Flexible cicuit substrate with electroconductive adhesive layer and its production

• US 4,844,784 A
• Filed: 12/12/1985
• Issued: 07/04/1989
• Est. Priority Date: 12/20/1984
• Status: Expired due to Fees

• Current Assignee: Shinto Paint Co. Ltd.
• Original Assignee: Shinto Paint Co. Ltd.
• Inventors: Suzuki, Tameyuki, Kamakura, Takuro
• Primary Examiner(s): NOT, DEFINED
• Assistant Examiner(s): Hsing, Ben C.
• Application Number:
  US06/808,140
• Time in Patent Office: 1,300 Days
• Field of Search: 204/181.7, 204/181.6, 204/181.4, 204/180.2, 204/180.9, 156/150, 156/151, 156/901, 156/902, 428/901
• US Class Current: 156/151
• CPC Class Codes: H01B 1/20 Conductive material dispersed in non-conductive organic material organic macromolecular compounds or compositions C08
• CPC Class Codes: H01R 4/04 using electrically conductive adhesives
• CPC Class Codes: H05K 1/095 for polymer thick films, i.e. having a permanent organic polymeric binder
• CPC Class Codes: H05K 2201/023 Hard particles, i.e. particles in conductive adhesive at least partly penetrating an electrode
• CPC Class Codes: H05K 2203/066 Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern transferring an insulating pattern H05K2203/0537
• CPC Class Codes: H05K 2203/135 Electrophoretic deposition of insulating material
• CPC Class Codes: H05K 3/247 Finish coating of conductors by using conductive pastes, inks or powders
• CPC Class Codes: H05K 3/321 by conductive adhesives
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits
• CPC Class Codes: Y10S 428/901 Printed circuit

Abstract

An electroconductive adhesive layer of high molecular weight resin having electroconductive particles disposed therein is electrodeposited selectively on only the electroconductive circuit povided on a flexible circuit substrate. The adhesive layer permits precise bonding of the coated circuit with an identical circuit provided on a second flexible circuit substrate.

Claims

1. A method of providing electroconductive bonding between a first flexible circuit substrate provided with at least one electroconductive circuit which has a width of 0.1 mm or less and a second flexible circuit substrate provided with at least one electroconductive circuit which has a width of 0.1 mm or less and which is identical to the electroconductive circuit on the first flexible circuit substrate and is provided on the surface of the second flexible circuit substrate which faces the first flexible circuit substrate, said method comprising the steps of forming by electrodeposition on the electroconductive circuit on the first flexible circuit substrate electroconductive adhesive layer consisting essentially of a high molecular resin and electroconductive particles of titanium carbide or titanium nitride dispersed therein, whereby said electroconductive layer is formed selectively on said electroconductive circuit on the first flexible circuit substrate, then bringing said electroconductive adhesive layer on the first flexible circuit substrate into contact with the electroconductive circuit on the second flexible circuit substrate so that the electroconductive circuits on the respective flexible circuit substrates are aligned with each other and bonded through the electroconductive adhesive layer.

2. A method as described in claim 1, wherein there is a plurality of electroconductive circuits on at least two of the flexible circuit substrates and the interval between adjacent electroconductive circuits on a flexible circuit substrate is 0.2 mm or less.