Monolithic semiconductor device and method of manufacturing same
First Claim
1. A monolithic semiconductor device comprising:
- a semiconductor body having a first major surface;
a contiguous first region disposed in said semiconductor body of a first conductivity type, said first region including a channel section abutting said first surface, a first intermediate section spaced apart from said channel section and abutting said first surface and a body section disposed below said first surface and interconnecting said channel and said first intermediate sections;
a contiguous second region disposed in said semiconductor body of a second conductivity type, opposite of said first conductivity type, said second region being bounded by said first region and including a peripheral section between said channel section and said first intermediate section, above said body section and abutting said first surface, a contact section abutting said first surface, and spaced part from said peripheral section, with said peripheral section and said contact section being disposed on opposite sides of said first intermediate section and interconnected by other first portions of said second region;
an insulating layer positioned over said channel section on said first surface;
a first electrode on said insulating layer above said channel section; and
a first ohmic contact on said contact section so that at least part of current flow between said contact section and said peripheral section is around said first intermediate section and through said other first portions of said second region.
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Abstract
A monolithic semiconductor device for use in various applications such as lateral and vertical MOS transistors, insulated gate conductivity modulated devices and the like together with a method of manufacturing same. The device includes source, body and drain regions, with the body region including a channel section which is disposed adjacent an insulated gate formed on the surface of the device. The source region includes a central contact area flanked by a pair of body segments which extend up through the source region and which create a resistive path between the source contact area and the channel section. A voltage is developed across the resistive path which tends to maintain a parasitic bipolar transistor formed by the source, body and drain regions in a non-conductive state. A source metallization bridges the two body segments and the intermediate source contact thereby shorting the body region to the source. The geometry of the device is reduced in that width of the source contact area need not be increased to ensure that the source metallization contacts both the source and the body region.
51 Citations
30 Claims
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1. A monolithic semiconductor device comprising:
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a semiconductor body having a first major surface; a contiguous first region disposed in said semiconductor body of a first conductivity type, said first region including a channel section abutting said first surface, a first intermediate section spaced apart from said channel section and abutting said first surface and a body section disposed below said first surface and interconnecting said channel and said first intermediate sections; a contiguous second region disposed in said semiconductor body of a second conductivity type, opposite of said first conductivity type, said second region being bounded by said first region and including a peripheral section between said channel section and said first intermediate section, above said body section and abutting said first surface, a contact section abutting said first surface, and spaced part from said peripheral section, with said peripheral section and said contact section being disposed on opposite sides of said first intermediate section and interconnected by other first portions of said second region; an insulating layer positioned over said channel section on said first surface; a first electrode on said insulating layer above said channel section; and a first ohmic contact on said contact section so that at least part of current flow between said contact section and said peripheral section is around said first intermediate section and through said other first portions of said second region. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 26, 27)
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18. A monolithic semiconductor device comprising:
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a semiconductor body having generally parallel first and second major surfaces and an expitaxial layer of a first conductivity type which abuts said first major surface; a first contiguous region of a second conductivity type, disposed in said expitaxial layer, opposite of said first conductivity type, said first region including a channel section which extends around the periphery of said first region and abuts said first major surface and first and second intermediate sections, spaced apart from said channel section and one another and which abut said first major surface and a body section disposed below said first surface and interconnecting said channel with said first and intermediate sections; a second contiguous region of said first conductivity type and bounded by said first region, said second region including a peripheral section and a contact section abutting said first major surface, with said peripheral section being disposed adjacent said channel section, extending around said contact section and above said body section, said contact section being disposed between said first and second intermediate sections and said contact section and said peripheral section being interconnected by other portions of said second region; a third region of said first conductivity type which bounds said first region, said third region including a drift section, adjacent said channel section and opposite said peripheral section; an insulating layer positioned over said channel section on said first major surface; a first electrode on said insulating layer positioned over said channel section; and a first ohmic contact on said second region contact section so that at least a part of the current flow between said second region contact section and said peripheral section is around said first and second intermediate sections and through said other portions of said second region. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 28, 29, 30)
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Specification