IC card

• US 4,841,134 A
• Filed: 07/25/1986
• Issued: 06/20/1989
• Est. Priority Date: 07/27/1985
• Status: Expired due to Term

• Current Assignee: Dai Nippon Printing Company Limited
• Original Assignee: DAI Nippon Insatsu Kabushiki Kaisha (Dai Nippon Printing Company Limited)
• Inventors: Gogami, Masao, Suzuki, Toshiyuki, Take, Seiji, Ishihara, Satoshi, Hida, Yoshiaki
• Primary Examiner(s): Trafton, David L.
• Application Number:
  US06/889,277
• Time in Patent Office: 1,061 Days
• Field of Search: 235/488, 235/492
• US Class Current: 235/488
• CPC Class Codes: G06K 19/07728 the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48464 the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

The IC card of the present invention comprises an IC card comprising an IC module embedded in a card substrate, said IC card having a reinforcing sheet layer laid in the planar direction of the card so as to cover at least the peripheral portion of the boundary between the card substrate and the IC module, and/or has a reinforcing member comprising at least a part of the side portion of said IC module extended in the outer circumferential direction, and it is excellent in mechanical strength and flexibility against bending of card.

Claims

1. An IC card comprising an IC module embedded in an IC module substrate built in a card substrate, said IC module comprising an IC chip, a circuit substrate and a reinforcing member, said reinforcing member comprising at least a part of the side portion of said IC module substrate extended in the outer circumferential direction, wherein said reinforcing member is formed in a shape so that it has a greater area toward the portion of the IC card with a greater flex coefficient.

2. An IC card according to claim 1, wherein a reinforcing sheet layer is laid in the planar direction of the card so as to cover at least the peripheral portion of the boundary between the card substrate and the IC module.

3. An IC card according to claim 1, wherein the sealing frame layer and/or the resin for mold constituting the IC module have/has a color identical or similar to that of a card substrate.

4. An IC card according to claim 1, wherein the IC module is applied with smoothening working on the backside thereof.

5. An IC card according to claim 1, wherein said IC module is an IC module having an IC chip mounted in a laminate of a plurality of substrates for formation of the IC module, at least one layer of said substrates for formation of the IC module has a reinforcing member extended in the outer circumferential direction of the IC module, and said reinforcing member is provided as extended so as to form a difference in level from the intermediate portion of said substrate for formation of the I module.

6. An IC card according to claim 1, wherein said IC module comprises two or more IC chips mounted thereon, and the sealing frame layer forming the IC module has windows with shapes for permitting said respective IC chips to extend therethrough independently of each other.

7. An IC card according to claim 1, wherein an external terminal of the IC module is formed on the same plane as the surface of the card substrate.

8. An IC card according to claim 2, wherein the reinforcing sheet layer is formed of at least one material selected from the group consisting of mesh-like sheet, unwoven fabric, continuous body sheet, rubber sheet, thermoplastice elastomer sheet, rubbery adhesive layer and tacky sheet.

9. An IC card according to claim 2, wherein the reinforcing sheet layer comprises an adhesive sheet having a polyolefinic adhesive layer formed on both surfaces of a plastic film.

10. An IC card according to claim 2, wherein the reinforcing sheet layer has a color identical or similar to that of the card substrate.

11. An IC card according to claim 2, wherein the reinforcing sheet layer comprises an opaque white material.

12. An IC card according to claim 1, wherein the oversheet constituting the IC card is opaque white.

13. An IC card according to claim 1, wherein the card substrate is constituted with the oversheet having microindentations formed on one surface or both surfaces thereof.

14. An IC card according to claim 1, wherein the card substrate is constituted with the oversheet in which a mesh sheet is laid therein.

15. An IC card comprising an IC module embedded in a card substrate,

said IC card having a mesh sheet as a reinforcing sheet layer laid in the planar direction of the card so as to cover at least the peripheral portion of the boundary between the card substrate and the IC module;

said IC module having an IC chip mounted in a laminate of a plurality of substrates for formation of the IC module, at least one layer of said substrates for formation of the IC module having a reinforcing member extended in the outer circumferential direction of the IC module; and

said reinforcing member being formed in a shape so that it has a greater area toward the portion of the IC card with greater flex coefficient.

21. An IC card according to claim 15, wherein said reinforcing member is provided as extended so as to form a difference in level from the intermediate portion of said substrate for formation of the IC module.

22. An IC card according to claim 21, wherein said IC module is applied with smoothening working on the backside thereof.

16. An IC module to be mounted in an IC card and embedded in an IC module substrate, said IC module comprising an IC chip, a circuit substrate and a reinforcing member, said reinforcing member comprising at least a art of the side portion of said IC module substrate extended in the outer circumferential direction, wherein said reinforcing member is formed in a shape so that it has a greater area toward the portion of the IC card with greater flex coefficient.

17. An IC module according to claim 16, wherein the IC module is applied with smoothening working on the backside thereof.

18. An IC module according to claim 16, wherein said IC module is an IC module having an IC chip mounted in a laminate of a plurality of substrates for formation of the IC module, at least one layer of said substrates for formation of the IC module has a reinforcing member extended in the outer circumferential direction of the IC module, and said reinforcing member is provided as extended so as to form a difference in level from the intermediate portion of said substrate for formation of the IC module.

19. An IC module according to claim 16 wherein said IC module comprises two or more IC chips mounted thereon, and the sealing frame layer forming the IC module has windows with shapes for permitting said respective IC chips to extend therethrough independently of each other.

20. An IC module according to claim 16, wherein said IC module has a color identical or similar to that of a card substrate in which said IC module is built.