Process control for laser wire bonding

• US 4,845,354 A
• Filed: 03/08/1988
• Issued: 07/04/1989
• Est. Priority Date: 03/08/1988
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Gupta, Arunava, Hussey, Brian W.
• Primary Examiner(s): Westin, Edward P.
• Application Number:
  US07/165,319
• Time in Patent Office: 483 Days
• Field of Search: 250/201, 250/205, 219/121.60, 219/121.61, 219/121.62, 219/121.63
• US Class Current: 250/205
• CPC Class Codes: B23K 26/032 using optical means
• CPC Class Codes: H01L 2224/05155 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/45014 Ribbon connectors, e.g. rectangular cross-section
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/45565 Single coating layer
• CPC Class Codes: H01L 2224/45644 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48463 the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
• CPC Class Codes: H01L 2224/48844 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/78261 Laser
• CPC Class Codes: H01L 2224/78301 Capillary
• CPC Class Codes: H01L 2224/78901 using a computer, e.g. fully- or semi-automatic bonding
• CPC Class Codes: H01L 2224/85214 using a laser
• CPC Class Codes: H01L 2224/859 involving monitoring, e.g. feedback loop
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/0101 : Neon [Ne]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01018 : Argon [Ar]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/0106 : Neodymium [Nd]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/2075 : larger or equal to 1 micron less than 10 microns
• CPC Class Codes: H01L 2924/20751 : larger or equal to 10 microns less than 20 microns
• CPC Class Codes: H01L 2924/20752 : larger or equal to 20 microns less than 30 microns
• CPC Class Codes: H01L 2924/20753 : larger or equal to 30 microns less than 40 microns
• CPC Class Codes: H01L 2924/20754 : larger or equal to 40 microns less than 50 microns
• CPC Class Codes: H01L 2924/20755 : larger or equal to 50 microns less than 60 microns
• CPC Class Codes: H01L 2924/351 : Thermal stress

Abstract

An optical process monitor primarily for use in laser wire bonding detects the reflectivity change of the wire being bonded in order to provide feedback control of the high power laser used for bonding the wire to a pad. A low power laser beam which is co-linear or combined with the high power laser beam is conducted to the bond site and reflected from the wire during the bonding cycle. The change in reflectivity of the wire during the bonding cycle is detected from the reflected low power laser beam. A signal commensurate with the detected change of reflectivity is used to control the power or duration of the high power laser during bonding.

Claims

1. A device for monitoring the energy dissipated during laser bonding of a metal workpiece to another workpiece comprising:

first means for propagating a first beam of energy to the metal workpiece sufficient to bond the metal workpiece to the another workpiece;

second means for propagating a second beam of energy co-linearly with said first beam, said second beam being reflected from the metal workpiece in the bond region;

detection means disposed for detecting the reflected second beam and providing a reflectance signal commensurate with the reflected second beam, and

control means coupled to said detection means for receiving said reflectance signal and controlling said first means responsive to said reflectance signal.

2. A device as set forth in claim 1, wherein said first means is a first laser means for bonding the workpieces and said second means is a second laser means operating at a lower power level than said first laser means and at a wavelength different from that of said first laser means.

3. A device as set forth in claim 2, wherein said detection means includes means for spatially separating said reflected second beam.

4. A device as set forth in claim 3, where said means for spatially separating is optical means.

5. A device as set forth in claim 3, wherein said detection means further includes conversion means for converting said spatially separated reflected second beam into an reflectance signal.

6. A device as set forth in claim 1, wherein said first means includes a shutter and said control means controls the time duration of said first beam by controlling said shutter.

7. A device as set forth in claim 1, wherein said first means includes an acousto-optic modulator means and said control means controls the power of said first beam by controlling said acousto-optic modulator means.

8. A device as set forth in claim 1, wherein said first beam and said second beam pass through a cold mirror for being propagated co-linearly.

9. A device as set forth in claim 2, wherein said second laser means is a visible light laser.

10. A device as set forth in claim 2, wherein said second laser means is an infrared laser.

11. A device as set forth in claim 1, wherein said control means controls a process parameter of said first means.

12. A device as set forth in claim 1, wherein the metal workpiece is a wire and the another workpiece is a pad.

13. A method of monitoring the energy dissipated during bonding of a metal workpiece to another workpiece by propagation of a first energy beam sufficient to bond the workpieces comprising the steps of:

propagating a second energy beam, co-linear with said first energy beam, for being reflected from the metal workpiece in the bond region during bonding;

detecting the reflected second energy beam; and

controlling the first energy beam responsive to said reflected second energy beam.

14. A method as set forth in claim 13, wherein said first energy beam is a first laser beam and said second energy beam is a second laser beam operating at a lower power level than said first laser beam and at a wavelength different from that of said first laser beam.

15. A method as set forth in claim 13, wherein said second energy beam is a visible laser beam.

16. A method as set forth in claim 13, wherein said second energy beam is an infrared laser beam.

17. A method as set forth in claim 13, wherein said controlling of the first energy beam comprises controlling the time duration of said first energy beam.

18. A method as set forth in claim 17, wherein controlling the time duration of said first energy beam includes controlling shutter means disposed in the path of the first energy beam.

19. A method as set forth in claim 13, wherein said controlling the first energy beam comprises controlling the power of said first energy beam.

20. A method as set forth in claim 19, wherein controlling the power of said first energy beam includes controlling acousto-optic modulation means disposed in the path of the first energy beam.

21. A method as set forth in claim 13, wherein said detecting the reflected second beam includes spatially separating said reflected second beam.

22. A device for controlling the process parameters of a laser wire bonder while bonding a first metal workpiece to a second metal workpiece comprising:

first laser means for propagating a first laser beam for bonding a first workpiece to a second workpiece;

second laser means for propagating a second laser beam, co-linearly with said first laser beam, said second laser beam being reflected from the first workpiece in the bond region;

detection means for detecting the reflected second laser beam and providing a reflectance signal commensurate with the reflected second laser beam, and

control means coupled to said detection means for receiving said reflectance signal and controlling said first laser beam responsive to said reflectance signal.

23. A device as set forth in claim 22, wherein said control means includes means for impeding said first laser beam responsive to said reflectance signal.

24. A device as set forth in claim 23, wherein said means for impeding includes shutter means.

25. A device as set forth in claim 23, wherein said means for impeding includes acousto-optic modulation means.

26. A device as set forth in claim 22, wherein said first laser beam operates at a higher power and different wavelength than said second laser beam.

27. A device as set forth in claim 22, wherein said detection means includes means for optically spatially separating said reflected second beam.

28. In a laser wire bonding apparatus for bonding a wire to a pad by use of a beam of high power laser energy at a first wavelength, a monitoring device for controlling the high power laser energy comprising:

laser means for propagating a beam of low power laser energy at a second wavelength, co-linearly with the beam of high power laser energy, for being reflected by the wire in the bond region during bonding;

detection means for detecting the reflected low power laser energy and providing a reflectance signal commensurate with the reflected low power laser energy; and

control means for receiving said reflectance signal and controlling the beam of high power laser energy responsive to said reflectance signal.

29. An apparatus as set forth in claim 28, wherein said detection means includes means for optically spatially separating said reflected low power laser energy beam and electrical signal conversion means for converting said spatially separated reflected low power laser energy beam into a signal commensurate with the reflectivity of the wire.

30. An apparatus as set forth in claim 28, wherein said control means controls process parameters of the beam of high power laser energy.

31. An apparatus as set forth in claim 28, wherein said control means controls the duration of the beam of high power laser energy.

32. An apparatus as set forth in claim 28, wherein said control means controls the power of the beam of high power laser energy.