Semiconductor device having waveguide-coaxial line transformation structure

• US 4,868,639 A
• Filed: 08/10/1987
• Issued: 09/19/1989
• Est. Priority Date: 08/11/1986
• Status: Expired due to Term

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Arai, Youichi, Hasegawa, Mitsuo, Mugiya, Hiroshi
• Primary Examiner(s): Hille, Rolf
• Assistant Examiner(s): Key, Gregory
• Application Number:
  US07/083,386
• Time in Patent Office: 771 Days
• Field of Search: 357/74, 357/75, 357/81
• US Class Current: 257/699
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/4823 connecting the wire to a pin of the item
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/15312 being a pin array, e.g. PGA
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16153 Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
• CPC Class Codes: H01L 2924/16195 Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/20752 larger or equal to 20 microns less than 30 microns
• CPC Class Codes: H01L 2924/2076 equal to or larger than 100 microns
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H01S 5/1082 : with a special facet structure, e.g. structured, non planar, oblique

Abstract

In a semiconductor device which has an air tight metal package containing a high frequency wave range circuit element and which has a waveguide-coaxial line transformation structure, a metal terminal for the waveguide-coaxial line is air-tightly attached directly in a hole of a base of the metal package with a dielectric spacer, usually by glass fusion, whereby the thickness of the base may be reduced and attachment of the terminal to the base is simplified.

Claims

1. A semiconductor device, comprising:

a metal base of a package, having a hole passing through a base;

a semiconductor circuit element mounted on the base;

a cap of the package air-tightly fixed to the base for sealing the circuit element within the package;

a metal terminal for waveguide-coaxial line transformation, passing through the hole of the base and having an inner end portion at which the terminal is electrically connected to the circuit element, a central transformation portion in the hole of the base, and an outer antenna portion extending toward the outside of the package; and

a dielectric spacer between the terminal and the base, the terminal being air-tightly fixed directly to the base by the dielectric spacer;

wherein the hole of the base, the dielectric spacer, and the central transformation portion of the terminal are formed so as to satisfy the following formula;

##EQU2## where Z₀ is a required inherent impedance of a characteristic frequency, ε

is a dielectric constant of the dielectric spacer, d₁ is a diameter of the central transformation portion of the terminal and d₂ is a diameter of a portion, enclosing the central transformation portion of the terminal of the hole of the base, such that said members act as a required waveguide-coaxial line transformer.

2. A device according to claim 1, wherein the base of the package is made of a steel.

3. A device according to claim 1, wherein the hole of the base has a simple cylindrical configuration.

4. A device according to claim 1, wherein the hole of the base has a stepwise cylindrical configuration in which a portion of the hole close to the inside of the package has a smaller diameter than that of the remaining portion of the hole.

5. A device according to claim 4, wherein the dielectric spacer is present between the smaller diameter portion of the hole and the terminal as well as between said remaining portion of the hole and the terminal.

6. A device according to claim 4, wherein the dielectric spacer is present only between said remaining portion of the hole and the terminal and air is present between the smaller diameter portion of the hole and the terminal.

7. A device according to claim 1, further comprising a waveguide attached to the base of the package, the waveguide having a hole which is aligned with the hole of the base and through which the antenna portion of the terminal passes toward the inside the waveguide.

21. A device according to claim 1, wherein the base and cap of the package are made of a steel.

8. a semiconductor device, comprising:

a metal base of a package, having a hole passing through a base,

a semiconductor circuit element mounted on the base;

a cap of the package air-tightly fixed to the base for sealing the circuit element within the package;

a metal terminal for waveguide-coaxial line transformation, passing through the hole of the base and having an inner end portion, the inner end portion extending from the inside of the hole in the base into the package and having a flat top surface and a first diameter, a central transformation portion having a second diameter in the hole of the base, and an outer antenna portion having a third diameter and extending toward the outside of the package, the first diameter being larger than the second diameter;

a wire bonded to the top surface of the inner end portion of the terminal and to the circuit element and electrically connecting the terminal with the circuit element;

a dielectric spacer between the terminal including the transformation portion and a part of the inner end portion thereof and the base, the terminal being air-tightly fixed directly to the base by the dielectric spacer;

wherein the hole of the base, the dielectric spacer, and the central transformation portion of the terminal are formed so as to satisfy the following formula;

##EQU3## wherein Z₀ is a required inherent impedance of a characteristic frequency, ε

is a dielectric constant of the dielectric spacer, d₁ is the second diameter of the central transformation portion of the terminal and d₂ is a diameter of a portion, enclosing the central transformation portion of the input terminal, of the hole of the base, such that said members act as a required waveguide-coaxial line transformation.

9. A. device according to claim 8, wherein the hole of the base has a simple cylindrical configuration.

10. A device according to claim 8, wherein the first and third diameters of the terminal have a same diameter which is substantially larger than the second diameter.

11. A device according to claim 8, wherein the base of the package is made of a steel.

12. A device according to claim 8, wherein the dielectric spacer is made of glass.

13. A device according to claim 8, wherein the wire is made of aluminum and welded to the inner end portion of the terminal.

14. A device according to claim 13, wherein the first diameter is more than two times larger than the diameter of the aluminum wire.

15. A device according to claim 14, wherein the first diameter is more than three times larger than the diameter of the aluminum wire.

16. A device according to claim 15, wherein the aluminum wire has a diameter of about 0.3 mm.

17. A device according to claim 8, wherein Z₀ is about 50 Ω

.

18. A device according to claim 8, further comprising a waveguide attached to the base of the package, the waveguide having a hole which is aligned with the hole of the base and through which the antenna portion of the terminal passes and extends into said waveguide.

19. A device according to claim 8, designed for microwave.

20. A semiconductor device, comprising:

a metal flat base of a package, having a hole passing through the base;

a plurality of semiconductor circuit elements mounted on the flat base;

a metal cap of the package air-tightly fixed to the flat base for sealing the circuit elements within the package, the metal cap having a plurality of cup-like small rooms formed on a draw-pressed metal sheet, the cup-like small rooms forming an electromagnetic shield for each circuit element;

a metal terminal for waveguide-coaxial line transformation, passing through the hole of the base and having an inner end portion at which the terminal is electrically connected to one of the circuit elements, a central transformation portion in the hole of the base, and an outer antenna portion extending toward the outside of the package, and

a dielectric spacer between the terminal and the base, the terminal being air-tightly fixed directly to the base by the dielectric spacer;

wherein the structure of the hole of the base, the dielectric spacer, and the central transformation portion of the terminal is so formed that said members act as a required waveguide-coaxial line transformer.

22. A semiconductor device, comprising:

a metal base of a package, having a hole passing through the base,

a semiconductor circuit element mounted on the base;

a cap of the package air-tightly fixed to the base for sealing the circuit element within the package;

a metal terminal for waveguide-coaxial line transformation, passing through the hole of the base and having an inner end portion having a flat top surface and a first diameter, a central transformation portion having a second diameter in the hole of the base, and an outer antenna portion having a third diameter and extending from the inside of the hole of the base toward the outside of the package, the first diameter being larger than the second diameter;

a wire bonded to the top surface of the inner end portion of the terminal and to the circuit element and electrically connecting the terminal with the circuit element;

a dielectric spacer between the terminal including the transformation portion and a part of the inner end portion thereof and the base, the terminal being air-tightly fixed directly to the base by the dielectric spacer;

wherein the whole of the base, the dielectric spacer, and the central transformation portion of the terminal are formed in order to satisfy the following formula;

##EQU4## where Z₀ is a required inherent impedance of a characteristic frequency, is a dielectric constant of the dielectric spacer, D₁ is a diameter of the central transformation portion of the terminal and d₂ is a diameter of a portion, enclosing the central transformation portion of the terminal of the hole of the base, such that said members act as a required waveguide-coaxial line transformer.

23. A device according to claim 22, wherein said inner end portion of said terminal extends from the inside of said hole into said package.