Chip mounting apparatus

• US 4,868,974 A
• Filed: 08/29/1988
• Issued: 09/26/1989
• Est. Priority Date: 09/01/1987
• Status: Expired due to Fees

• Current Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Original Assignee: Sumitomo Electric Industries Limited (Sumitomo Corporation)
• Inventors: Nishiguchi, Masanori
• Primary Examiner(s): Hall, Carl E.
• Application Number:
  US07/237,578
• Time in Patent Office: 393 Days
• Field of Search: 29/834, 29/709, 29/714, 29/740, 29/743, 29/759
• US Class Current: 29/740
• CPC Class Codes: H01L 2221/68313 Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
• CPC Class Codes: H05K 13/02 Feeding of components
• CPC Class Codes: H05K 13/0413 with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
• CPC Class Codes: H05K 13/0815 Controlling of component placement on the substrate during or after manufacturing
• CPC Class Codes: Y10T 29/53178 Chip component
• CPC Class Codes: Y10T 29/53261 Means to align and advance work part

Abstract

A chip mounting apparatus is provided with a base, a support member securely held on the base, a tray detachably mounted in the support member and provided with a plurality of substantially square concaves each for accommodating one of the chips, and an oscillating device for oscillating the tray. The concaves of the tray are regularly spaced from one another by a plurality of partition walls formed on the tray. The support member is capable of inclining the tray so that one corner of each concave may become lower than any other corners. In such a chip mounting apparatus, the chips are rearranged in order in the same corners of respective concaves upon oscillation of the tray.

Claims

1. A chip mounting apparatus for mounting a plurality of chips one at a time onto a package base or a circuit board, said chip mounting apparatus comprising:

a base;

a support member securely held on said base;

a tray detachably mounted in said support member and provided with a plurality of substantially square concaves each for accommodating one of said chips, said concaves being regularly spaced from one another by a plurality of partition walls formed on said tray;

means associated with said support member for inclining said tray so that one corner of each concave becomes lower than any other corners thereof; and

an oscillating means for oscillating said tray,

whereby said chips are rearranged and positioned in the same corners of respective concaves.

2. The chip mounting apparatus according to claim 1, further comprising a vacuum pickup member for picking up said chips rearranged on said tray one at a time and a control means for controlling a relative angle between said tray and said vacuum pickup member by recognizing a direction identification mark formed on an upper surface of each chip.

3. The chip mounting apparatus according to claim 1, wherein at least two notches are formed respectively at two corners positioned diagonally with respect to one concave and two projections are formed on said vacuum pickup member to be brought into contact with diagonally located two corners of each chip.