Method for manufacturing transparent conductive indium-tin oxide layers

• US 4,842,705 A
• Filed: 03/28/1988
• Issued: 06/27/1989
• Est. Priority Date: 06/04/1987
• Status: Expired due to Fees

• Current Assignee: Siemens AG
• Original Assignee: Siemens AG
• Inventors: Mueller, Werner
• Primary Examiner(s): Nguyen, Nam X.
• Application Number:
  US07/174,183
• Time in Patent Office: 456 Days
• Field of Search: 204/192.15, 204/192.26, 204/192.27, 204/192.28, 204/192.29, 204/192.30, 427/255.1, 427/372.2, 427/38, 427/39, 427/40, 156/653
• US Class Current: 204/192.29
• CPC Class Codes: C23C 14/0021 Reactive sputtering or evaporation
• CPC Class Codes: C23C 14/086 of zinc, germanium, cadmium, indium, tin, thallium or bismuth
• CPC Class Codes: C23C 14/58 After-treatment
• CPC Class Codes: C23C 14/5806 Thermal treatment
• CPC Class Codes: C23C 14/5853 Oxidation
• CPC Class Codes: G03G 5/104 comprising inorganic material other than metals, e.g. salts, oxides, carbon
• CPC Class Codes: H01L 31/1884 Manufacture of transparent electrodes, e.g. TCO, ITO
• CPC Class Codes: Y02E 10/50 Photovoltaic [PV] energy

Abstract

A method for applying a transparent, conductive indium-tin oxide coating on a substrate of amorphous, hydrogen-containing silicon wherein an unheated substrate of amorphous hydrogen-containing silicon is treated with sources of indium and tin in a first stage while maintaining a low partial pressure of oxygen until a partial coating is built-up, then reducing the oxygen partial pressure in the coating zone in a second stage and continuing the coating until an additional coating thickness is built-up, followed by heating the coated substrate in an oxygen-containing atmosphere at a temperature less than 250° C.

Claims

1. A method for applying a transparent, conductive indium-tin oxide coating on a substate of amorphous, hydrogen-containing silicon which method comprises the steps of:

providing an unheated substrate of amorphous, hydrogen-containing silicon in an enclosed coating zone;

applying sources of both indium and tin in a first stage onto said substrate while maintaining the substrate unheated and maintaining an oxygen partial pressure at a low level in said zone until a partial coating is built-up on said substrate;

temporarily reducing the oxygen partial pressure in said coating zone in a second stage and maintaining the substrate unheated and continuing the coating until an additinal coating thickness is built-up on said substrate;

continuing coating in a third stage with the oxygen partial pressure the same as during the first stage to complete the coating to a final thickness; and

thereafter heating the coated substrate in an oxygen containing atmosphere at a temperature less than 250°

C.

2. A method according to claim 1 which includes the step of etching said substrate after coating and before said heating.

3. A method according to claim 1 wherein said coating is applied by cathode sputtering.

4. A method according to claim 1 wherein said coating is applied by vapor deposition.

5. A method according to claim 1 in which the oxygen partial pressure in said first stage is in the range of from 10^-4 to 10^-2 mbar.

6. A method according to claim 1 wherein the heating takes place for about one hour at about 200°

C.

7. A method for applying a transparent, conductive indium-tin oxide coating of a desired thickness on a substrate of amorphous, hydrogen-containing silicon, said method comprising the steps of:

providing an unheated substrate of amorphous, hydrogen-containing silicon in an enclosed coating zone;

applying sources of both indium and tin in a first stage onto said substrate while introducing and maintaining an oxygen partial pressure at a low level of about 8×

10^-4 mbar in said zone until a partial coating is built-up on said substrate;

terminating the introduction of oxygen when the coating thickness is about one-third of the desired thickness to reduce the oxygen partial pressure below 1×

10^-5 mbar in said coating zone in a second stage and continuing the coating until an additional coating thickness of about one-third of the desired coating is built-up on said substrate;

introducing additional oxygen until the partial oxygen pressure is approximately that used in said first stage and continuing the coating until the desired coating thickness is achieved; and

thereafter heating the coated substrate in an oxygen containing atmosphere at a temperature less than 250°

C.

8. A method according to claim 7 wherein said oxygen partial pressure in said second stage is maintained for a period of from 75 to 450 seconds.

9. A method according to claim 7 wherein said desired coating thickness is about 100 nm, an indium-tin oxide layer is applied by electron beam evaporation at a rate of about 0.1 nm/sec in said first stage, and said second stage is commenced after the coating thickness reaches about 30 nm, and said oxygen partial pressure in said second stage is maintained for a period of about 300 seconds.