Electroless deposition employing laser-patterned masking layer

• US 4,865,873 A
• Filed: 12/07/1987
• Issued: 09/12/1989
• Est. Priority Date: 09/15/1986
• Status: Expired due to Fees

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Levinson, Lionel M., Cole, Herbert S. Jr., Liu, Yung S., Sitnik, Theresa A.
• Primary Examiner(s): NOT, DEFINED
• Assistant Examiner(s): Bueker, Margaret
• Application Number:
  US07/129,854
• Time in Patent Office: 645 Days
• Field of Search: 427/98, 427/271, 427/304, 427/305, 427/306, 427/53.1, 427/54.1
• US Class Current: 427/555
• CPC Class Codes: C23C 18/1605 by masking
• CPC Class Codes: C23C 18/1608 from pretreatment step, i.e. selective pre-treatment
• CPC Class Codes: C23C 18/1831 Use of metal, e.g. activation, sensitisation with noble metals
• CPC Class Codes: C23C 18/1879 Use of metal, e.g. activation, sensitisation with noble metals
• CPC Class Codes: C23C 18/206 Use of metal other than noble metals and tin, e.g. activation, sensitisation with metals sensitising with tin C23C18/285, sensitising with noble metals C23C18/30
• CPC Class Codes: C23C 18/30 Activating or accelerating or sensitising with palladium or other noble metal
• CPC Class Codes: C23C 18/31 Coating with metals
• CPC Class Codes: H05K 2203/0565 Resist used only for applying catalyst, not for plating itself
• CPC Class Codes: H05K 2203/0577 Double layer of resist having the same pattern
• CPC Class Codes: H05K 2203/107 Using laser light
• CPC Class Codes: H05K 2203/1415 Applying catalyst after applying plating resist
• CPC Class Codes: H05K 3/0017 Etching of the substrate by chemical or physical means
• CPC Class Codes: H05K 3/184 using masks
• CPC Class Codes: Y10S 430/165 Thermal imaging composition

Abstract

A metal is electrolessly plated on a substrate which is first coated with at least one ablatively-removable layer that is selectively irradiated with laser radiation to obtain a pattern for the deposition of metal on the substrate. The electroless plating solution applied to the substrate after the irradiated substrate is coated with a catalyst also serves to remove the unirradiated portion of the ablatively-removable layer. The method is particularly suited for plating fine lines of metal, especially on non-planar surfaces.

Claims

1. A method of electrolessly plating a metal on a substrate comprising:

(a) coating the substrate with at least one layer of an ablatively-removable material to form a coated substrate;

(b) irradiating at least a portion of the coated substrate with a sufficient amount of laser radiation to thereby ablatively remove the irradiated portion of the layer coated on the substrate;

(c) terminating the step of irradiating at least a portion of the coated substrate;

(d) coating the resulting irradiated substrate with a catalyst capable of instigating electroless deposition of the metal to be plated when contacted by an electroless plating solution; and

(e) contacting the catalyst-coated substrate with an electroless plating solution to thereby plate the metal on the catalyst-coated irradiated portion of the substrate and simultaneously remove the unirradiated portion of the catalyst-coated layer.

2. The method of claim 1 wherein the electrolessly plated metal is selected from the group consisting of copper, palladium, nickel, cobalt and iron.

3. The method claim 2 wherein the electrolessly plated metal comprises copper.

4. The method of claim 1 wherein the catalyst is selected from the group consisting of palladium-containing compounds, nickel-containing compounds and platinum-containing compounds.

5. The method of claim 1 wherein said catalyst is selected from the group consisting of bis benzonitrile palladium chloride, palladium acetate, palladium bromide, palladium chloride, palladium iodide, palladium nitrate, palladium 1,1,1,5,5,5-hexafluoro-2,4-pentanedionate, palladium 2,4-pentanedionate, palladium trifluoroacetate and elemental palladium.

6. The method of claim 1 wherein the ablatively-removable material comprises a water-soluble polymer.

7. The method of claim 6 wherein the water-soluble polymer is selected from the group consisting of polyvinylpyrrolidone, polyvinyl alcohol, gelatin and polyalkylene ethers.

8. The method of claim 6 wherein the water-soluble polymer comprises polyvinylpyrrolidone.

9. The method of claim 1 wherein step (b) further comprises irradiating at least a portion of the coated substrate with laser radiation in the far to near ultraviolet region at a fluence of at least about 20 mJ/cm².

10. The method of claim 9 wherein the rate of fluence is from about 20 mJ/cm² to about 300 mJ/cm².

11. The method of claim 9 wherein the laser comprises an excimer laser.

12. The method of claim 9 wherein the wavelength of the laser radiation is selected from the group of wavelengths consisting of 193 nm, 248 nm and 308 nm.

13. The method of claim 1 wherein the substrate comprises one of the group consisting of polyimides, alumina, ceramics, silicone-polyimides, polysulfones, silicon, silicone rubbers and silicon dioxide.

14. The method of claim 1 wherein the substrate includes a metal layer in the irradiated portion of the substrate, the plated metal being deposited on the metal layer to thereby provide a low loss means of electrically interconnecting the substrate and another electronic component.

15. The method of claim 1 wherein the substrate includes a layer of insulative material thereon and the layer of ablatively-removable material is coated on the insulative layer.

16. The method of claim 15 wherein step (b) comprises irradiating at least a portion of the ablatively-removable layer and the corresponding portion of the insulative layer in registry therewith, with said laser radiation to thereby ablatively remove the irradiated portion of the coated, ablatively-removable layer and corresponding irradiated portion of the insulative layer.

17. The method of claim 1 wherein the substrate is non-planar.

18. The method of claim 1 wherein the at least one layer of ablatively-removable material includes an organic soluble layer.

19. The method of claim 18 wherein the organic soluble layer comprises one of the group consisting of polyvinylacetate, polystyrene and polymethylmethacrylate.

20. The method of claim 18 wherein the substrate includes a layer of insulative material thereon and the at least one layer of ablatively-removable material is coated on the layer of insulative material.

29. The method of claim 14 wherein the metal layer comprises one of the group consisting of aluminum chromium and molybdenum.

21. A method of electrolessly plating copper on a substrate comprising:

(a) coating the substrate with a layer consisting essentially of a water-soluble polymer;

(b) irradiating at least a portion of the water-soluble polymer layer with a sufficient amount of laser radiation from an excimer laser to thereby ablatively remove said irradiated portions of the water-soluble polymer layer;

(c) terminating the step of irradiating at least a portion of the water-soluble polymer layer;

(d) coating with a palladium catalyst the surface of the substrate thus ablatively exposed; and

(e) contacting the substrate and the water-soluble polymer layer thereon with an electroless copper solution to thereby plate copper on the catalyst-coated portion of the substrate and simultaneously remove the unirradiated portion of the palladium catalyst-coated water-soluble polymer layer.

22. The method of claim 21 wherein said water soluble polymer comprises polyvinylpyrrolidone.

23. The method of claim 21 wherein the energy fluence of the radiation employed to ablatively remove portions of the water-soluble polymer layer is from about 20 mJ/cm² to about 300 mJ/cm².

24. The method of claim 21 wherein the substrate includes a layer of insulative material thereon and the water-soluble polymer layer overlies the insulative layer.

25. The method of claim 24 wherein step (b) comprises irradiating with laser radiation at least a portion of the water-soluble polymer layer and the corresponding portion of the insulative layer in registry therewith, to thereby ablatively remove the irradiated portion of the water soluble polymer layer and the corresponding irradiated portion of the insulative layer.

26. A method of electrolessly plating a metal on a substrate, said substrate including thereon a dual layer comprising an organic soluble material and a water-soluble polymer layer, said method comprising:

(a) irradiating at least a portion of the water-soluble polymer layer and a corresponding portion of the organic soluble layer in registry therewith, with a sufficient amount of laser radiation to thereby ablatively remove the irradiated portion of the water-soluble polymer layer and the corresponding portion of the organic soluble layer;

(b) terminating the step of irradiating at least a portion of the water-soluble polymer layer and a corresponding portion of the organic soluble layer in registry therewith;

(c) coating the surface of the substrate, thus ablatively exposed, with a catalyst capable of instigating electroless deposition of the metal to be plated when the ablatively-exposed substrate surface is contacted by an electroless plating solution; and

(d) contacting the catalyst-coated substrate with an electroless plating solution to thereby plate the metal on the ablatively-exposed substrate surface and simultaneously remove the unirradiated catalyst-coated dual layer.

27. The method of claim 26 wherein the water-soluble polymer layer is situated between the organic soluble layer and the substrate.

28. The method of claim 26 wherein the organic soluble layer is situated between the water-soluble polymer layer and the substrate.