Liquid crystal display device having an extention metal film wiring which is covered by polyimide layer having low viscosity under 1.0 poise before curing

• US 4,826,297 A
• Filed: 12/19/1986
• Issued: 05/02/1989
• Est. Priority Date: 12/25/1985
• Status: Expired due to Fees

• Current Assignee: Hitachi Device Engineering Co., Ltd., Hitachi, Ltd.
• Original Assignee: Hitachi Device Engineering Co., Ltd., Hitachi, Ltd.
• Inventors: Kanazaki, Mikio, Toma, Shinobu, Kubo, Kiichirou
• Primary Examiner(s): Miller, Stanley D.
• Assistant Examiner(s): MAI, HUY KIM
• Application Number:
  US06/943,747
• Time in Patent Office: 865 Days
• Field of Search: 350/334, 350/331 R, 350/339 R, 339/17 M, 339/17 L, 368/342, 368/242, 368/80, 368/30, 357/80, 357/84
• US Class Current: 349/151
• CPC Class Codes: G02F 1/1345 Conductors connecting electrodes to cell terminals
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation

Abstract

A liquid crystal display device comprising upper and lower substrates with electrodes on the inner surfaces thereof, at least one of said upper and lower substrates including an extended portion thereof which projects beyond the edge of the other substrate, liquid crystal material sandwiched between said upper and lower substrates, a sealing member disposed around the periphery enclosing said liquid crystal material, a driving integrated circuit chip mounted on the inner surface of said extended portion, metal film wiring formed on the inner surface of said extended portion mechanically and electrically connected to said driving integrated circuit chip via solder, polyimide resin coating covering said metal film wirings, and resin coating covering said polyimide resin for filling up pinholes in the polyimide resin coating and being of low viscosity before curing.

Claims

1. A liquid crystal display device comprising:

upper and lower substrates with electrodes on the inner surfaces thereof, at least one of said upper and lower substrates including an extended portion thereof which projects beyond the edge of the other substrate,

liquid crystal material sandwiched between said upper and lower substrates,

a sealing member disposed around the periphery enclosing said liquid crystal material,

a driving integrated circuit chip mounted on the inner surface of said extended portion,

metal film wiring formed on the inner surface of said extended portion mechanically and electrically connected to said driving integrated circuit chip via solder,

a first resin coating comprising polyimide and covering said metal film wirings,

and a second resin coating covering said first resin coating for filling up pinholes in the first resin coating and being of low viscosity under 1.0 poise before curing.

2. A liquid crystal display device according to claim 1, wherein said second resin coating covering said first resin coating is made of urethane resin.

3. A liquid crystal display device according to claim 1 wherein said first resin coating covering said metal film wirings has a temperature of thermal decomposition above 300°

C.

4. A liquid crystal display device according to claim 1 wherein said first resin coating is made of photosensitive polyimide resin.

5. A liquid crystal display device according to claim 1, wherein said first resin coating also covers a part of the inner surface of said extended portion that underlies said driving integrated circuit chip and that is between parts of said metal film wiring.

6. A liquid crystal display device according to claim 1, wherein said driving integrated circuit chip is covered with a third resin coating;

said third resin also covering portions of said first resin coating adjacent to said driving integrated circuit chip and being covered by a portion of said second resin coating.

7. A liquid crystal display device according to claim 6, wherein said third resin coating is an epoxy resin.