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Apparatus for measuring circuit parameters of a packaged semiconductor device

  • US 4,853,628 A
  • Filed: 09/10/1987
  • Issued: 08/01/1989
  • Est. Priority Date: 09/10/1987
  • Status: Expired due to Fees
First Claim
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1. In a semiconductor device having a circuited portion and a plurality of pins, a test structure as part of said device and connected to a part of pins of the device, the test structure in use providing electrical information concerning the circuit portion, and further comprising means comprising a disconnectable link as part of said test structure for providing that the circuit portion operates without degradation in operation of the device, as compared to a device not including said test structure, wherein the test structure in use thereof is connected to the circuit portion, wherein the test structure further comprises a diode forward biased in the direction from the pin at higher potential during testing toward the pin at lower potential during testing, wherein the disconnectable link comprises a laser programmable fuse connected between the pair of pins.

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