Process of bonding plates

• US 4,848,643 A
• Filed: 09/19/1988
• Issued: 07/18/1989
• Est. Priority Date: 09/19/1988
• Status: Expired due to Term

• Current Assignee: Honeywell Incorporated (Honeywell International Inc.)
• Original Assignee: Honeywell Incorporated (Honeywell International Inc.)
• Inventors: Sherrer, Tony L., Frische, Richard H.
• Primary Examiner(s): Seidel, Richard K.
• Assistant Examiner(s): Heinrich, Samuel M.
• Application Number:
  US07/246,051
• Time in Patent Office: 302 Days
• Field of Search: 228/239, 228/121, 228/122, 228/124, 228/195, 228/263.12, 310/338, 310/346
• US Class Current: 228/121
• CPC Class Codes: B23K 35/001 Interlayers, transition pieces for metallurgical bonding of workpieces
• CPC Class Codes: C04B 2237/064 based on alumina or aluminates
• CPC Class Codes: C04B 2237/12 Metallic interlayers
• CPC Class Codes: C04B 2237/122 based on refractory metals
• CPC Class Codes: C04B 2237/125 based on noble metals, e.g. silver
• CPC Class Codes: C04B 2237/32 Ceramic
• CPC Class Codes: C04B 2237/592 whereby the interlayer is not continuous, e.g. not the whole surface of the smallest substrate is covered by the interlayer
• CPC Class Codes: C04B 2237/708 of one or more of the interlayers
• CPC Class Codes: C04B 2237/72 Forming laminates or joined articles comprising at least two interlayers directly next to each other
• CPC Class Codes: C04B 2237/76 Forming laminates or joined articles comprising at least one member in the form other than a sheet or disc, e.g. two tubes or a tube and a sheet or disc
• CPC Class Codes: C04B 37/006 consisting of metals or metal salts
• CPC Class Codes: C04B 37/04 with articles made from glass
• CPC Class Codes: G01L 9/0016 of a diaphragm
• CPC Class Codes: G01L 9/0022 of a piezoelectric element
• CPC Class Codes: H10N 30/073 by fusion of metals or by adhesives

Abstract

A process of bonding crystalline quartz plates in a plate assembly of a quartz crystal resonator is provided. The plate assembly includes a base plate, a resonator plate, a cover plate, a first silver and indium alloy layer between the base plate and the resonator plate, and a second silver and indium alloy layer between the resonator plate and the cover plate. The process of bonding the plates in the plate assembly includes the steps of depositing in sequence on base plate face and on the cover plate face, a layer of chromium, a layer of silver, and a layer if indium, and also includes the steps of depositing in sequence on two opposite faces of the resonator plate, a layer of chromium, and a layer of silver, and also includes the steps in sequence of sandwiching the resonator plate between the base plate and the cover plate to form a plate assembly, then evacuating the plate assembly, compressing the plate assembly, and heating the plate assembly to about 310 degrees centigrade for several hours.

Claims

1. The process of bonding plates in a plate assembly of a quartz crystal resonator including a base plate with a first face with a contact surface;

a resonator plate with first and second faces with respective first and second contact surfaces, a cover plate with a first face with a contact surface, a first bonding layer disposed between the contact surfaces of the base plate and the resonator plate, and a second bonding layer disposed between the contact surfaces of the resonator plate and the cover plate, comprising;

depositing a layer of chromium on the contact surface of the first face of the base plate;

depositing a layer of silver on the layer of chromium on the contact surface of the first face of the base plate;

depositing a layer of indium on the layer of silver on the layer of chromium on the contact surface of the first face of the base plate;

depositing a layer of chromium on the contact surface of the first face of the resonator plate;

depositing a layer of silver on the layer of chromium on the contact surface of the first face of the resonator plate;

positioning the first face of the base plate towards the first face of the resonator plate so that the indium layer on the base plate is separated by a gap from the silver layer on the resonator plate;

depositing a layer of chromium on the contact surface of the first face of the cover plate;

depositing a layer of silver on the layer of chromium on the contact surface of the first face of the cover plate;

depositing a layer of indium on the layer of silver on the layer of chromium on the contact surface of the first face of the cover plate;

depositing a layer of chromium on the contact surface of the second face of the resonator plate;

depositing a layer of silver on the layer of chromium on the contact surface of the second face of the resonator plate;

positioning the first face of the cover plate towards the second face of the resonator plate so that the indium layer on the cover plate is separated by a gap from the silver layer on the resonator plate to form a plate assembly;

evacuating the plate assembly;

compressing the plate assembly; and

heating the plate assembly to about 310 degrees centigrade for a selective time interval.

2. The process of claim 1, wherein the resonator plate and the cover plate have an upper chamber and the second face of the resonator plate has an upper chamber surface and the resonator plate and base plate have a lower chamber and the resonator plate has a lower chamber surface and the resonator plate has a resonator portion disposed between the lower chamber and the upper chamber, said process including:

while depositing the layer of chromium on the contact surface of the first face of the resonator plate, simultaneously depositing a layer of chromium on the lower chamber surface of the resonator plate, and then depositing a layer of gold film on the layer of chromium on the lower chamber surface; and

while depositing a layer of chromium on the contact surface of the second face of the resonator plate, simultaneously depositing a strip of chromium on the upper chamber surface, and then depositing a strip of gold film of defined width and length over the chromium layer and strip.

3. The process of claim 2, including:

while depositing the layer of gold film on the layer of chromium on the lower chamber surface, simultaneously depositing a strip of gold film of defined width and length over a portion of the chromium layer on the contact surface adjacent to the lower chamber.

4. The process of claim 3, including:

depositing a barrier layer over each layer of gold film.

5. The process of claim 1, including:

before depositing the layer of chromium on the respective contact surface of the base plate and resonator plate and cover plate, polishing the contact surfaces of the base plate and resonator plate and cover plate.

6. The process of claim 2, including:

providing a fluid pressure opening in the upper chamber, for use of the plate assembly in a quartz crystal resonator of a pressure sensor and for applying a fluid pressure on the resonator plate thereby altering the frequency of the quartz crystal resonator as a measure of pressure magnitude.

7. The process of bonding plates in a plate assembly of a quartz crystal resonator having a first plate with a face and a second plate with a face and having a chamber therebetween with a chamber surface comprising:

depositing a layer of chromium on the face of the first plate;

depositing a layer of silver on the layer of chromium on the face of the first plate;

depositing a layer of indium on the layer of silver on the layer of chromium on the face of the first plate;

depositing a layer of chromium on the face of the second plate and simultaneously depositing a layer of chromium of defined length and width on the chamber surface;

depositing a layer of silver on the layer of chromium on the face of the second plate and then depositing a layer of gold film on the layer of chromium on the chamber surface;

positioning the face of the first plate towards the face of the second plate so that the indium layer on the first plate is separated by a gap from the silver layer on the second plate to form a plate assembly;

compressing the plate assembly; and

heating the plate assembly to about 310 degrees centigrade for a selective time interval.