Shielding device

• US 4,861,941 A
• Filed: 02/11/1988
• Issued: 08/29/1989
• Est. Priority Date: 06/20/1986
• Status: Expired due to Fees

• Current Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Original Assignee: Matsushita Electric Industrial Company Limited (Panasonic Holdings Corporation)
• Inventors: Kubo, Kazuhiko, Nagai, Hiroyuki, Usui, Akira, Saitou, Susumu
• Primary Examiner(s): Nimmo, Morris H.
• Application Number:
  US07/184,490
• Time in Patent Office: 565 Days
• Field of Search: 174/35 R, 361/424, 29/829, 29/846, 29/852
• US Class Current: 174/350
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 1/113 Via provided in pad; Pad over filled via
• CPC Class Codes: H05K 1/115 Via connections; Lands around holes or via connections H05K1/112 takes precedence
• CPC Class Codes: H05K 2201/0979 Redundant conductors or connections, i.e. more than one current path between two points
• CPC Class Codes: H05K 2201/10371 Shields or metal cases
• CPC Class Codes: H05K 2203/1394 Covering open PTHs, e.g. by dry film resist or by metal disc
• CPC Class Codes: H05K 3/0094 Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
• CPC Class Codes: H05K 3/341 Surface mounted components
• CPC Class Codes: H05K 3/3452 Solder masks
• CPC Class Codes: H05K 9/0039 Galvanic coupling of ground layer on printed circuit board [PCB] to conductive casing printed shielding conductors, ground planes or power planes for reduction of cross-talk or noise in printed circuits H05K1/0218
• CPC Class Codes: H05K 9/006 specially adapted for signal processing applications, e.g. CATV, tuner, antennas amplifier
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10S 174/34 PCB in box or housing
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base

Abstract

The present invention is directed to a shielding device of a double-sided printed substrate used in a circuit for processing a high frequency signal such as a television tuner circuit and the like, which is arranged such that a first grounding conductor film (12a) is formed on one side of the substrate (11), a second grounding conductor film (12b) is formed on the other side of the substrate (11), both the conductor films (12a, 12b) are connected by a through-hole conductor (15b), an opening portion of a through hole (15a) at at least one side is covered and closed by a solder resist (16), and the shielding plate (13) is mounted on the conductor film (12a) on the one side and both members are soldered. In particular, when a ceramic substrate is used as the substrate (11), it is arranged so as to obtain reliable soldering and satisfactory shielding effects while ensuring the strength thereof.

Claims

1. A shielding device wherein a shielding plate is erected on one side of a substrate and is connected to a grounding conductor film on the other side of said substrate, comprising:

grounding conductor films respectively formed on said one side and on said other side of said substrate, said conductor film on said one side being connected to said conductor film on said other side by at least one through-hole conductor applied to at least one through-hole in said substrate, an opening portion of said at least one through-hole on at least one side of said substrate being covered and closed by a solder resist, and said shielding plate being mounted on said grounding conductor film on the at least one side and soldered thereto.

2. A shielding device according to claim 1, wherein a multiplicity of through-holes are formed so as to be positioned at right and left sides with respect to said shielding plate and alternately to each other along a lengthwise direction of said shielding plate, each of said through-holes being covered by a respective solder resist.

3. A shielding device according to claim 1, wherein solder resists are formed so as to divide said grounding conductor film on the at least one side into a plurality of sections at right and left sides with respect to said shielding plate and alternately to each other along a lengthwise direction of said shielding plate.

4. A shielding device as in claim 1 wherein said substrate is formed of a ceramic material.

5. A method of forming a shielding device comprising the steps of:

forming grounding conductor films respectively on opposite sides of a substrate;

electrically interconnecting the respective grounding conductor films through at least one through-hole formed in said substrate;

covering an open portion of said through-hole on at least one side of said substrate with a solder resist;

coating the grounding conductor film on said one side of said substrate with a creamy solder;

mounting a shielding plate on said grounding conductor film on said one side of said substrate through said creamy solder; and

soldering said shielding plate to said conductor film on said one side of said substrate.

6. A method according to claim 5, wherein said shielding plate is soldered to said grounding conductor film on said one side of said substrate by solder dipping.

7. A method according to claim 5, wherein said shielding plate is soldered to said grounding conductor film on said one side of said substrate by reflow soldering.

8. A method according to claim 5 wherein said substrate is formed of a ceramic material.