Wire-bonding method and apparatus

• US 4,864,514 A
• Filed: 08/31/1987
• Issued: 09/05/1989
• Est. Priority Date: 09/02/1986
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Yamanaka, Kazuyuki, Shibasaka, Mitsusada
• Primary Examiner(s): Arnold, Bruce Y.
• Assistant Examiner(s): Callaghan, Terry S.
• Application Number:
  US07/091,118
• Time in Patent Office: 736 Days
• Field of Search: 364/488, 364/489, 364/490, 364/491
• US Class Current: 716/139
• CPC Class Codes: H01L 21/67144 Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48 of an individual wire connector
• CPC Class Codes: H01L 2224/85148 involving movement of a part of the bonding apparatus
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/85 using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01039 Yttrium [Y]
• CPC Class Codes: H01L 2924/01066 Dysprosium [Dy]
• CPC Class Codes: H01L 2924/0107 Ytterbium [Yb]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]

Abstract

Wire-bonding of a semiconductor device designed in accordance with the CAD system is implemented on the basis of bonding data obtained by making use of the design data in the CAD system For the design data in the CAD system, coordinate data of the bonding pads and the lead frames and wiring information therebetween are used. Since ordinarily the coordinate system in the CAD system and the coordinate system in the wire-bonding apparatus are not equal to each other, coordinate transformation is applied to the bonding data obtained from the CAD system. The data thus transformed is delivered to the bonding unit. Since there is employed a scheme to utilize the design data in the CAD system, the necessity of inputting bonding data by an operator is eliminated, thus making it possible to carry out bonding work free from an error in a short time.

Claims

1. A wire-bonding method for a semiconductor device designed in accordance with a CAD system, said method comprising:

a step of extracting coordinate values of a semiconductor pellet from said Computer Aided Design system;

a step of extracting coordinate values of leads from said Computer Aided Design system;

a step of extracting wiring information for bonding from said Computer Aided Design system;

a step of preparing bonding data having positional coordinates for bonding on the basis of (1) said coordinate values of said pellet, (2) said coordinate values of said leads, and (3) said wiring information;

a step of inputting said bonding data to a bonding unit; and

a step of driving said bonding unit on the basis of said bonding data.

2. A wire-bonding method as set forth in claim 1, wherein said coordinate values of said pellet include coordinate values of bonding pads on said semiconductor pellet.

3. A wire-bonding method as set forth in claim 2, wherein said coordinate values of said bonding pads are the coordinate values at central positions of said bonding pads.

4. A wire-bonding method as set forth in claim 1, wherein said coordinate values of said leads include coordinate values of bonding points on inner leads.

5. A wire-bonding method as set forth in claim 1, wherein said wiring information indicate a corresponding relationship between bonding pads on said semiconductor pellet and inner leads.

6. A wire-bonding method as set forth in claim 1, wherein the accuracy of the extracted coordinate values is determined in consideration of the resolution of an XY stage of said bonding unit.

7. A wire-bonding method as set forth in claim 1, wherein said bonding data includes start coordinates and terminating coordinates of respective bonding wires.

8. A wire-bonding method as set forth in claim 1, wherein said bonding data includes the number of bonding wires.

9. A wire-bonding method as set forth in claim 1, wherein said bonding data is input to said bonding unit through a floppy or flexible disk.

10. A wire-bonding method as set forth in claim 1, wherein said bonding data is subjected to format conversion by using a minicomputer and is then input to said bonding unit.

11. A wire-bonding method for a semiconductor device designed in accordance with a Computer Aided Design system, said method comprising:

a step of extracting coordinate values of a semiconductor pellet from said Computer Aided Design system being represented in a first coordinate system used in said Computer Aided Design system;

a step of extracting coordinate values of leads from said Computer Aided Design system which are represented in said first coordinate system;

a step of extracting wiring information for bonding from said Computer Aided Design system;

a step of preparing bonding data having positional coordinates for bonding on the basis of (1) said coordinate values of said pellet, (2) said coordinate values of said leads and (3) said wiring information;

a step of inputting said bonding data to a bonding unit;

a step of transforming said input bonding data to corresponding data in a second coordinate system used in said bonding unit; and

a step of driving said bonding unit on the basis of said bonding data.

12. A wire-bonding method as set forth in claim 11, wherein said coordinate values of said pellet and said coordinate values of said leads respectively include coordinate values of reference points for said pellet and coordinate values of reference points for said leads, whereby when transformation to said second coordinate system is carried out, coordinate values of said respective reference points in said second coordinate system are calculated to compare coordinate values in said first and second coordinate systems in respect to the same reference point.

13. A wire-bonding method as set forth in claim 12, wherein coordinate values in said first and second coordinate systems are compared to obtained values of positional shift, rotational shift and variable shift between said first and second coordinate systems to perform transformation with reference to these obtained values.

14. A wire-bonding method as set forth in claim 12, wherein at least two reference points are provided for said pellet and said leads.

15. An apparatus for implementing wire-bonding to a semiconductor device designed using a Computer Aided Design System which is used for designing a pattern on a semiconductor pellet and a Computer Aided Design System which is used for designing a pattern on a lead frame on the basis of wiring information input thereto, said semiconductor pellet having bonding pads and inner leads thereon, said wire-bonding apparatus comprising:

a first memory unit for storing design data with respect to the pattern on a semiconductor pellet in said Computer Aided Design System used for designing a pattern on said semiconductor pellet;

a second memory unit for storing design data with respect to the pattern on a lead frame in said Computer Aided Design System used for designing a pattern on said lead frame;

a third memory unit for storing said wiring information;

a data extraction unit for preparing bonding data having positional information on the basis of said data from said first, second and third memory units;

a coordinate transformation unit for transforming a coordinate system of said bonding data prepared in said data extraction unit; and

a unit for carrying out wire-bonding on the basis of said bonding data having been transformed by said coordinate transformation unit.

16. A wire-bonding apparatus as set forth in claim 15, wherein said first memory unit stores therein coordinate values of bonding points on said bonding pads.

17. A wire-bonding apparatus as set forth in claim 15, wherein said second memory unit stores therein coordinate values of bonding points on said inner leads.

18. A wire-bonding apparatus as set forth in claim 15, wherein said third memory unit stores therein the correspondence relationship between said bonding pads and said inner leads.