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Method of fabricating airbridge metal interconnects

  • US 4,857,481 A
  • Filed: 03/14/1989
  • Issued: 08/15/1989
  • Est. Priority Date: 03/14/1989
  • Status: Expired due to Term
First Claim
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1. A method of fabricating an airbridge metal interconnect, comprising the steps of:

  • providing a semiconductor substrate;

    applying a first polymer to the substrate;

    patterning the first polymer to provide openings therein;

    forming a first metal layer on the first polymer and on the substrate through the openings in the first polymer;

    applying a second polymer on the first metal layer, the second polymer having different solubility characteristics than the first polymer;

    patterning the second polymer to provide openings therein;

    forming a second layer of metal onto a portion of the first metal layer through the openings of the second polymer;

    removing the second polymer with a solution which does not dissolve the first polymer;

    removing the first metal layer not underneath the second metal layer; and

    removing the first polymer, thereby forming the airbridge metal interconnect.

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