Method and apparatus for applying solder preforms

• US 4,842,184 A
• Filed: 06/23/1988
• Issued: 06/27/1989
• Est. Priority Date: 06/23/1988
• Status: Expired due to Term

• Current Assignee: Lockheed Martin Corporation (Martin Marietta Corporation)
• Original Assignee: LTV Aerospace & Defense Co. (LTV Corp.)
• Inventors: Miller, Grady A. Jr.
• Primary Examiner(s): Godici, Nicholas P.
• Assistant Examiner(s): Heinrich, Samuel M.
• Application Number:
  US07/210,736
• Time in Patent Office: 369 Days
• Field of Search: 228/180.1, 228/253, 228/255, 228/41, 228/56.3, 269/903
• US Class Current: 228/180.1
• CPC Class Codes: B23K 3/06 Solder feeding devices; Solder melting pans
• CPC Class Codes: B23K 35/0222 for use in soldering, brazing B23K35/0205 takes precedence
• CPC Class Codes: H05K 2201/10189 Non-printed connector
• CPC Class Codes: H05K 2201/10424 Frame holders
• CPC Class Codes: H05K 2203/0415 Small preforms other than balls, e.g. discs, cylinders or pillars
• CPC Class Codes: H05K 2203/0769 Dissolving insulating materials, e.g. coatings, not used for developing resist after exposure
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence
• CPC Class Codes: H05K 3/3478 Applying solder preforms; Transferring prefabricated solder patterns

Abstract

A method of applying solder to contacts of a connector, when the contacts are spaced apart according to a given arrangement. The method includes the steps of perforating a water-soluble adhesive material to form perforations in a pattern according to the given arrangement, applying solder preforms around the perforations, positioning the adhesive material to center the solder preforms around the contacts, washing off the adhesive material with water, and heating the contacts to the flow-point temperature of the solder.

Claims

1. A method of applying solder to multiple contacts of a device, the contacts spaced apart according to a given arrangement, comprising the steps of:

a. perforating a material having first and second outer surfaces to form perforations in a pattern according to the given arrangement;

b. applying solder preforms upon the first surface of said material adjacent the perforations;

c. adherently contacting the preforms and the material; and

d. relatively positioning the material and the contacts so that the contacts extend through the perforations adjacent the solder preforms and through respective solder preforms mounted upon the first surface of said material.

2. The method of claim 1 wherein the material is water soluble.

3. The method of claim 1 further comprising the step of heating the solder preforms to flow them around the contacts.

4. The method according to claim 1 wherein the material is adhesive, and the step of applying and the step of adherently contacting comprises the step of engaging the preform and the adhesive material.

5. The method according to claim 1 further including the step of removing the material after said step of

relatively positioning the material and the contacts and thereafter heating the solder preforms to flow them around the contacts.

6. A method of soldering contacts to holes of a circuit board, the contacts spaced apart according to a given arrangement, comprising the steps of:

a. perforating a soluble adhesive material to form perforations in a pattern according to the given arrangement;

b. affixing solder preforms to the adhesive material so that each respective preform is in substantial alignment with each perforation ;

c. positioning the adhesive material to center the solder preforms around the contacts so that the contacts pass through the preforms;

d. dissolving the soluble adhesive material leaving the solder preforms encompassing the contacts; and

e. heating the contacts to the flow-point temperature of the solder.

7. The method of claim 6 wherein the adhesive material is water soluble.

8. A solder contact strip for soldering contacts to holes of a circuit board comprising:

a. a fluid-soluble strip perforated with a pattern of perforations;

b. adhesive on one side of the strip; and

c. a solder preform surrounding each perforation and held in position on the strip by the adhesive.

9. The solder contact strip of claim 8 wherein the pattern matches a pattern of pins on a pin device.

10. The solder contact strip of claim 8 wherein the strip is water-soluble.

11. The solder contact strip of claim 8 wherein the adhesive is a coating on the one side.

12. A solder contact strip for soldering contacts to holes of a circuit board comprising:

a. a fluid-soluble strip perforated with a pattern of perforations;

b. a solder preform adjacent each perforation; and

c. adhesive holding said preform in substantial engagement with said strip.