Method of packaging a non-contact I/O signal transmission integrated circuit

• US 4,845,052 A
• Filed: 01/13/1988
• Issued: 07/04/1989
• Est. Priority Date: 02/07/1986
• Status: Expired due to Term

• Current Assignee: Intersil Corporation (Renesas Electronics Corporation)
• Original Assignee: Harris Corporation (L3Harris Technologies, Inc.)
• Inventors: Abend, Robert J.
• Primary Examiner(s): NOT, DEFINED
• Assistant Examiner(s): NOT, DEFINED
• Application Number:
  US07/143,328
• Time in Patent Office: 538 Days
• Field of Search: 350/96.2, 350/96.15, 350/96.24, 358/901, 437/209, 437/2, 437/5, 437/23, 437/127, 437/984
• US Class Current: 438/27
• CPC Class Codes: G02B 6/4234 Passive alignment along the optical axis and active alignment perpendicular to the optical axis
• CPC Class Codes: G02B 6/4249 comprising arrays of active devices and fibres
• CPC Class Codes: H01L 27/156 two-dimensional arrays
• CPC Class Codes: Y10S 148/099 LED, multicolor

Abstract

The I/O ports of a packaged IC includes a plurality of optical conduits in the package adjacent electro-optical transmitters and receivers throughout the die spaced from the periphery of the die. The method of assembling the die in the package includes using optical transmitters on the die to align the top of the package and the optical conduits to the die which was previously mounted in the base of the package.

Claims

1. A method of packaging an integrated circuit comprising:

providing a plurality of alignment optical signal emitting means on a die;

mounting said die in a base of a housing;

providing a corresponding plurality of alignment optical signal conduits in a lid of said housing;

activating said plurality of alignment optical signal emitting means;

positioning said lid to align said corresponding alignment optical signal conduits with a respective alignment optical signal emitter means; and

securing said aligned lid with said base of said housing.

2. A method according to claim 1, including providing an additional plurality of optical signal emitting means on said die and a corresponding additional plurality of optical signal conduits in said lid which are not activated during said aligning step.

3. A method of packaging an integrated circuit according to claim 1 wherein, at least three of said plurality of alignment optical signal emitting means are activated during the aligning step.