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High temperature adhesive for polymide films

  • US 4,859,530 A
  • Filed: 07/09/1987
  • Issued: 08/22/1989
  • Est. Priority Date: 07/09/1987
  • Status: Expired due to Fees
First Claim
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1. A method of bonding a metal to a substrate which comprises placing therebetween a prepreg composed of a fibrous substrate coated and impregnated with a tacky polyimide precursor of (a) a substantially equimolar mixture of (i) 2,2-bis[4-(4-(4aminophenoxy)phenyl]hexafluoropropane or 2,2-bis[4-(3-aminophenoxy)phenyl]hexafluoropropane, or both, and (ii) lower alkyl diester of benzophenone tetracarboxylic acid;

  • (b) about 2 to 50 weight percent of polyamic acid polyamide producible from components (i) and (ii); and

    (c) about 10 to 50 weight percent of solvent;

    applying heat to cause the formation of the polyimide in situ while maintaining the metal and first-named substrate in intimate contact with the curing prepreg; and

    then cooling the resultant article.

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