Wiring board

• US 4,835,598 A
• Filed: 05/14/1987
• Issued: 05/30/1989
• Est. Priority Date: 06/13/1985
• Status: Expired due to Term

• Current Assignee: Matsushita Electric Works Ltd (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Works Ltd (Panasonic Holdings Corporation)
• Inventors: Higuchi, Tooru, Kanou, Takeshi, Yamaguchi, Tosiyuki
• Primary Examiner(s): James, Andrew J.
• Assistant Examiner(s): CLARK, SHEILA V
• Application Number:
  US07/052,182
• Time in Patent Office: 747 Days
• Field of Search: 357/80, 357/72, 357/81, 357/79, 174/52 FP, 174/16 HS
• US Class Current: 257/668
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/142 Metallic substrates having insulating layers
• CPC Class Codes: H01L 23/36 Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/49827 Via connections through the substrates, e.g. pins going through the substrate, coaxial cables H01L23/49822, H01L23/49833, H01L23/4985, H01L23/49861 take precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/07802 not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 1/021 Components thermally connected to metal substrates or heat-sinks by insert mounting
• CPC Class Codes: H05K 1/182 : associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 2201/0355 : Metal foils
• CPC Class Codes: H05K 2201/10287 : Metal wires as connectors or conductors
• CPC Class Codes: H05K 2201/10416 : Metallic blocks or heatsinks completely inserted in a PCB
• CPC Class Codes: H05K 2201/10477 : Inverted
• CPC Class Codes: H05K 2203/049 : Wire bonding
• CPC Class Codes: H05K 2203/063 : of preperforated insulating layer
• CPC Class Codes: H05K 3/386 : by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: H05K 3/4046 : using auxiliary conductive elements, e.g. metallic spheres, eyelets, pieces of wire
• CPC Class Codes: H05K 3/445 : having insulated holes or insulated via connections through the metal core

Abstract

A printed wiring board for carrying a semiconductor chip including a resin base substrate having at least one opening therethrough, a thermo-conductive plate for mounting the semiconductor chip thereon, the plate being inserted into the opening, an insulating adhesive layer covering at least one side of the substrate and an electric circuit formed on the layer. The wiring board of this invention eliminates those disadvantages of the existing resin substrate type and metal core type. In essence, the wiring board of this invention displays excellent heat releasing capability and magnetic shield effect as well as reliable electric insulation.

Claims

1. A semiconductor chip carrier comprising:

an insulative substrate having at least one opening extending through the thickness thereof;

a thermo-conductive plate in contact with the circumference of the opening inserted in the opening for supporting a semiconductor chip thereon; and

an upper insulative adhesive layer and a lower insulative adhesive layer for electrical connection with the semiconductor chip; and

wherein said conductive layer is provided with a hole extending through the thickness of the upper insulative adhesive layer in which the thermo-conductive plate is exposed, the lower insulative layer is provided with a hole in which the thermo-conductive plate is exposed and said holes of the insulative adhesive layers are dimensioned to be smaller than the opening of the insulative substrate so as to define along the inner circumference thereof internal flanges which are placed over the marginal portions of the thermo-conductive plate in direct contact relation therewith.

2. A semiconductor chip carrier according to claim 1, wherein said conductor layer extends to an edge of said insulative substrate.

3. A semiconductor chip carrier according to claim 1, wherein said insulative substrate is provided with at least one terminal hole.

4. A semiconductor chip carrier according to claim 2, wherein ends of said conductor layer extending to the edge of said insulative substrate is provided with terminals along said edge.

5. A semiconductor chip carrier according to claim 1, wherein said heat radiation surface is provided with an expansion metal plate thereby enlarging heat radiation capacity.

6. A semiconductor chip carrier according to claim 1, wherein said heat radiation surface is provided with a depression upon the surface thereof.

7. A semiconductor chip carrier comprising:

an insulative substrate made of a laminate prepared by prepreg which is impregnated with a thermosetting resin, said insulative substrate having at least one opening extending through the thickness thereof;

a thermo-conductive plate inserted in the opening for supporting a semiconductor chip thereon;

hardened insulative adhesive layers formed with prepregs impregnated with a thermo-setting resin, said insulative adhesive layers covering the opposite surfaces of the insulative substrate over the thermo-conductive plate;

a conductor layer formed on the outer surface of at least the insulative adhesive layer adjacent to the semiconductor chip for electrical connection with the semiconductor chip; and

each of the insulative adhesive layers being formed with a hole which is smaller than the opening of the insulative substrate so as to define along the inner circumference thereof an internal flange which is placed in direct contact relation over the marginal portion of the thermo-conductive plate, whereby the thermo-conductive plate is held between the internal flanges of the respective insulative adhesive layers while the surface of the thermo-conductive plate opposite to the semiconductor chip is exposed through the hole to define thereat a heat radiation surface.

8. A semiconductor chip carrier comprising:

an insulative substrate made of a laminate prepared by prepreg which is impregnated with a thermosetting resin, said insulative substrate having at least one opening extending through the thickness thereof;

a thermo-conductive plate inserted in the opening for supporting a semiconductor chip thereon;

hardened insulative adhesive layers formed with prepregs impregnated with a thermo-setting resin, said insulative adhesive layers covering the opposite surfaces of the insulative substrate over the thermo-conductive plate;

conductor layers formed on the outer surface of each of the insulative adhesive layers adjacent to the semiconductor chip for electrical connection with the semiconductor chip; and

each of the insulative adhesive layers being formed with a hole extending through the thickness of both the insulative adhesive layers and the conductor layers, said holes being smaller than the opening of the insulative substrate so as to define along the inner circumference thereof an internal flange which is placed in direct contact relation over the marginal portion of the thermo-conductive plate, whereby the thermo-conductive plate is held between the internal flanges of the respective insulative adhesive layers while the surface of the thermo-conductive plate opposite to the semiconductor chip is exposed through the hole to define thereat a heat radiation surface.