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Method of packaging a non-contact I/O signal transmission integrated circuit

  • US 4,845,052 A
  • Filed: 01/13/1988
  • Issued: 07/04/1989
  • Est. Priority Date: 02/07/1986
  • Status: Expired due to Term
First Claim
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1. A method of packaging an integrated circuit comprising:

  • providing a plurality of alignment optical signal emitting means on a die;

    mounting said die in a base of a housing;

    providing a corresponding plurality of alignment optical signal conduits in a lid of said housing;

    activating said plurality of alignment optical signal emitting means;

    positioning said lid to align said corresponding alignment optical signal conduits with a respective alignment optical signal emitter means; and

    securing said aligned lid with said base of said housing.

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