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Process control for laser wire bonding

  • US 4,845,354 A
  • Filed: 03/08/1988
  • Issued: 07/04/1989
  • Est. Priority Date: 03/08/1988
  • Status: Expired due to Fees
First Claim
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1. A device for monitoring the energy dissipated during laser bonding of a metal workpiece to another workpiece comprising:

  • first means for propagating a first beam of energy to the metal workpiece sufficient to bond the metal workpiece to the another workpiece;

    second means for propagating a second beam of energy co-linearly with said first beam, said second beam being reflected from the metal workpiece in the bond region;

    detection means disposed for detecting the reflected second beam and providing a reflectance signal commensurate with the reflected second beam, andcontrol means coupled to said detection means for receiving said reflectance signal and controlling said first means responsive to said reflectance signal.

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