Photocurable laminate

• US 4,839,261 A
• Filed: 09/15/1987
• Issued: 06/13/1989
• Est. Priority Date: 09/29/1986
• Status: Expired due to Fees

• Current Assignee: Asahi Kasei Kogyo Kabushiki Kaisha (Asahi Kasei Corporation)
• Original Assignee: Asahi Kasei Kogyo Kabushiki Kaisha (Asahi Kasei Corporation)
• Inventors: Miyao, Manabu, Nakazaki, Nobuo, Ai, Hideo
• Primary Examiner(s): Michl, Paul R.
• Assistant Examiner(s): RoDee, C. D.
• Application Number:
  US07/096,479
• Time in Patent Office: 637 Days
• Field of Search: 430/280, 430/281, 430/287, 430/296, 430/313
• US Class Current: 430/313
• CPC Class Codes: G03F 7/033 the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers

Abstract

A process for forming electroless copper plating patterns comprising: (a) laminating a substrate with a photocurable laminate, (b) exposing said photocurable laminate to a high energy ray, (c) removing unexposed parts of the laminate, and (d) electrolessly plating a desired pat of the laminate with copper; wherein said photocurable layer comprises (a) 100 parts by weight of a compound having recurring units represented by the following formulae [A] and [B] ##STR1## and (b) 5 to 1,000 parts by weight of a compound, which is compatible with compound (a), having a group represented by the formula

--(R.sub.4).sub.n

wherein R₄ is a group having a double bond and n is an integer of 1 to 50 and characterized by a viscosity at 20° C. of from 0.001 to 500 poises.

Claims

1. A process for forming electroless copper plating patterns comprising:

(a) laminating a substrate with a photocurable laminate,

(b) exposing said photocurable laminate to a high energy ray,

(c) removing unexposed parts of the laminate, and

(d) electrolessly plating a desired part of the laminate with copper;

wherein said photocurable laminate comprises a photocurable layer and a film-shaped substrate capable of substantially transmitting high-energy rays, said photocurable layer comprises (a) 100 parts by weight of a compound having recurring units represented by the following formulae [A] and [B] ##STR45## wherein R₀ is a vinyl group, an epoxy group or an episulfide group;

R₁ is a hydrogen atom, an alkyl group of 1 to 6 carbon atoms or a halogen atom; and

R₁ and R₀ are attached to the position ortho, meta or para to the carbon atom of the main chain; and

wherein W, X, Y and Z are each a hydrogen atom, a halogen atom, a cyano group, an alkyl group of 1 to 6 carbon atoms, a halogenated alkyl group of 1 to 6 carbon atoms, an aryl group of 6 to 30 carbon atoms substituted with alkyl or halogenated alkyl groups of 1 to 6 carbon atoms, an aryl group of 6 to 30 carbon atoms substituted with silicon-containing groups, an aryl group of 6 to 30 carbon atoms, --COOR₂, --COR₂, --O--COR₂ (R₂ is an alkyl or halogenated alkyl group of 1 to 12 carbon atoms, an aryl group of 6 to 30 carbon atoms substituted with alkyl or halogenated alkyl groups of 1 to 6 carbon atoms, an aryl group of 6 to 30 carbon atoms substituted with silicon-containing groups, or an aryl group of 6 to 30 carbon atoms), a nitro group, a silicon-containing group, or a substituent having heterocyclic rings substituted with at least one R₃ (R₃ is a hydrogen atom, a hydroxyl group, a carboxyl group, a halogen atom, a nitro group, an amino group, a cyano group, an alkyl or halogenated alkyl group of 1 to 6 carbon atoms, an aryl group of 6 to 30 carbon atoms or a silicon-containing group) and (b) 5 to 1,000 parts by weight of a compound, which is compatible with compound (a), having a group represented by the formula

space="preserve" listing-type="equation">--(R.sub.4).sub.n

wherein R₄ is a group having a double bond and n is an integer of 1 to 50 and characterized by a viscosity at 20°

C. of from 0.001 to 500 poises.

2. The process for forming electroless copper plating patterns according to claim 1, wherein the film-shaped substrate is polyethylene terephthalate, polyvinyl alcohol, polyvinyl chloride, vinyl chloride copolymer, polymethyl methacrylate, methyl methacrylate copolymer, polystyrene, polyacrylonitrile, styrene copolymer, polyamide or a cellulose derivative.

3. The process for forming electroless copper plating patterns according to claim 1, wherein the high-energy rays are ultraviolet rays, far-ultraviolet rays, laser beams, soft X-rays or electron beams.

4. The process for forming electroless copper plating patterns according to claim 3, wherein the high-energy rays are ultraviolet rays, far-ultraviolet rays, or laser beams.

5. The process for forming electroless copper plating patterns according to claim 1, wherein compound (a) has a number-average molecular weight of 3,000 to 1,000,000.

6. The process for forming electroless copper plating patterns according to claim 5, wherein compound (a) has a number-average molecular weight of 5,000 to 500,000.

7. The process for forming electroless copper plating patterns according to claim 1, wherein R₁ is a hydrogen atom.

8. The process for forming electroless copper plating patterns according to claim 1, wherein R₀ and R₁ of formula [A] are each at a position of meta or para to the carbon atom of the main chain.

9. The process for forming electroless copper plating patterns according to claim 8, wherein R₀ of formula [A] is a vinyl group.

10. The process for forming electroless copper plating patterns according to claim 1, wherein the W of formula [B] is a hydrogen atom.

11. The process for forming electroless copper plating patterns according to claim 10, wherein the X, Y and Z of formula [B] are each a hydrogen atom, a cyano group, an alkyl group of 1 to 6 carbon atoms, a halogenated alkyl group of 1 to 6 carbon atoms, an aryl group of 6 to 30 carbon atoms substituted with alkyl or halogenated alkyl groups of 1 to 6 carbon atoms, an aryl group of 6 to 30 carbon atoms substituted with silicon-containing groups, an aryl group of 6 to 30 carbon atoms, --COOR₂, --COR₂, --O--COR₂ (R₂ is an alkyl or halogenated alkyl group of 1 to 12 carbon atoms, an aryl group of 6 to 30 carbon atoms substituted with alkyl or halogenated alkyl groups of 1 to 6 carbon atoms, an aryl group of 6 to 30 carbon atoms substituted with silicon-containing groups or an aryl group of 6 to 30 carbon atoms), a nitro group, a silicon-containing group or a substituent having heterocyclic rings substituted with at least one R₃ (R₃ is a hydrogen atom, a hydroxyl group, a carboxyl group, a halogen atom, a nitro group, an amino group, a cyano group, an alkyl or halogenated alkyl group of 1 to 6 carbon atoms, an aryl group of 6 to 30 carbon atoms or a silicon-containing group).

12. The process for forming electroless copper plating patterns according to claim 10, wherein the X, Y and Z of formula [B] are each a hydrogen atom, a halogen atom, a cyano group, an alkyl group of 1 to 6 carbon atoms, a halogenated alkyl group of 1 to 6 carbon atoms, an aryl group of 6 to 30 carbon atoms substituted with alkyl or halogenated alkyl groups of 1 to 6 carbon atoms, an aryl group of 6 to 30 carbon atoms substituted with silicon-containing groups, an aryl group of 6 to 30 carbon atoms, a nitro group, silicon-containing group, or a substituent having heterocyclic rings substituted with at least one R₃ (R₃ is a hydrogen atom, a halogen atom, a cyano group, an alkyl or halogenated alkyl group of 1 to 6 carbon atoms, an aryl group of 6 to 30 carbon atoms, or a silicon-containing group).

13. The process for forming electroless copper plating patterns according to claim 1, wherein the mol fraction of the recurring unit represented by formula [A], of compound (a) is 1 to 99%.

14. The process for forming electroless copper plating patterns according to claim 13, wherein the mol fraction of the recurring unit represented by formula [A], of compound (a) is 5 to 95%.

15. The process for forming electroless copper plating patterns according to claim 1, wherein R₄ of compound (b) is one of the groups represented by the formulae ##STR46##

16. The process for forming electroless copper plating patterns according to claim 1, wherein the amount of compound (b) is 10 to 800 parts by weight based on 100 parts by weight of compound (a).

17. The process for forming electroless copper plating patterns according to claim 1, wherein said photocurable laminate contains up to 50 parts by weight based on 100 parts by weight of compound (a) of a photopolymerization initiator or photosensitizer.

18. The process for forming electroless copper plating patterns according to claim 1, wherein said photocurable laminate contains 0.01 to 30 parts by weight based on 100 parts by weight of compound (a) of a photopolymerization initiator or photosensitizer.

19. The process for forming electroless copper plating patterns according to claim 1, wherein said photocurable layer contains up to 1,000 parts by weight based on 100 parts by weight of compound (a) of compound (c), in which compound (c) is a thermoplastic resin which is compatible with compounds (a) and (b).

20. The process for forming electroless copper plating patterns according to claim 19, wherein said thermoplastic resin is polymethyl methacrylate, methyl methacrylate copolymer, polystyrene, styrene copolymer, polyvinyl chloride, vinyl chloride copolymer, polyvinyl acetate, vinyl acetate copolymer or polyvinyl alcohol.

21. The process for forming electroless copper plating patterns according to claim 1, wherein said photocurable laminate further contains an additive, said additive comprising a dye, a stabilizer, a plasticizer or mixtures thereof.

22. The process for forming electroless copper plating patterns according to claim 1, wherein a plastic protective film is disposed on the surface of the photocurable layer.

23. The process for forming electroless copper plating patterns according to claim 22, wherein the plastic protective film is a polyethylene terephthalate film, a polypropylene film or a polyethylene film.

24. The process for forming electroless copper plating patterns according to claim 1, wherein the substrate is a copper-clad, glass-epoxy laminated sheet.