Identification card with an integrated circuit

• US 4,843,225 A
• Filed: 05/22/1987
• Issued: 06/27/1989
• Est. Priority Date: 12/28/1982
• Status: Expired due to Term

• Current Assignee: GAO Gesellschaft Fur Automation und Organisation mbH
• Original Assignee: GAO Gesellschaft Fur Automation und Organisation mbH
• Inventors: Hoppe, Joachim
• Primary Examiner(s): Pellinen, A. D.
• Assistant Examiner(s): Gaffin, Jeffrey A.
• Application Number:
  US07/053,040
• Time in Patent Office: 767 Days
• Field of Search: 235/487, 235/488, 235/492, 283/83, 357/72, 357/79, 357/84
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07728 the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/50 Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto thin flexible metallic tape with or without a film carrier H01L23/49572, flexible insulating substrates H01L23/4985, H01L23/5387
• CPC Class Codes: H01L 24/86 using tape automated bonding [TAB]
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device
• CPC Class Codes: Y10T 29/49146 with encapsulating, e.g., potting, etc.

Abstract

A multilayer identification card containing an IC module in a cavity. The cavity is filled with a polymer with a consistency ranging form liquid to pasty before the card compound is laminated using pressure and heat. During lamination, the polymer completely fills in the cavity around the IC module, supported by the applied pressure. In the finished card, the polymer is cross-linked to form a solid, rubber-like mass, which protects the IC module in the cavity of the card.

Claims

1. A multi-layer identification card comprising:

(a) at least one layer having a cavity;

(b) an IC module mounted on a carrier disposed in said cavity so that space exists in said cavity between said IC module and said at least one card layer;

(c) a hollow area in a layer of said card in communication with said cavity;

(d) a channel in a layer of said card having one end opening into said cavity and another end opening into said hollow area to allow for said communication;

(e) elastic material filling said space, wherein said channel and said hollow area are adapted to be at least partially filled with elastic material in excess of an amount of elastic material required to fill said space.

2. The multi-layer identifiation card in accordance with claim 1, wherein said elastic material is a silicon rubber material capable of being cast and cross-linked at room temperature.

3. The multi-layer identification card in accordance with claim 2, wherein said layer is a film punched out to form said hollow area and said channel.

4. A multi-layer identification card comprising:

(a) at least one card layer having a cavity;

(b) an IC module having a top surface and a bottom surface mounted on a carrier disposed in said cavity so that space exists in said cavity between said IC module and said at least one card layer;

(c) a film layer covering said top surface of said IC module and laminated over at least one card layer so as to divide said cavity into an upper portion and a lower portion; and

(d) elastic material filling said upper portion of said cavity above said film layer.

5. The multi-layer identification card in accordance with claim 4, wherein said film layer is perforated and said elastic material fills said lower portion of said cavity to completely fill said space in said cavity.

6. The multi-layer identification card in accordance with claim 5, wherein said elastic material is a cross-linked polymer material capable of being cast and cross-linked at room temperature.

7. A multi-layer identification card comprising:

(a) at least one layer having a cavity;

(b) an IC module mounted on a carrier disposed in said cavity so that space exits in said cavity between said IC module and said at least one card layer;

(c) a hollow area in a layer of said card in communication with said cavity;

(d) a channel in a layer of said card having one end opening into said cavity and another end opening into said hollow area to allow for said communication;

(e) a first amount of elastic material filling said space, so that said IC module is at least partially embedded and protected by said elastic material; and

(f) a second amount of said elastic material at least partially filling said channel and said hollow area, said second amount being in excess of said first amount of elastic material filling said space.

8. The multi-layer identification card in accordance with claim 7, wherein said elastic material is a silicon rubber material capable of being cast and cross-linked at room temperature.