Solid state image pickup device
First Claim
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1. A solid state pickup device, comprising:
- a semiconductor substrate of a first conductivity type;
a photosensitive section comprising;
a region of a second conductivity type formed in said semiconductor substrate, said region having semiconductive channels of the first conductivity type located at a surface of said region, and having a plurality of charge accumulation means corresponding to respective picture elements;
means for transferring signals accumulated in said charge accumulation means;
a logic circuit integrally formed with said region in said substrate and at a periphery of said region; and
a photoconductive film formed on, and contiguous with, said substrate including said region and said logic circuit, and means for electrically coupling said photoconductive film to each of said plurality of charge accumulation means, and for supplying thereto an electric signal produced in response to light incident on said photoconductive film.
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Abstract
An solid state optical pickup device having integrally formed therein both a photosensitive matrix and peripheral circuits thereto. Both the photosensitive matrix and the peripheral circuit are built according to CMOS IC technology. A photoconductive film overlies the entire photosensitive matrix and is electrically connected to each of the charge accumulating regions in the matrix.
65 Citations
11 Claims
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1. A solid state pickup device, comprising:
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a semiconductor substrate of a first conductivity type; a photosensitive section comprising; a region of a second conductivity type formed in said semiconductor substrate, said region having semiconductive channels of the first conductivity type located at a surface of said region, and having a plurality of charge accumulation means corresponding to respective picture elements; means for transferring signals accumulated in said charge accumulation means; a logic circuit integrally formed with said region in said substrate and at a periphery of said region; and a photoconductive film formed on, and contiguous with, said substrate including said region and said logic circuit, and means for electrically coupling said photoconductive film to each of said plurality of charge accumulation means, and for supplying thereto an electric signal produced in response to light incident on said photoconductive film. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification