Imaging apparatus using a solid-state imaging element having a substrate

• US 4,831,456 A
• Filed: 10/26/1987
• Issued: 05/16/1989
• Est. Priority Date: 12/08/1986
• Status: Expired due to Term

• Current Assignee: Olympus Optical Corporation Limited (Olympus Corporation)
• Original Assignee: Olympus Optical Corporation Limited (Olympus Corporation)
• Inventors: Takamura, Koji
• Primary Examiner(s): Coles, Sr., Edward L.
• Assistant Examiner(s): Kostak, Victor R.
• Application Number:
  US07/113,824
• Time in Patent Office: 568 Days
• Field of Search: 358/98, 358/229, 358/213.11, 358/209
• US Class Current: 348/374
• CPC Class Codes: A61B 1/05 characterised by the image sensor, e.g. camera, being in the distal end portion
• CPC Class Codes: A61B 1/051 Details of CCD assembly
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/555 for picking-up images in sites, inaccessible due to their dimensions or hazardous conditions, e.g. endoscopes or borescopes
• CPC Class Codes: H04N 23/66 Remote control of cameras or camera parts, e.g. by remote control devices

Abstract

An imaging apparatus includes a camera head and a camera control unit. An objective optical system is arranged at a front end portion of the camera head. A solid-state imaging device having a first external terminal group to or from which signals subjected to signal processing inside the camera head are input or output, and a second external terminal group, which is separated from the first external terminal group, and to or from which signals that are not subjected to signal processing inside the camera head are input or output, is arranged behind the objective optical system. A circuit board has at least two connecting terminal groups. One connecting terminal group of the circuit board is connected to the first external terminal group, and the other connecting terminal group is connected to one end portion of a first conductive wire group of a power cable. One end portion of a second conductive wire group of the power cable is connected to the second external terminal group. The other end portion of each of the first and second conductive wire groups is connected to the camera control unit. Therefore, the camera head can be rendered compact.

Claims

1. An imaging apparatus comprising:

a camera head having

(a) an objective optical system arranged on a front end portion of said camera head;

(b) a solid-state imaging device arranged behind said objective optical system, said solid-state imaging device including a first external terminal group of terminals to or from which signals subjected to signal processing inside said camera head are input or output, and a second external terminal group, which is separated from said first external terminal group, and including terminals to or from which signals that are not subjected to signal processing inside said camera head are input or output, and

(c) a first circuit board having at least two connecting terminal groups, one connecting terminal group being electrically connected to said first external terminal group;

an electric cable having a first conductive wire group one end portion of which is connected to the other connecting terminal group of said circuit board, and a second conductive wire group one end portion of which is connected to said second external terminal group; and

a camera control unit connected to the other end portion of each of said first and second conductive wire groups.

2. An apparatus according to claim 1, wherein said first circuit board is arranged to be parallel to a longitudinal axis of said camera lead.

3. An apparatus according to claim 2, wherein each of said first and second external terminal groups of said solid-state imaging device is arranged at least in a line, and the lines of said external terminals are arranged parallel to each other.

4. An apparatus according to claim 3, wherein each of said first and second external terminal groups is aligned in line, and is arranged to be perpendicular to the longitudinal direction of said camera head.

5. An apparatus according to claim 3, further comprising:

a second circuit board having at least two connecting terminal groups and a wiring pattern portion, one connecting terminal group being connected to said second external terminal group, and the other connecting terminal group being connected to the one end portion of said second conductive wire group.

6. An apparatus according to claim 1, further comprising:

a second circuit board having at least two connecting terminal groups and a wiring pattern portion, one connecting terminal group being connected to said second external terminal group, and the other connecting terminal group being connected to the one end portion of said second conductive wire group.

7. An apparatus according to claim 6, wherein said first and second circuit boards are arranged to be parallel to the longitudinal axis of said camera head.

8. An apparatus according to claim 7, wherein each of said first and second external terminal groups is aligned in line, and is arranged to be perpendicular to the longitudinal axis of said camera head.

9. An apparatus according to claim 6, wherein said first and second circuit boards are arranged parallel to each other.

10. An apparatus according to claim 7, wherein each connecting terminal at the other end of said second circuit board comprises a pipe-shaped lead.

11. An apparatus according to claim 6, wherein said first and second external terminal groups of said solid-state imaging device comprise flat leads, and said connecting terminals at the one end portions of said first and second circuit boards comprise L-shaped leads.

12. An apparatus according to claim 6, wherein said first and second external terminal groups comprise pin-shaped leads standing upright on a bottom surface of said solid-state imaging device, and said connecting terminals on the one end portion of said first circuit board comprise flat leads.

13. An apparatus according to claim 4, wherein said first and second circuit boards are arranged parallel to each other, and a filler is filled therebetween to integrally assemble said circuit boards.

14. An apparatus according to claim 1, wherein said camera head comprises a metal casing, and said casing is partially formed of a conductive film.

15. An apparatus according to claim 1, wherein said electric cable is separated into said first and second conductive wire groups near the rear end portion of said camera head.

16. An apparatus according to claim 15, wherein said electric cable comprises first and second bundles of conductive wires, said first and second bundles of conductive wires being terminated near the rear end portion of said camera head to serve as said first and second conductive wire groups.

17. An apparatus according to claim 1, wherein said electric cable comprises shield wires having inner and external conductors, said external conductor being electrically connected to a shield member near the rear end portion of said camera head.

18. An apparatus according to claim 1, wherein said first and second external terminal groups comprise pin-shaped leads standing upright on bottom surfaces of said solid-state imaging device, said connecting terminals at the one end portion of said first circuit board comprise flat leads, and said second conductive wire group is directly connected to said second external terminal group.

19. An apparatus according to claim 1, wherein said first external terminal group of said solid-state imaging device comprises flat leads, said one connecting terminal group of said first circuit board comprises flat leads, and said first circuit board is in contact with said solid-state imaging device so as to be perpendicular to each other.

20. An apparatus according to claim 1, wherein said first circuit board comprises a hybrid circuit board.

21. An apparatus according to claim 1, wherein said solid-state imaging device comprises a simultaneous type solid-state imaging device.

22. An apparatus according to claim 1, wherein said solid-state imaging device comprises a frame-sequential type solid-state imaging device.

23. An apparatus according to claim 1, further comprising an endoscope having an insertion section having a distal end member incorporating said camera head.

24. An apparatus according to claim 23, wherein said first and second conductive wire groups are divided over the entire length of the insertion section of said endoscope.

25. An apparatus according to claim 1, wherein said objective optical system has an optical element for diffracting an optical axis of said objective optical system, and said solid-state imaging device is arranged to be parallel to the axis of said camera head.

26. An apparatus according to claim 25, wherein said first and second external terminal groups are arranged at a proximal end portion of said solid-state imaging device.

27. An imaging apparatus comprising:

a camera head having

(a) an objective optical system arranged on a front end portion of said camera head,

(b) a solid-state imaging device arranged behind said objective optical system, said solid-state imaging device having first and second external terminal groups,

(c) a first circuit board having at least two connecting terminal groups, one connecting terminal group being connected to said first external terminal group to perform signal processing, and

(d) a second circuit board having at least two connecting terminal groups, one connecting terminal group being connected to said second external terminal group to perform signal processing different from said first circuit board;

an electric cable having a first conductive wire group one end portion of which is connected to the other connecting terminal group of said first circuit board, and a second conductive wire group one end portion of which is connected to the other connecting terminal group of said second circuit board; and

a camera control unit connected to the other end portion of each of said first and second conductive wire groups.