Surface mounting device pick-and-place head

• US 4,860,438 A
• Filed: 02/09/1988
• Issued: 08/29/1989
• Est. Priority Date: 02/03/1988
• Status: Expired due to Term

• Current Assignee: Industrial Technology Research Institute
• Original Assignee: Industrial Technology Research Institute
• Inventors: Chen, Horng-Hwei
• Primary Examiner(s): Hall, Carl E.
• Application Number:
  US07/160,943
• Time in Patent Office: 567 Days
• Field of Search: 29/740, 29/741, 29/743, 29/759, 294/64.1, 294/2, 414/744 B
• US Class Current: 29/740
• CPC Class Codes: H05K 13/0408 Incorporating a pick-up tool
• CPC Class Codes: H05K 13/0409 Sucking devices
• CPC Class Codes: H05K 13/0413 with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
• CPC Class Codes: Y10T 29/53178 Chip component
• CPC Class Codes: Y10T 29/53191 Means to apply vacuum directly to position or hold work part

Abstract

An SMD pick-and-place head for picking an SMD (Surface Mounting Device) and placing it on a predetermined location of a PC board automatically. An SMD pick-and-place head also automatically centers a picked up SMD, so as to place the SMD at a predetermined location precisely. The SMD pick-and-place head comprises a body shell, a nozzle device, a vacuum source, an elevating device, two couples of centering links, a centering link drive mechanism, and a nozzle rotation drive mechanism.

Claims

1. An SMD pick-and-place head for picking up and placing a surface mounting device (SMD) automatically, which comprises:

a shell body;

a nozzle device having an opening hole;

a vacuum source for both producing and releasing vacuum pressure;

a passageway having one end communicating with said opening of said nozzle device and the other end communicating with said vacuum source;

at least one pair of centering links pivotally mounted on said shell body, having a cam follower mounted on each of a first end portion thereof, and a pad mounted on a second end portion thereof;

pad driving means for driving the pads of each pair of said centering links to move toward or away from each other; and

a mechanism engaging with said nozzle device and enclosed in said shell body for drawing said nozzle device to move linearly between a first position and a second position, relative to said shell body, and actuating said pad drawing means;

wherein said mechanism comprises;

a stepping motor disposed in such a manner that it moves integrally with said shell body, having a drive shaft;

a pinion connected to said drive shaft;

a rack slidably mounted on said shell body for meshing with said pinion, so as to be driven to slide relative to said shell body by said stepping motor; and

a coupling device for coupling said rack and said nozzle device;

said coupling device comprising;

a flange formed in one end portion of said rack, having a first receptacle surface;

a coupling sleeve sleeved around the outer peripheral surface of said rack above said flange, having a second receptacle surface formed therewithin opposite to said first receptacle surface of said flange and a connecting portion connected with said nozzle device for drawing said nozzle device to move integrally;

a stopper formed within said shell body for engaging with said coupling sleeve to restrict the upward movement of said coupling device; and

a first spring member constrained between said first receptacle surface of said flange and said second receptacle surface of said coupling sleeve, for enabling said rack to move upward relative to said coupling sleeve when said coupling sleeve is engaged with said stopper;

such that when said nozzle device is at its second position, said vacuum source produces vacuum pressure to enable said nozzle device to hold said SMD by means of vacuum pressure, then said mechanism drives said nozzle device to move to its first position and subsequently actuates said pad driving means to drive said pads of each pair of said centering links to move toward each other in order to grab and center said SMD, then said mechanism actuates said pad driving means to drive said pads of each pair of said centering links to move away from each other to release said SMD and subsequently drawing said nozzle device to move to its second position, finally said vacuum source releases vacuum pressure to enable said nozzle device to disengage from said SMD.

2. An SMD pick-and-place head as claimed in claim 1, wherein said driving means comprises:

at least one coil spring sleeved around said rack;

a receptacle member fixed relative to said rack for receiving a first end portion of said coil spring;

at least one cam ring sleeved around said rack and mounted on a first end surface of said coil spring, having a cam surface formed on a first surface thereof for actuating said cam follower of said centering links; and

when said rack moves upward, said spring members are pushed upward by said receptacle member, and subsequently pushing said cam ring upward to actuate said cam follower to urge said pads of said centering links to come close in pairs.

3. An SMD pick-and-place head as claimed in claim 2, wherein each pair of the centering links are actuated by each of said cam rings independently.

4. An SMD pick-and-place head as claimed in claim 1, wherein said centering links are two pairs and are interposed at a 90 degree angular distance with each other.

5. An SMD pick-and-place head as claimed in claim 2, wherein said centering links are two pairs and are interposed at a 90 degree angular distance with each other.

6. An SMD pick-and-place head as claimed in claim 3, wherein said centering links are two pairs and are interposed at a 90 degree angular distance with each other.