Composite bead element

• US 4,845,452 A
• Filed: 10/05/1988
• Issued: 07/04/1989
• Est. Priority Date: 10/08/1987
• Status: Expired due to Term

• Current Assignee: TDK Corporation
• Original Assignee: TDK Corporation
• Inventors: Kuroshima, Toshihiro, Takahashi, Sumio, Sasaki, Yoshinori
• Primary Examiner(s): GRIFFIN, DONALD
• Application Number:
  US07/254,324
• Time in Patent Office: 272 Days
• Field of Search: 361/302, 361/306 DC, 361/321 R, 361/400, 361/401, 336/200
• US Class Current: 336/200
• CPC Class Codes: H03H 1/00 Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network constructional details of electromechanical transducers H03H9/00
• CPC Class Codes: H05K 1/0233 Filters, inductors or a magnetic substance
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 1/183 Components mounted in and supported by recessed areas of the printed circuit board
• CPC Class Codes: H05K 2201/086 for inductive purposes, e.g. printed inductor with ferrite core
• CPC Class Codes: H05K 2201/09036 Recesses or grooves in insulating substrate recess in metallic substrate H05K2201/09745
• CPC Class Codes: H05K 2201/10015 Non-printed capacitor
• CPC Class Codes: H05K 2201/1028 Thin metal strips as connectors or conductors
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 2201/10916 Terminals having auxiliary metallic piece, e.g. for soldering
• CPC Class Codes: H05K 3/3442 having edge contacts, e.g. leadless chip capacitors, chip carriers
• CPC Class Codes: H05K 3/4015 using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product

Abstract

A composite bead element comprises a chip-like magnetic body in a shape of a nearly rectangular parellelepiped in which a recess is provided, at least one feed-through holes formed in said body and an electronic component inserted in said recess. Bead inductors are formed by conductors provided in said feed-through holes, and said electronic component and said conductors are connected by predetermined conductors on a surface of said body.

Claims

1. A composite bead element comprising:

a chip-like magnetic body which has a shape of a nearly rectangular parallelepiped and has at least one recess on one surface;

an electronic component mounted in each said recess;

at least one feed-through hole formed in said body;

conductors provided in said feed-through holes for forming bead inductors by said conductors and the magnetic body therearound; and

said electronic component and said conductors are connected by predetermined conductors on a surface of said body.

2. A composite bead element comprising:

a chip-like magnetic body which has a shape of a nearly rectangular parallelepiped, and which comprises at least one recess provided on one surface thereof and at least one feed-through hole extending from said one surface to the opposite surface;

an electronic component which comprises a planar upper surface and film-like external terminals on both end portions of said upper surface, and which is inserted in each said recess so that said upper surface coincides with said one surface;

conductors for forming bead inductors which are provided in said feed-through holes;

an interconnection network which includes extension conductors of the conductors for forming bead inductors and film-like connection conductors provided on edge portions of said recess such that they align with said external terminals in said recess;

conductive pieces for bridging across said external terminals of said electronic component and said connection conductors; and

solders for connecting said conductive pieces to said external terminals and said connection conductors.