Multilayered ceramic capacitor

• US 4,868,711 A
• Filed: 09/28/1988
• Issued: 09/19/1989
• Est. Priority Date: 09/29/1987
• Status: Expired due to Term

• Current Assignee: Mitsubishi Mining & Cement Co. Ltd. (Mitsubishi Materials Corporation)
• Original Assignee: Mitsubishi Mining & Cement Co. Ltd. (Mitsubishi Materials Corporation)
• Inventors: Hirama, Masahiro, Shinohara, Yoshinori, Tanidokoro, Hiroaki, Kitahara, Naoto, Hikita, Kazuyasu
• Primary Examiner(s): GRIFFIN, DONALD
• Application Number:
  US07/250,119
• Time in Patent Office: 356 Days
• Field of Search: 252/62.2, 264/61, 264/63, 264/65, 501/134-139, 29/25.42, 174/68.5, 357/10, 361/328, 361/330, 361/306, 361/321
• US Class Current: 361/321.3
• CPC Class Codes: H01G 4/20 using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 H01G4/12 takes precedence
• CPC Class Codes: H01G 4/258 Temperature compensation means
• CPC Class Codes: H01G 4/30 Stacked capacitors H01G4/33 takes precedence
• CPC Class Codes: Y10T 29/435 Solid dielectric type

Abstract

A multilayered ceramic capacitor includes glass melted layers and adhering layers containing conductive patters in which the combination of two or more different species of dielectric materials are used for ceramic layers in the stack of the multilayered capacitor.

Claims

1. A multilayered ceramic capacitor comprising in combination:

(a) a plurality of ceramic thin film pieces;

(b) joining layers formed on said ceramic thin film pieces in which those are alternatively laminated therein, said ceramic thin film piece having been independently fired, and being sandwiched between two joining layers, said joining layers serving to join the adjacent layers sandwiching said joining layer; and

(c) conductive material layers formed on the surfaces of said ceramic thin pieces for electrodes of said capacitor;

wherein said plurality of ceramic film pieces comprises two or more species of ceramic films independently different in dielectric properties, each of which species is made of selected dielectric material, each species having at least one film piece laminated in the stack of the layers.

2. The capacitor as claimed in claim 1 wherein one of said selected dielectric materials have a positive temperature coefficient of electrostatic capacity, and the other thereof has a negative temperature coefficient of electrostatic capacity.

3. The capacitor as claimed in claim 2 wherein said dielectric material(s) having a positive temperature coefficient of electrostatic capacity is selected from alumina, mullite, steatite, forsterite, magnesium titanate or lead titanate, and said dielectric material(s) having a negative temperature coefficient of electrostatic capacity is selected from titania, calcium titanate or strontium titanate.

4. The capacitor as claimed in claim 1, wherein said joining layers are consisting essentially of:

(1) said glass material layers and (2) said conductive material layers, and both of the said glass material layers and the said conductive material layers function to bind the adjacent two ceramic film pieces and further said conductive material layers are formed from conductive binder material.

5. The capacitor as claimed in claim 1 wherein said conductive material layers are enclosed between the ceramic thin film pieces and glass material layers, and are not exposed to the outside of the capacitor.

6. A method of the production of the multilayered ceramic capacitor of claim 1 which comprises:

(A) selecting a combination of two or more materials having different dielectric constants and different temperature coefficient of electrostatic capacity to yield the appropriate total dielectric constant and approximately zero temperature coefficient of the total electrostatic capacity;

(B) preparing predetermined numbers of two or more species of dielectric layers each of which is made independently of the selected dielectric materials in combination as in the step (A), firing green sheets made of said selected dielectric materials;

(C) forming predetermined conductive patterns of thick coatings of conductive material paste on the both surfaces of said fired dielectric layers as prepared in the step (B), by printing said patterns of conductive electroding base metal paste on the surfaces of the said layers by a printing techniques such as silk screen printing;

(D) forming a glass paste material layer over each of the conductive patterns formed on the surfaces of said layers and the whole surfaces of the said dielectric layers by applying a paste consisting of glass powder and binder medium to the whole surface including the conductive patterns of said dielectric layers if desired;

(E) stacking at least one of each of such two or more species of said dielectric layers having entirely different dielectric properties, with said conductive patterns and said glass material layers,

(F) further positioning respective ceramic films on both of the most top and on the bottom surfaces of the resulting stack.

(G) firing such formed stack at relatively lower temperature so as to melt the glass paste material in said glass material layers to join together the adjacent dielectric layers sandwiching the corresponding glass paste layers to provide a multilayered capacitor with enclosed inner electrodes.

7. A multilayered ceramic capacitor comprising in combination:

dielectric layers and conductive layers alternatively layered therein, wherein said dielectric layers comprises two or more species of dielectric layers each made of different dielectric materials, which have been independently fired, said conductive material layer being formed on both surfaces of said dielectric layers, and said dielectric layers with the conductive layer(s) formed on the surface(s) thereof being mutually bonded by a joining layer consisting essentially of glass material.

8. The multilayered ceramic capacitor as claimed in claim 7, wherein said conductive material layer consisting essentially of silver, copper, palladium and the combination thereof.

9. A method of preparation of a multilayered ceramic capacitor of claim 7 which comprises:

(A) selecting a combination of two or more materials having different dielectric constants and different temperature coefficient of electrostatic capacity to yield appropriate total dielectric constant and approximately zero temperature coefficient of electrostatic capacity;

(B) firing dielectric material films of the selected dielectric materials as in the step (A), to prepare predetermined number of the fired ceramic thin films of the two or more species of said different materials as selected;

(C) applying conductive electroding paste consisting essentially of metal powder and binding medium on the surface(s) of said prepared films to form predetermined patterns as inner electrodes;

(D) further applying glass paste consisting essentially of glass powder and binding medium over the surface(s) of each the electroding films to form glass material layer(s) on the whole surfaces of said prepared films;

(E) stacking at least one of said two or more species of thus formed different dielectric films;

(F) heating thus formed stack comprising the fired dielectric films with the electroding enclosed in the glass material layers, at relatively lower temperature so as to melt the glass material thereby to form binding between the thus formed films.

10. The method of preparation of the multilayered ceramic capacitor, multilayered capacitor, as claimed in claim 9, wherein the electroding pattern is enclosed among the glass material layer and the ceramic film piece.

11. The method of preparation of the multilayered ceramic capacitor as claimed in claim 9, wherein the metal powder for the electroding pattern is selected from silver, copper, palladium and the combination thereof.

12. The method of preparation of the multilayered ceramic capacitor as claimed in claim 9, wherein the electroding pattern is formed by printing technique such as screen printing to form thick coating on the surface of the film pieces.

13. The method of preparation of the multilayered ceramic capacitor as claimed in claim 9, wherein the glass material layer is formed by applying the glass paste over the surfaces of the electroding patterns and the dielectric films.

14. The method of preparation of the multilayered ceramic capacitor as claimed in claim 9, wherein one species of the dielectric film is of alumina having a positive temperature coefficient of electrostatic capacity, and the other species of the dielectric film is of strontium titanate composition having a negative temperature coefficient of electrostatic capacity.