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Electronic circuit module

  • US 4,843,520 A
  • Filed: 02/03/1988
  • Issued: 06/27/1989
  • Est. Priority Date: 02/03/1987
  • Status: Expired due to Fees
First Claim
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1. An electronic circuit module comprising:

  • a case;

    first and second substrates respectively disposed on opposite inner walls of said case with a predetermined gap therebetween;

    a flexible film having thereon a circuit pattern, wherein said flexible film has a part affixed to said first substrate and has another part affixed to said second substrate;

    a first group of electronic components mounted on said flexible film at said part affixed to said first substrate, wherein said first group of electronic components includes a heat generating component;

    a second group of electronic components mounted on said flexible film at said another part affixed to said second substrate, wherein said second group of electronic components includes a low-heat-resistive component; and

    a resin layer having a low heat conductivity, said resin layer filling a gap betweensaid first group of electronic components and said second group of electronic components so that heat generated by said heat-generating component is not transferred to said low-heat-resistive component.

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