Encapsulant compositions for use in signal transmission devices
First Claim
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1. A grease compatible dielectric encapsulant capable of being used to encapsulate a splice of a signal transmission conducting device comprising:
- the extended reaction product of an admixture of(a) an effective amount of an anhydride functionalized compound having reactive anhydride sites; and
(b) an effective amount of a crosslinking agent which reacts with the anhydride sites of said compound to form a cured cross-linked material; and
wherein said reaction product is extended with at least one plasticizer present in the range of between 5 and 95 percent by weight of the encapsulant, forming a plasticized system which is essentially inert to the reaction product and substantially non-exuding therefrom; and
wherein said encapsulant has a C-H adhesion value of at least 4.
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Abstract
The invention provides an encapsulant composition capable of use with signal transmission devices, such as electrical or optical cable. The composition is the extended reaction product of an admixture of an anhydride functionalized composition and a crosslinking agent.
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Citations
12 Claims
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1. A grease compatible dielectric encapsulant capable of being used to encapsulate a splice of a signal transmission conducting device comprising:
- the extended reaction product of an admixture of
(a) an effective amount of an anhydride functionalized compound having reactive anhydride sites; and (b) an effective amount of a crosslinking agent which reacts with the anhydride sites of said compound to form a cured cross-linked material; and wherein said reaction product is extended with at least one plasticizer present in the range of between 5 and 95 percent by weight of the encapsulant, forming a plasticized system which is essentially inert to the reaction product and substantially non-exuding therefrom; and wherein said encapsulant has a C-H adhesion value of at least 4. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
- the extended reaction product of an admixture of
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12. A dielectric encapsulant capable of being used to encapsulate a signal transmission device comprising:
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(1) the reaction product of an admixture of (a) an effective amount of an anhydride functionized compound having reactive anhydride sites, (b) an effective amount of a polyol crosslinking agent which reacts with the anhydride sites of said compound to form a cured crosslinked material; and (c) an effective amount of a catalyst for the reaction between said anhydride functionalized compound and said polyol crosslinking agent capable of catalyzing the crosslinking thereof in less than about 24 hours at 25°
C.; and(2) at least one plasticizer present in the range of between 5 and 95 percent by weight of said encapsulant and being essentially inert with said reaction product and substantially non-exuding therefrom, wherein said encapsulant has a C-H adhesion value of at least 4.
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Specification
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Current AssigneeMinnesota Mining and Manufacturing Co (3M Company)
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Original AssigneeMinnesota Mining and Manufacturing Co (3M Company)
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InventorsCroft, Thomas S., Haugen, Hartwick A.
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Primary Examiner(s)Schofer, Joseph L.
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Assistant Examiner(s)Mulcahy, Peter D.
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Application NumberUS07/019,295Time in Patent Office890 DaysField of Search524/77, 524/322, 525/64, 525/74, 525/285, 523/173US Class Current523/173CPC Class CodesH01B 3/44 vinyl resins; acrylic resin...
