Electronic circuit module
First Claim
1. An electronic circuit module comprising:
- a case;
first and second substrates respectively disposed on opposite inner walls of said case with a predetermined gap therebetween;
a flexible film having thereon a circuit pattern, wherein said flexible film has a part affixed to said first substrate and has another part affixed to said second substrate;
a first group of electronic components mounted on said flexible film at said part affixed to said first substrate, wherein said first group of electronic components includes a heat generating component;
a second group of electronic components mounted on said flexible film at said another part affixed to said second substrate, wherein said second group of electronic components includes a low-heat-resistive component; and
a resin layer having a low heat conductivity, said resin layer filling a gap betweensaid first group of electronic components and said second group of electronic components so that heat generated by said heat-generating component is not transferred to said low-heat-resistive component.
1 Assignment
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Accused Products
Abstract
An electronic circuit module comprises a case, first and second substrates disposed in the case on opposite inner walls with a gap therebetween and, a flexible film having a circuit pattern thereon and attached at a part to the first substrate and attached at another part to the second substrate. A first group of electronic components including a heat-generating component are mounted on the film part attached to the first substrate. A second group of electronic components including a low-heat-resistive component are mounted on the film part attached to the second substrate. The gap between the first and second substrates is filled with a resin layer, preferably a foam resin layer, having a low heat conductivity so as to prevent a heat transfer from the heat-generating part to the low-heat-resistive part.
30 Citations
14 Claims
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1. An electronic circuit module comprising:
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a case; first and second substrates respectively disposed on opposite inner walls of said case with a predetermined gap therebetween; a flexible film having thereon a circuit pattern, wherein said flexible film has a part affixed to said first substrate and has another part affixed to said second substrate; a first group of electronic components mounted on said flexible film at said part affixed to said first substrate, wherein said first group of electronic components includes a heat generating component; a second group of electronic components mounted on said flexible film at said another part affixed to said second substrate, wherein said second group of electronic components includes a low-heat-resistive component; and a resin layer having a low heat conductivity, said resin layer filling a gap betweensaid first group of electronic components and said second group of electronic components so that heat generated by said heat-generating component is not transferred to said low-heat-resistive component. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification