseplate is attached to the thin flexible strip during its manufacture.

28. The apparatus of claim 26, wherein the plurality of electrically conductive leads are formed from the thin, flexible strip during manufacture of the apparatus.

29. The apparatus of claim 25, wherein the aperture extends through a nib that projects outwardly of the baseplate, and which is adapted to be filled with a substantially incompressible gel.

30. The apparatus of claim 25, wherein the lead bond area is disposed on a shelf formed in the recessed portion of the baseplate, and the leads extend through the baseplate, the ends of the leads being plated with a precious metal of relatively higher electrical conductivity than a metal from which the leads are formed.

31. The apparatus of claim 25, wherein the baseplate is generally rectangular in shape and comprises a top portion and a bottom portion disposed on opposite surfaces of the thin flexible strip.