Micromachined cold cathode vacuum tube device and method of making

• US 4,855,636 A
• Filed: 10/08/1987
• Issued: 08/08/1989
• Est. Priority Date: 10/08/1987
• Status: Expired due to Fees

• Current Assignee: Busta, Heinz H., Raul D. Cuellar
• Original Assignee: Busta, Heinz H., Raul D. Cuellar
• Inventors: Cuellar, Raul D., Busta, Heinz H.
• Primary Examiner(s): WIEDER, KENNETH A
• Application Number:
  US07/105,895
• Time in Patent Office: 670 Days
• Field of Search: 313/291, 313/306, 313/355, 313/309, 313/336, 313/250
• US Class Current: 313/306
• CPC Class Codes: H01J 21/105 with microengineered cathode and control electrodes, e.g. Spindt-type
• CPC Class Codes: H01J 9/00 Apparatus or processes specially adapted for the manufacture , installation, removal, maintenance of electric discharge tubes, discharge lamps, or parts thereof; Recovery of material from discharge tubes or lamps

Abstract

A miniaturized field emitter vacuum tube device and method of making are described. The device includes a needle-shaped field emitter cathode, metal gate and electron collecting anode, which are enclosed by an insulating chamber which is evacuated. The gate electrode may be used to form the insulator-to-metal vacuum seal. Device isolation is achieved by using a highly resistive polycrystalline silicon film. A method of making a field emitter cathode tip is described in which two masking and etching steps form a pair of intersecting lines, the intersection point forming the cathode tip.

Claims

1. A device comprising:

a vacuum chamber, wherein said vacuum chamber comprises a first insulating layer, a second insulating layer spaced apart from said first layer, and a side insulating layer positioned between and sealed to said first layer and said second layer such that a vacuum space is formed within said first, second and side layers;

a cathode disposed within said vacuum chamber and on said first layer, wherein said cathode comprises a planar field emitter having a small radius of curvature tip; and

an anode disposed within said vacuum chamber and on said first layer, spaced apart from said cathode; and

a gate positioned between and spaced apart from said cathode and said anode.

2. The device of claim 1 wherein said field emitter is formed by the process of depositing a metal layer on said first insulating layer and etching said metal layer such that the boundary of said field emitter is formed by two intersecting etch lines.

3. The device of claim 1 wherein said first layer, said second layer and said side layer are formed of silicon dioxide.

4. The device of claim 1 wherein said first layer and said second layer are formed of silicon dioxide and said side layer is formed of highly resistive polycrystalline silicon.

5. The device of claim 1 wherein said cathode and said anode are formed of a material selected from the group consisting of refractory metals, platinum and refractory metal silicides.

6. The device of claim 1 wherein said gate is formed of a material selected from the group consisting of aluminum, refractory metals, doped polycrystalline silicon and refractory metal silicides.

7. The device of claim 1 wherein said cathode is formed of an electron emitting semi conductor.

8. The device of claim 1 wherein said second layer and said side layer are formed of a single layer of polyimide.

16. The device of claim 1 wherein said gate comprises one or more metal posts within said vacuum chamber and a metal strip, connected to said posts, substantially outside said vacuum chamber.

17. The device of claim 16 wherein said gate is formed by the process of etching one or more openings in said second insulating layer and depositing a metal on said second layer such that metal fills said openings in said second layer forming said metal posts and etching said metal on said second layer to form said metal strip.

9. A method of making a device comprising the steps of:

providing a first insulating layer;

forming a cathode on said first layer, wherein said cathode comprises a planar field emitter having a small radius of curvature tip;

forming an anode on said first layer, said anode being spaced apart from said cathode;

forming a side insulating layer on said first layer such that portions of said cathode and said anode are contained within said side layer;

forming a second insulating layer on said side layer such that said second layer, said side layer and a portion of said first layer form a vacuum chamber having portions of said cathode and said anode contained therein; and

forming a gate such that said gate is positioned between and apart from said cathode and said anode.

10. The method of claim 9 wherein said gate is formed by forming an opening in said second insulating layer and depositing a metal on said second layer such that metal fills the opening in the second layer sealing said chamber.

11. The method of claim 9 wherein said second layer and said side layer are formed according to the step.:

depositing a layer of polycrystalline silicon on said first layer such that said polycrystalline silicon covers portions of said anode and said cathode;

forming a layer of silicon dioxide on said polycrystalline silicon layer;

forming an opening in said silicon dioxide layer;

etching said polycrystalline silicon layer through said opening such that a chamber is formed having said first layer as a bottom layer, said polycrystalline silicon layer as a side layer, and said silicon dioxide layer as said second layer.

12. The method of claim 10 further comprising the step of prior to said gate formation, etching said first layer such that a portion of said first layer is removed from under a portion of said cathode and said anode.

13. The method of claim 9 wherein said side layer is formed according to the steps:

depositing a layer of polycrystalline silicon on said first layer covering portions of said cathode and said anode;

depositing an oxidation barrier on said polycrystalline silicon layer;

forming a ring-shaped opening in said oxidation barrier, such that portions of said cathode and said anode are contained within said ring-shaped opening;

oxidizing said polycrystalline silicon layer through said ring-shaped opening such that a portion of said polycrystalline silicon layer is oxidized to form a ring-shaped side layer of silicon dioxide; and

removing said oxidizing barrier.

14. The method of claim 9 wherein said cathode is formed according to the steps:

depositing a layer of metal on said first layer;

etching said metal layer such that one boundary of said etched metal layer forms a first line segment;

covering said etched metal layer with a layer of photoresist;

removing a portion of said photoresist to expose a portion of said etched metal layer, one boundary of said removed photoresist forming a second line segment which intersects said first line segment; and

etching said exposed portion of said etched metal layer.

15. The method of claim 9 wherein said second layer and said side layer are formed according to the steps:

depositing a layer of aluminum on said first layer, said aluminum layer being positioned apart from said cathode and said anode;

depositing a layer of amorphous silicon on said first layer such that said aluminum layer and portions of said cathode and said anode are covered;

depositing a layer of polyimide on said amorphous silicon layer;

forming an opening in said polyimide layer, said opening being positioned substantially over said aluminum layer;

removing aluminum from said aluminum layer by etching through said opening;

etching said amorphous silicon layer through said opening such that a chamber is formed having said first layer as a bottom layer and said polyimide layer as said second and said side layer.

18. A method of making a planar field emitter, having a small radius of curvature tip, for use in a vacuum device comprising the steps of:

depositing a layer of metal on an insulating layer;

etching said metal layer such that one boundary of said etched metal layer forms a first line segment;

covering said etched metal layer with a layer of photoresist;

removing a portion of said photoresist to expose a portion of said etched metal layer such that one boundary of said removed photoresist forms a second line segment which intersects said first line segment; and

etching said exposed portion of said etched metal layer.