×

Wiring board

  • US 4,835,598 A
  • Filed: 05/14/1987
  • Issued: 05/30/1989
  • Est. Priority Date: 06/13/1985
  • Status: Expired due to Term
First Claim
Patent Images

1. A semiconductor chip carrier comprising:

  • an insulative substrate having at least one opening extending through the thickness thereof;

    a thermo-conductive plate in contact with the circumference of the opening inserted in the opening for supporting a semiconductor chip thereon; and

    an upper insulative adhesive layer and a lower insulative adhesive layer for electrical connection with the semiconductor chip; and

    wherein said conductive layer is provided with a hole extending through the thickness of the upper insulative adhesive layer in which the thermo-conductive plate is exposed, the lower insulative layer is provided with a hole in which the thermo-conductive plate is exposed and said holes of the insulative adhesive layers are dimensioned to be smaller than the opening of the insulative substrate so as to define along the inner circumference thereof internal flanges which are placed over the marginal portions of the thermo-conductive plate in direct contact relation therewith.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×