Handler for IC packages
First Claim
1. A handler for presenting circuit packages to a test head, said handler working in conjunction with a plurality of carrier platens, hereinafter called sticks, each stick adapted for holding a plurality of packages in a substantially horizontal linear array, the linear array defining a linear axis for the stick, comprising:
- input elevator means for receiving a first stick loaded with a first package, with the linear axis of said first stick oriented in a first direction, for moving said first stick vertically to an index level with said linear axis oriented in a direction parallel to said first direction;
input drive means for moving said first stick horizontally in a direction parallel to said first direction at said index level to an index position where said first package can be removed from said first stick, and for moving said first stick away from said index position after said package has been removed;
first pick-up means, for removing said first package from said first stick when said first stick is located at said index position and for moving said first package to a stage pick-up position;
stage means for receiving said first package when said first pick-up means moves said first package to said stage pick-up position, for presenting said first package to the test head for testing thereby, and for moving said first package to a stage exit position after testing by the test head;
stage pick-up means for removing said first package from said stage means when said first package is located at said stage exit position, and for placing said first package in a stage row stick at a stage row receiving level;
third pick-up means for removing said first package from said stage row stick, and for placing said first package into a storage row stick located at a storage row receiving level in response to a signal from said test head.
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Accused Products
Abstract
A package handling apparatus for presenting circuit packages to a test head is provided which uses a soft handling approach throughout the system. The handler works with a plurality of sticks, with each stick adapted for holding a plurality of packages in a substantially horizontal linear array, with the linear array defining a linear axis for the stick. The handler includes an input elevator element for receiving a first stick loaded with a first package, for moving the first stick vertically to an index level. An input drive moves the first stick horizontally to an index position. A first pick-up removes the first package from the first stick and then moves the first package to a stage pick-up position. A stage element receives the first package, and presents it to the test head for testing. Once tested, the stage element moves the package to a stage exit position. A stage pick-up then places the first package in a stage row stick. A third pick-up then removes the first package from the stage row stick, and places it into a storage row stick in response to a signal from the test head. With this approach, packages are transported and stored in sticks, except when on the stage element. Hence, the packages never contact each other or feed trays. Furthermore, gravity is not used for stick transport. Instead, controlled drive systems are used. Hence, the entire system can be configured to avoid problematic accelerations, and hence reduce potential damage to the delicate integrated circuits being transported.
32 Citations
18 Claims
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1. A handler for presenting circuit packages to a test head, said handler working in conjunction with a plurality of carrier platens, hereinafter called sticks, each stick adapted for holding a plurality of packages in a substantially horizontal linear array, the linear array defining a linear axis for the stick, comprising:
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input elevator means for receiving a first stick loaded with a first package, with the linear axis of said first stick oriented in a first direction, for moving said first stick vertically to an index level with said linear axis oriented in a direction parallel to said first direction; input drive means for moving said first stick horizontally in a direction parallel to said first direction at said index level to an index position where said first package can be removed from said first stick, and for moving said first stick away from said index position after said package has been removed; first pick-up means, for removing said first package from said first stick when said first stick is located at said index position and for moving said first package to a stage pick-up position; stage means for receiving said first package when said first pick-up means moves said first package to said stage pick-up position, for presenting said first package to the test head for testing thereby, and for moving said first package to a stage exit position after testing by the test head; stage pick-up means for removing said first package from said stage means when said first package is located at said stage exit position, and for placing said first package in a stage row stick at a stage row receiving level; third pick-up means for removing said first package from said stage row stick, and for placing said first package into a storage row stick located at a storage row receiving level in response to a signal from said test head. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A handler for presenting circuit packages to a test head, said handler working in conjunction with a plurality of carrier platens, hereinafter called sticks, each stick adapted for holding a plurality of said packages in a substantially horizontal linear array, the linear array defining a linear axis for the stick, comprising:
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input elevator means for receiving a plurality of sticks, each stick loaded with a plurality of packages, with the linear axis of each of said sticks in said input elevator means oriented in a first direction, for moving each of said sticks vertically to an index level with said linear axis of each stick oriented in a direction parallel to said first direction; input drive means for moving each of said plurality of sticks horizontally in a direction parallel to said first direction at said index level to an index position where each of said packages can be removed from said sticks, and for moving each of said sticks away from said index position after each of said packages has been removed from its respective stick; first pick-up means for removing said packages from said plurality of sticks when each of said sticks is located at said index position and for moving said packages to a stage pick-up position; stage means for receiving each of said packages when said first pick-up means moves each of said packages to said stage pick-up position, for presenting said packages to the test head for testing thereby, and for moving said packages to a stage exit position after testing by the test head; stage pick-up means for removing said packages from said stage means when said packages are located at said stage exit position, and for placing said packages in a stage row stick at a stage row receiving level; third pick-up means for removing said packages from said stage row stick, and for placing said packages into a storage row stick located at a storage row receiving level in response to a signal from said test head.
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12. A handler for presenting circuit packages to a test head comprising:
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a plurality of carrier platens, hereinafter called sticks, each stick adapted for holding a plurality of said packages in a substantially horizontal linear array, the linear array defining a linear axis for the stick; input elevator means for receiving a plurality of sticks, each stick loaded with a plurality of packages, with the linear axis of each of said sticks in said input elevator means oriented in a first direction, for moving each of said sticks vertically to an index level with said linear axis of each stick oriented in a direction parallel to said first direction; input drive means for moving each of said plurality of sticks horizontally in a direction parallel to said first direction at said index level to a plurality of index positions, each index position being where one of each of said packages can be removed from said sticks, and for moving each of said sticks away from said index positions after all of said packages have been removed from a stick; first pick-up means for removing said packages from said plurality of sticks when each of said sticks is located at said index position and for moving said packages to a stage pick-up position; stage means for receiving each of said packages when said first pick-up means moves each of said packages to said stage pick-up position, for presenting said packages to the test head for testing thereby, and for moving said packages to a stage exit position after testing by the test head; stage pick-up means for removing said packages from said stage means when said packages are located at said stage exit position, and for placing said packages in a stage row stick at a stage row receiving level; third pick-up means for removing said packages from said stage row stick, and for placing said packages into a storage row stick located at a storage row receiving level in response to a signal from said test head. - View Dependent Claims (13, 14, 15, 16, 17, 18)
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Specification