Formation of catalytic metal nuclei for electroless plating

• US 4,830,880 A
• Filed: 03/22/1988
• Issued: 05/16/1989
• Est. Priority Date: 04/22/1986
• Status: Expired due to Fees

• Current Assignee: Nissan Chemical Industries Limited (Shin-Etsu Chemical Company Limited)
• Original Assignee: Nissan Chemical Industries Limited (Shin-Etsu Chemical Company Limited)
• Inventors: Nogami, Tatsuya, Takakura, Makoto, Okubi, Kenichi
• Primary Examiner(s): Morgenstern, Norman
• Assistant Examiner(s): Padgett, M. L.
• Application Number:
  US07/171,223
• Time in Patent Office: 420 Days
• Field of Search: 427/97, 427/98, 427/229, 427/306
• US Class Current: 427/98.1
• CPC Class Codes: C23C 18/28 Sensitising or activating
• CPC Class Codes: H05K 3/181 by electroless plating adhesives therefor H05K3/387
• CPC Class Codes: H05K 3/387 for electroless plating H05K3/4661 takes precedence

Abstract

An electroless plating method which comprises applying to a substrate a polymer composition comprising 100 parts by weight of a polymer and an organic metal complex in an amount of from 0.001 to 50 parts by weight as metal, pyrolytically decomposing the organic metal complex at a temperature of from 50° to 500° C. to form plating catalyst metal nuclei on the substrate, removing the dried polymer coating, and conducting electroless plating of the substrate.

Claims

1. An electroless plating method which comprises applying to a substrate a polymer composition consisting essentially of 100 parts by weight of a polymer and an organic metal complex in an amount of from 0.001 to 50 parts by weight as metal, pyrolytically decomposing the organic metl complex at a temperature of from 80°

to 350°

C. to form plating catalyst metal nuclei on the substrate without decomposing the polymer, removing the dried polymer coating by using an organic solvent and/or an aqueous alkaline solution, and conducting electroless plating of the substrate.

2. The electroless plating method according to claim 1, wherein the plating catalyst metal nuclei are of a metal selected from the group consisting of metals of Groups Ib and VIII of the Periodic Law Table.

3. The elctroless plating method according to claim 1, wherein the plating catalyst metal nuclei are of a metal selected from the group consisting of cobalt, nickel, palladium, copper and platinum.

4. The eletroless plating method according to claim 1, wherein the ligand of the organic metal complex is at least one ligand selected from the group consisting of a tertiary phosphine, a tertiary phosphite, carbon monoxide, a straight chain or cyclic olefin, a conjugated olefin, an aryl compound, an organic cyano compound, an organic isonitrile compound, a carbonyl compound, an organic mercapto compound, a heterocyclic compound, a compound having an alkyl group, a vinyl group, an allyl group, an aryl group, an ethylidyne group, an acyl group, an acyloxy group or an amino group, a halogen atom, an oxygen atom and a nitrogen atom.

5. The electroless plating method according to claim 1, wherein the polymer is selected from the group consisting of polystyrene, polyvinyl chloride, polysulfone, polycarbonate, polyacrylate, polyurethane, polyamide, a saturated or unsaturated polyester, an epoxy resin, a silicon resin, a diallyl phthalate resin, a cellulosic plastic, a rosin-modified maleic acid resin, and copolymers thereof.

6. The electroless plating method according to claim 1, wherein the substrate is made of a material selected from the group consisting of plastics, glass, ceramics, wood, cellulose, paper and metal.