Epoxy resin composition

• US 4,851,481 A
• Filed: 12/06/1988
• Issued: 07/25/1989
• Est. Priority Date: 11/13/1986
• Status: Expired due to Term

• Current Assignee: Sunstar Giken Kabushiki Kaisha (Hosei Gijuku Luxembourg SA)
• Original Assignee: Sunstar Giken Kabushiki Kaisha (Hosei Gijuku Luxembourg SA)
• Inventors: Kuriyama, Akira, Okuno, Tatsuya
• Primary Examiner(s): Marquis, Melvyn I.
• Application Number:
  US07/281,935
• Time in Patent Office: 231 Days
• Field of Search: 525/476, 525/454
• US Class Current: 525/454
• CPC Class Codes: C08G 77/045 containing less than 25 silicon atoms
• CPC Class Codes: C08G 77/16 to hydroxyl groups
• CPC Class Codes: C08G 77/50 by carbon linkages C08G77/485 takes precedence
• CPC Class Codes: C08G 77/70 Siloxanes defined by use of the MDTQ nomenclature
• CPC Class Codes: C08L 2666/14 Macromolecular compounds according to C08L59/00 - C08L87/00; Derivatives thereof
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: C08L 83/00 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
• CPC Class Codes: C08L 83/04 Polysiloxanes
• CPC Class Codes: C08L 83/14 in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms C08L83/10 takes precedence
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence

Abstract

An improved epoxy resin composition having improved crack resistance and toughness with maintaining the excellent mechanical and electrical properties, which comprises an epoxy resin dispersed with silicone resin particles which are a crosslinking reaction product of one or more organopolysiloxanes having silanol groups at both ends and one or more organosilane compounds having at least two alkoxysilyl groups within one molecule thereof. The epoxy resin compositions of this invention are useful as sealing materials for IC, and also as coating materials, paints, adhesives, and prepregs.

Claims

1. An epoxy resin composition which comprises 100 parts by weight of an epoxy resin which is dispersed with silicone resin particles comprising a cross-linking reaction product of

(a) 5 to 200 parts by weight of at least one of an organopolysiloxane having silanol groups at both ends of the following formula:

##STR28## wherein R₁ is methyl or phenyl, R₂ is phenyl, p is an integer of 9 to 500, and q is 0 or less than 6% of p, with one or more organosilane compounds having at least two alkoxysilyl groups in one molecule which are selected from the group consisting of

(b) an aminosilane compound of the formula;

##STR29## wherein R₃ is hydrogen, phenyl, benzyl, cyclohexyl, vinylbenzyl, or allyl, R₄ is --C₂ H₄ --, --C₃ H₆ -- or --C₂ H₄ SC₂ H₄ --, R₅ and R₆ are the same or different and are each methyl or ethyl, R₇ is --C₂ H₄ --, --C₂ H₄ SC₂ H₄ --, --C₂ H₄ NHC₂ H₄ --, or --CO--, R₈ is --C₂ H₄ -- or --C₃ H₆ --, and m is 0 or 1,

(c) a mercapto compound of the formula;

##STR30## wherein R₅, R₆ and m are as defined above, and R₉ is --C₃ H₆ -- or --CH₂ --,

(d) an epoxy silane compound of the formula;

##STR31## wherein R₅, R₆ and m are as defined above, and R₁₀ is ##STR32## and (e) an isocyanatosilane compound of the formula;

##STR33## wherein R₅, R₆ and m are as defined above, and R₁₁ is --A-- or --Q--NHCOX--A-- wherein A is an alkylene having one to 3 carbon atoms, Q is a diisocyanate residue, and X is --NH--, --O-- or --S--,

said organopolysiloxane and said organosilane compound being used in a molar ration of the alkoxy groups in the organosilane compound and the hydroxy groups in the organopolysiloxane [OR₆ ]/[OH] of 0.1 to 15.

2. The composition according to claim 1, wherein the reaction product further comprises one or more of additional organosilane compounds selected from

(f) organosilane compounds of the formula:

##STR34## wherein R₅ is as defined above, R₁₂ is methyl or ethyl, R₁₃ is --CH₂ --, --C₂ H₄ -- or --C₃ H₆ --, Y is CH₂ ═

CH--, C₆ H₅ --, C_n F_2n+1 wherein n=1-10, CF₃ COO--, NC--, or NC(CH₂)₃ S--, r is 0, 1 or 2, m is 0 when r is 0 or 1, and m is 0 or 1 when r is 2, or

(g) organosilane compounds of the formula;

##STR35## wherein R₅ and R₁₂ are as defined above, R₁₄ is C_n'"'"' H_2n'"'"'+1 wherein n'"'"'=1-20, CH₂ ═

CH--, or C₆ H₅ --, r is 0, 1 or 2, m is 0 when r is 0 or 1, and m is 0 or 1 when r is 2.

3. The composition according to claim 1, which comprises a dispersion of 100 parts by weight of the epoxy resin of the formula [I] with the crosslinking reaction product of 5 to 200 parts by weight of the organopolysiloxane having silanol groups at both ends (a) and 0.5 to 10 parts by weight of the organosilane compound (b) selected from the compounds of the formulae [b-1] or [b-2].

4. The composition according to claim 2, wherein the organosilane compounds (b) of the formulae [b-1] and [b-2] wherein m is 1 are used and the organosilane compound (f) wherein m is 0 is used in an amount of 0.5 to 10 parts by weight.

5. The composition according to claim 4, wherein the organosilane compound (b) of the formula [b-1] or [b-2] wherein m is 1 is used together the organosilane compound (b) of the formula [b-1] or [b-2] wherein m is 0 in the ratio of the compound m=0 to the compound m=1 being in the range of 1 :

4 or more by weight, and the organosilane compound (f) is used in an amount of 0.5 to 5 parts by weight.