LED array head using a fiber bundle

• US 4,827,290 A
• Filed: 09/29/1987
• Issued: 05/02/1989
• Est. Priority Date: 11/27/1986
• Status: Expired due to Fees

• Current Assignee: ALPS Electric Company Limited (Alps Alpine Co., Ltd.)
• Original Assignee: ALPS Electric Company Limited (Alps Alpine Co., Ltd.)
• Inventors: Yoritomo, Makoto, Murata, Shinji, Fuse, Masashi
• Primary Examiner(s): Goldberg, E. A.
• Assistant Examiner(s): REINHART, MARK J
• Application Number:
  US07/102,537
• Time in Patent Office: 581 Days
• Field of Search: 346/107 R, 346/108, 346/160, 250/560, 250/561
• US Class Current: 347/245
• CPC Class Codes: B41J 2/45 using light-emitting diode [LED] or laser arrays
• CPC Class Codes: G02B 6/4204 the coupling comprising intermediate optical elements, e.g. lenses, holograms encapsulated active devices H01S5/02208, H01L33/52
• CPC Class Codes: G02B 6/4249 comprising arrays of active devices and fibres
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2224/73257 Bump and wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 27/153 in a repetitive configuration, e.g. LED bars
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 33/58 Optical field-shaping elements

Abstract

An LED array head has an LED array which selectively emits light. The LED array is mounted on a substrate in a flip chip form with a light emitting section located opposed to a surface of the substrate. A fiber bundle including a plurality of optical fibers is buried in the substrate with an end portion of the fiber bundle located at a position in the vicinity of the light emitting section of the LED array.

Claims

1. An LED array head comprising:

an LED array which selectively emits light, said LED array being mounted on a substrate in a flip chip form with a light emitting section located to oppose a surface of the substrate, and

a fiber bundle including a plurality of optical fibers having no self-convergence characteristic, said fiber bundle being buried in the substrate with an end portion of said fiber bundle located at a position in the vicinity of the light emitting section of said LED array.

2. An LED array head according to claim 1, wherein said substrate is transparent and made of glass.