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High speed process for coating substrates

  • US 4,842,893 A
  • Filed: 04/29/1988
  • Issued: 06/27/1989
  • Est. Priority Date: 12/19/1983
  • Status: Expired due to Term
First Claim
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1. A high-speed process for coating the surface of a substrate with an adherent film comprising the following steps:

  • (a) providing a vacuum chamber containing;

    (i) a movable support, (ii) a vapor outlet of a vaporizer mounted adjacent to an upstream portion of said support, (iii) curing means mounted adjacent to a downstream portion of said support, and (iv) means for maintaining said support at a temperature below that of said vaporizer;

    (b) placing said substrate in thermal contact with said movable support in a manner permitting the surface of said substrate to move sequentially past said vapor outlet and said curing means;

    (c) evacuating gas from said chamber until the pressure within said chamber is less than about 1×

    10-2 Torr;

    (d) selecting a curable component having an average of about two or more olefinic groups per molecule, an average molecular weight between 150 and 1000, and a vapor pressure in the range of 1×

    10-6 to 1×

    10-1 Torr at standard temperature and pressure;

    (e) metering a quantity of said curable component into an inlet portion of said vaporizer;

    (f) vaporizing said component within said vaporizer;

    (g) moving said support at a speed sufficient to pass said substrate relative to said vapor outlet and said curing means at a rate between about 1 cm/sec and 1000 cm/sec;

    (h) condensing a film of said component on the surface of said substrate, said film having a thickness of less than 4 microns; and

    (i) activating said curing means whereby a adherent film is formed on said substrate surface.

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