Piezoelectric pressure-sensitive element and method for making same

• US 4,826,616 A
• Filed: 06/17/1988
• Issued: 05/02/1989
• Est. Priority Date: 09/08/1987
• Status: Expired due to Term

• Current Assignee: Toyokako Kabushiki Kaisha
• Original Assignee: Toyokako Kabushiki Kaisha
• Inventors: Tanino, Katsumi, Nakada, Morihito
• Primary Examiner(s): Cooper, Jack
• Application Number:
  US07/208,062
• Time in Patent Office: 319 Days
• Field of Search: 252/62.9, 264/24, 523/442, 523/458, 528/111, 528/118, 528/117
• US Class Current: 252/62.90R
• CPC Class Codes: C04B 35/491 based on lead zirconates and lead titanates , e.g. PZT
• CPC Class Codes: H10N 30/092 Forming composite materials
• CPC Class Codes: H10N 30/852 Composite materials, e.g. having 1-3 or 2-2 type connectivity

Abstract

A piezoelectric pressure-sensitive element comprising a dispersion of a dipolarly oriented ferroelectric ceramic powder in a cured product of a composition comprised of an epoxy resin having at least two epoxy groups in the molecules, a compound having defined numbers of amino groups, benzene rings, carbonyl groups and methylene groups, and a crosslinking agent. A methd for making such a piezoelectric pressure-sensitive element is also described, in which the resin composition comprising a ferroelectric ceramic powder is thermally cured and applied with an electric field at a high temperature to cause dipolar orientation of at least the ceramic powder.

Claims

1. A piezoelectric pressure-sensitive element which comprises:

a dispersion of a dipolarly oriented ferroelectric ceramic powder in a cured product made from a composition of (1) an epoxy resin having at least two epoxy groups;

(2), a compound which has at least two amino groups, at least two benzene rings, at least two carbonyl groups and at least two methylene group units, each unit consisting of at least four methylene groups, said amino groups, benzene rings, carbonyl groups and methylene groups being linearly arranged and (3) a crosslinking agent for the epoxy resin, said cured product having dipolarly oriented microcrystals dispersed therein, the microcrystals having been formed during the curing of said composition.

2. A piezoelectric pressure-sensitive element according to claim 1, wherein said crosslinking agent is a mixture of an imidazole derivative and a pyridine derivative.

3. A piezoelectric pressure-sensitive element according to claim 1, wherein said cured product is made of 100 parts by weight of said epoxy resin, from (70) to (85) parts by weight of said compound, and from (10) to (30) parts by weight of said crosslinking agent.

4. A piezoelectric pressure-sensitive element according to claim 1, wherein said element is in the form of a sheet.

5. A piezoelectric pressure-sensitive element according to claim 1, wherein said ferroelectric ceramic powder is used in an amount of 90 wt % of the total composition.

6. A piezoelectric pressure-sensitive element according to claim 5, wherein said ferroelectric ceramic powder has a size of from 0.5 to 100 micrometers.

7. A piezoelectric pressure-sensitive element according to claim 1, wherein said compound (2) is polytetramethyleneoxide-di-p-aminobenzoate.

8. The piezoelectric pressure-sensitive element according to claim 7, wherein said polytetramethylene oxide-di-p-aminobenzoate has at least 52 methylene groups which are linearly arranged.

9. A method for making a piezoelectric pressure-sensitive element, the method comprising mixing a composition of (1) an epoxy resin having at least two epoxy groups, (2) a compound which has at least two amino groups, at least two benzene rings, at least two carbonyl groups and at least two methylene group units, each unit consisting of at least 4 methylene groups, said amino grops, benzene rings, carbonyl groups and methylene groups being arranged linearly, and (3) a crosslinking agent for the epoxy resin, with a ferroelectric ceramic powder, thermally curing the mixture by crosslinkage, and applying an electric field to the ceramic powder dispersed in the cured product to cause dipolar orientation, said electric field being not less than 10 kV/cm and applied at a temperature of from 100°

to 180°

C.

10. A method according to claim 9, wherein the thermal curing is effected at a temperature of from 140°

to 200°

C.

11. A method according to claim 10, further comprising cooling the cured product while applying the electric field.