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Encapsulant compositions for use in signal transmission devices

  • US 4,857,563 A
  • Filed: 03/09/1987
  • Issued: 08/15/1989
  • Est. Priority Date: 03/09/1987
  • Status: Expired due to Term
First Claim
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1. A grease compatible dielectric encapsulant capable of being used to encapsulate a splice of a signal transmission conducting device comprising:

  • the extended reaction product of an admixture of(a) an effective amount of an anhydride functionalized compound having reactive anhydride sites; and

    (b) an effective amount of a crosslinking agent which reacts with the anhydride sites of said compound to form a cured cross-linked material; and

    wherein said reaction product is extended with at least one plasticizer present in the range of between 5 and 95 percent by weight of the encapsulant, forming a plasticized system which is essentially inert to the reaction product and substantially non-exuding therefrom; and

    wherein said encapsulant has a C-H adhesion value of at least 4.

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