Dynamic thermal display simulator

• US 4,859,080 A
• Filed: 07/22/1988
• Issued: 08/22/1989
• Est. Priority Date: 07/22/1988
• Status: Expired due to Fees

• Current Assignee: SSG Incorporated
• Original Assignee: SSG Incorporated
• Inventors: Graham, Harold A., Titus, Joseph S., Wang, Dexter
• Primary Examiner(s): Cuchlinski, Jr., William A.
• Assistant Examiner(s): GUTIERREZ, DIEGO F
• Application Number:
  US07/223,448
• Time in Patent Office: 396 Days
• Field of Search: 374/134, 340/752, 340/755, 340/766, 340/783, 340/786, 219/216 PH, 219/543, 430/944, 250/495.1, 250/494.1
• US Class Current: 374/134
• CPC Class Codes: G01J 5/53 Reference sources, e.g. standard lamps; Black bodies
• CPC Class Codes: Y10S 430/145 Infrared

Abstract

A dynamic thermal display simulator for testing thermal sensors having a matrix of individually programmable heater elements which are arranged in a linear array on the edge of a board comprising a low, thermal-conductive, electrically insulating substrate. A plurality of boards are arranged in rows to create the matrix.

Claims

1. A dynamic thermal display simulator for testing thermal sensors comprising:

a matrix of individually programmable resistive elements,

a plurality of elements being arranged in a linear array on one exposed edge of a narrow board comprising a low thermal conductive, electrically insulating substrate,

a plurality of narrow boards being arranged side-by-side in rows to create the matrix, and a plurality of integrated circuit chips secured to each narrow board.

2. A display simulator according to claim 1 wherein each resistive element in the linear array is separated from the adjacent element.

3. A display simulator according to claim 1 wherein each board in the matrix is separated from the adjacent board by an insulating film.

4. A display simulator according to claim 1 wherein each resistive element is connected to a heat sink.

5. A display simulator according to claim 1 wherein each resistive element is connected to at least one conductor lead.

6. A display simulator according to claim 1 wherein there are a plurality of integrated circuit chips secured to each board and each board includes an aperture for accommodating the chips on an adjacent board thereby to permit the boards to be assembled in close proximity.

7. A display simulator according to claim 1 wherein there are a plurality of integrated circuit chips secured to each board, each chip being in communication with a plurality of leads, each lead being dedicated to one resistive element.

8. A heater element for a thermal display simulator comprising one of a plurality of pixels which are arranged in a predetermined matrix,

each pixel comprising one of a plurality of members projecting from a common substrate of insulating material in the form of a narrow board,

a plurality of integrated circuit chips secured to each narrow board,

resistive material deposited on one exposed end surface of the substrate material forming the pixel,

a common lead on the substrate material connected to one portion of the resistive material, as well as, to the resistive material of other pixels,

a dedicated lead on the substrate material connected to a different portion of the resistive material,

an insulating material deposited on one of said leads on the substrate,

and a heat sink connected to the other of said leads on the substrate.

9. A heater element according to claim 8 wherein the substrate portion of the pixel is a substantially rectangular solid projecting from the narrow board of insulating material which substrate material forms a plurality of other projecting pixels.

10. A heater element according to claim 8 wherein the resistive material is deposited as a film on the one exposed end surface of the substrate.

11. A heater element according to claim 8 wherein the leads are deposited as films on substantially parallel surfaces of the substrate which are substantially normal to the exposed end surface.

12. A heater element according to claim 8 wherein the leads are in contact with the resistive material along chamfered edges of the substrate contiguous with the exposed end surface.

13. A heater element according to claim 8 wherein the insulating material which is superposed on the lead terminates at a point spaced from the resistive material.

14. A heater element according to claim 8 wherein the heat sink of one pixel is in engagement with the insulating material of an adjacent pixel.

15. A heater element according to claim 8 wherein each pixel is separated from the adjacent pixel.

16. A dynamic thermal display simulator for testing thermal sensors comprising:

a matrix of individually programmable resistive elements electrically insulated from each other and arranged on a plurality of narrow boards and lying substantially in a plane,

means for conducting energy to each resistive element including a plurality of integrated circuit chips secure to each narrow board to heat said resistive element and produce infrared radiation,

means to conduct heat away from each element to reduce the infrared radiation, and

control means responsive to predetermined programming to control the conduction of energy to and from the resistive elements to produce a discernible pattern on the plane.

17. A display simulator according to claim 16 wherein each resistive element is separated from the adjacent resistive element by an air space.

18. A display simulator according to claim 16 wherein each resistive element is connected to a heat sink.

19. A display simulator according to claim 16 wherein each resistive element is connected to conductor leads.