Wire bonding device

• US 4,855,928 A
• Filed: 09/02/1987
• Issued: 08/08/1989
• Est. Priority Date: 09/02/1986
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Yamanaka, Kazuyuki
• Primary Examiner(s): Lall, Parshotam S.
• Assistant Examiner(s): Trans, V. N.
• Application Number:
  US07/092,369
• Time in Patent Office: 706 Days
• Field of Search: 364/488-491, 382/8, 382/34, 228/4.5, 228/179, 356/375, 356/392, 356/393, 356/394, 356/397, 356/399
• US Class Current: 228/4.5
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/451 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48245 the item being metallic
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 2224/859 involving monitoring, e.g. feedback loop
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/78 Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]

Abstract

A wire bonding device including a camera for producing image signals corresponding to a field of view including an object having plural target patterns on which wire bonding is to be performed, a displacement device for altering the field view of the camera by varying the relative positioning between the camera and the object, a monitor for displaying an image of the object to be wire bonded, a reference mark display generation circuit coupled to the camera and the monitor for combining reference mark signals with the image signals so that an image of a reference mark is superimposed on the image of each target displayed by said monitor, a reference mark generation circuit for storing data corresponding to plural reference marks and for producing reference mark signals defining a selected reference mark and applying the reference mark signals to the reference mark display generation circuit, and an input selection and control device coupled to the reference mark generation circuit for selecting a reference mark shape and size tailored to each target pattern and for producing corresponding selection signals applied to the reference mark generation circuit, which then produces the reference mark signals in correspondance with the selection signals.

Claims

1. A wire bonding device comprising:

camera means for producing image signals corresponding to a field of view including an object having plural target patterns on which wire bonding is to be performed;

displacement means coupled to said camera means for altering the field of view by varying the relative positioning between the camera means and the object;

monitor means for displaying an image of the object to be wire bonded based on the image signals produced by said camera means;

reference mark display generation means coupled to said monitor means for combining reference mark signals with said image signals so that an image of a reference mark is superimposed on the image of each target pattern displayed by said monitor means;

reference mark generation means for storing data corresponding to a plurality of reference marks and for producing reference mark signals defining a selected reference mark and applying said reference mark signals to said reference mark display generation means; and

input selection and control means coupled to said reference mark generation means for selecting a respective reference mark shape and size tailored to each target pattern and for producing corresponding selection signals applied to said reference mark generation means, said reference mark generation means producing said reference mark signals in correspondence with said selection signals

2. The wire bonding device according to claim 1, wherein said input selection and control means includes means for selecting a rectangular reference mark and the length and width of the rectangular reference mark, and wherein said reference mark generation means produces and applies to said reference mark display generation means reference signals which are displayed by said monitor means as a rectangle having the selected length and width.

3. The wire bonding device according to claim 1, wherein said input selection and control means includes means for selecting a circular reference mark and the diameter of the circular reference mark, and wherein said reference mark generation means produces and applies to said reference mark display generation means reference mark signals which are displayed by said monitor means as a circle having the selected diameter.

4. The wire bonding device according to claim 1, wherein the target patterns include a first pattern on a semiconductor pellet and a second pattern on a lead frame, and the reference mark generation means stores first reference mark data adapted for position location of the first pattern and second reference mark data adapted for position location of the second pattern.

5. The wire bonding device according to claim 4, wherein the first pattern is that of a bonding pad and the second pattern is that of an inner lead.