Process for placing single or multiple patterned layers of conductive material on a substrate

• US 4,869,767 A
• Filed: 06/02/1987
• Issued: 09/26/1989
• Est. Priority Date: 05/03/1985
• Status: Expired due to Fees

• Current Assignee: Hallmark Cards Incorporated
• Original Assignee: Hallmark Cards Incorporated
• Inventors: Robinson, Richard A., Brown, William E.
• Primary Examiner(s): Robinson, Ellis P.
• Assistant Examiner(s): RYAN, PATRICK J
• Application Number:
  US07/058,598
• Time in Patent Office: 847 Days
• Field of Search: 156/233, 156/234, 156/235, 156/241, 156/249, 156/267, 156/275.7, 156/344
• US Class Current: 156/233
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/05 Insulated conductive substrates, e.g. insulated metal substrate
• CPC Class Codes: H05K 2201/0317 Thin film conductor layer; Thin film passive component
• CPC Class Codes: H05K 2203/0156 Temporary polymeric carrier or foil, e.g. for processing or transferring
• CPC Class Codes: H05K 2203/0522 Using an adhesive pattern
• CPC Class Codes: H05K 2203/0528 Patterning during transfer, i.e. without preformed pattern, e.g. by using a die, a programmed tool or a laser
• CPC Class Codes: H05K 2203/1545 Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
• CPC Class Codes: H05K 3/046 by selective transfer or selective detachment of a conductive layer
• CPC Class Codes: H05K 3/20 by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: H05K 3/4644 by building the multilayer layer by layer, i.e. build-up multilayer circuits making via holes in the insulating layers H05K3/0011; special circuit boards as base or core whereon the multilayer is built H05K3/4602
• CPC Class Codes: H05K 3/4658 characterized by laminating a prefabricated metal foil pattern, e.g. by transfer
• CPC Class Codes: Y10S 156/919 Delaminating in preparation for post processing recycling step
• CPC Class Codes: Y10T 156/108 Flash, trim or excess removal

Abstract

The invention consists of an improved method for placing single or multiple patterned layers of conductive material on a substrate. The method provided includes the step of placing or depositing a thin patterned layer of electrically conductive material on a substrate. The procedures used to deposit this layer include mechanically adhering the layer to the substrate then removing portions of it to form a pattern. They also include printing adhesive on the substrate and using it to peel a conductive pattern off of the surface of a transfer agent. After depositing the first conductive pattern, the process prints an insulating layer on top of it. The insulating layer has openings through which the next conductive pattern makes electrical contact with the first. Similarly, the process places other conductive layers and prints other insulating layers between them to produce multiple layers of conductive patterns. The multilayer circuit board provided includes a substrate. It also includes conductive layers separated by insulating layers and electrically interconnected through openings in those insulating layers.

Claims

1. A method for making electronic components by placing electrically conductive or semi-conductive patterns on a substrate, comprising the steps of:

(a) depositing a releasable layer of electrically conductive material on a transfer agent;

(b) removing a pattern of the conductive layer from said transfer agent to leave a desired remaining pattern of the conductive layer;

(c) transferring said desired remaining pattern to a substrate to establish electrical current paths across said substrate;

(d) applying an insulating separating layer of material on the pattern on said substrate;

(e) repeating steps (a) and (b); and

(f) transferring said desired remaining pattern resulting form step (e) to the resultant of step (d) to establish electrical current paths thereacross.

2. A method for making electronic components by placing electrically conductive or semi-conductive patterns on a substrate, comprising the steps of:

(a) depositing a releasable layer of electrically conductive material on a transfer agent;

(b) removing a pattern of the conductive layer form the transfer agent to leave a desired remaining pattern on the transfer agent;

(c) transferring said desired pattern of said conductive layer from said transfer agent to a substrate to establish electrical current paths across said substrate;

(d) applying an insulating separating layer of material on the pattern on said substrate which is the same or different from the pattern of step (b);

(e) depositing a releasable layer of electrically conductive material on a transfer agent;

(f) removing a pattern of the conductive layer deposited in step (e) from said transfer agent to leave a desired remaining pattern of the conductive layer, said desired remaining pattern of the conductive layer being either the same or different from the pattern of step (b);

(g) transferring said desired remaining pattern resulting from step (f) to the resultant of step (d); and

(h) repeating steps (d) through (g) as desired, each time building on the resultant of the previous step.

3. A method for making electronic components by placing electrically conductive or semi-conductive patterns on a substrate, comprising the steps of:

(a) depositing a releasable layer of electrically conductive material on a substrate;

(b) removing a pattern of the conductive layer from said substrate to leave a desired remaining pattern on said substrate and establish electrical current paths across said substrate;

(c) applying an insulating separating layer of material on said substrate which is the same or different from the pattern of step (b);

(d) depositing a releasable layer of electrically conductive material on the resultant of step (c); and

(e) removing a pattern of the conductive layer deposited in step (d) to leave a desired remaining pattern of the conductive layer.

4. A method for making electronic components by placing electrically conductive and semi-conductive patterns on a substrate, comprising the steps of:

(a) depositing a releasable layer of electrically conductive material on a transfer agent;

(b) applying an adhesive on a waste removing agent to a desired pattern;

(c) joining said waste removing agent and said transfer agent so that said adhesive on said waste removing agent contacts a portion of the conductive layer on said transfer agent and binds the portion to said water removing agent;

(d) separating said waste removing agent and said transfer agent to remove a pattern of the conductive layer with the waste removing agent and to leave a desired remaining pattern of the conductive layer on the transfer agent, the removed pattern having the same configuration as the adhesive pattern, the remaining pattern being the negative of said adhesive pattern;

(e) applying an adhesive on a substrate;

(f) joining said transfer agent and said substrate so that said adhesive on said substrate contacts the remaining conductive pattern on said transfer agent and binds the remaining conductive pattern to said substrate; and

(g) separating said transfer agent and said substrate to leave the remaining conductive pattern on said substrate and establish electrical current paths across said substrate.

5. The method of claim 4, further comprising the step of curing the adhesive applied in step (b) while said waste removing agent remains joined with said transfer agent.

6. The method of claim 4, further comprising the step of curing the adhesive applied in step (e) while said transfer agent remains joined with said substrate.

7. The method of claim 4 wherein step (e) provides full coverage of adhesive to the surface of the substrate.

8. A method for making electronic components by placing electrically conductive and semi-conductive patterns on a substrate, comprising the steps of:

(a) depositing a releasable layer of electrically conductive material on a transfer agent;

(b) applying an adhesive on a substrate to a desired pattern;

(c) joining said transfer agent and said substrate so that said adhesive on said substrate contacts a portion of the conductive layer on said transfer agent and binds the portion to said substrate; and

(d) separating said transfer agent and said substrate to remove a pattern of conductive layer from the transfer agent and transfer said removed pattern to said substrate where said removed pattern provides an electrical current path, said removed conductive pattern having the same peripheral configuration as the adhesive pattern.

9. The method of claim 8, further comprising the step of curing the adhesive applied in step (b) while said transfer agent remains joined with said substrate.

10. A method for making electronic components by placing electrically conductive and semi-conductive patterns on a substrate, comprising the steps of:

(a) depositing a releasable layer of electrically conductive material on a transfer agent;

(b) applying an adhesive on a waste removing agent to a desired pattern;

(c) joining the waste removing agent and said transfer agent so that said adhesive on said waste removing agent contacts a portion of the conductive layer on said transfer agent and binds the portion to said waste removing agent;

(d) separating said waste removing agent and said transfer agent to remove a pattern of the conductive layer with the waste removing agent and to leave a desired remaining pattern of the conductive layer on the transfer agent, the removed pattern having the same configuration as the adhesive pattern, the remaining pattern being the negative of said adhesive pattern;

(e) applying an adhesive on a substrate;

(f) joining said transfer agent and said substrate so that said adhesive on said substrate contacts the remaining conductive pattern on said transfer agent and binds the remaining conductive pattern to said substrate;

(g) separating said transfer agent and said substrate to leave the remaining conductive pattern on said substrate and establish electrical current paths across said substrate;

(h) applying a layer of adhesive over said remaining conductive pattern on said substrate, said adhesive layer having at least one void and providing electrical insulation for said remaining conductive pattern;

(i) applying an electrically conductive interconnecting agent in the void of the layer of adhesive applied in step (h);

(j) repeating steps (a) through (d);

(k) joining the transfer agent of step (j) and said substrate so that the adhesive applied on said substrate in step (h) contacts the conductive pattern on said transfer agent of step (j) and binds said conductive pattern to said substrate so that the conductive pattern makes electrical contact with the electrically conductive interconnecting agent; and

(l) repeating steps (h) through (k) to provide the desired number of conductive layers which form electric paths.

11. A method for making electronic components by placing electrically conductive and semi-conductive patterns on a substrate, comprising the steps of:

(a) depositing a releasable layer of electrically conductive material on a transfer agent;

(b) applying an adhesive on a substrate to a desired pattern;

(c) joining said transfer agent and said substrate so that said adhesive on said substrate contacts a portion of the conductive layer on said transfer agent and binds the portion to said substrate;

(d) separating said transfer agent and said substrate to remove a pattern of conductive layer from the transfer agent and transfer said removed pattern to said substrate where said removed pattern provides electrical current paths, said removed conductive pattern having the same peripheral configurations as the adhesive pattern;

(e) applying a layer of adhesive over the removed conductive pattern on said substrate, said adhesive layer having at least one void and providing electrical insulation for said removed conductive pattern;

(f) applying an electrically conductive interconnecting agent in the void of the layer of adhesive applied in step (e);

(g) depositing a releasable layer of electrically conductive material on a second transfer agent;

(h) applying an adhesive on a waste removing agent to a desired pattern;

(i) joining said waste removing agent and said second transfer agent so that said adhesive on said waste removing agent contacts a portion of the conductive layer on said second transfer agent and binds the portion to said waste removing agent;

(j) separating said waste removing agent and said second transfer agent to remove a pattern of the conductive layer with the waste removing agent and to leave a desired remaining pattern of the conductive layer on the transfer agent, the removed pattern having the same configuration as the adhesive pattern, the remaining pattern being the negative of said adhesive pattern;

(k) joining the second transfer agent and said substrate so that the adhesive applied on said substrate in step (e) contacts the remaining conductive pattern on said second transfer agent and binds said pattern to said substrate so that the remaining conductive pattern makes electrical contact with the electrically conductive interconnecting agent of step (f); and

(l) repeating steps (e) through (k) to provide the desired number of conductive layers which form electric paths.

12. A method for making electronic components by placing electrically conductive and semi-conductive patterns on a substrate, comprising the steps of:

(a) depositing a releasable layer of electrically conductive material on a substrate;

(b) applying an adhesive on a waste removing agent to a desired pattern;

(c) joining said waste removing agent and said substrate so that said adhesive on said waste removing agent contacts a portion of the conductive layer on said substrate and binds the portion to said waste removing agent; and

(d) separating said waste removing agent and said substrate to remove a pattern of the conductive layer and to leave a desired remaining pattern of the conductive layer and establish electrical current paths, said removed pattern having the same configuration as the pattern of adhesive, said remaining pattern of the conductive layer being the negative of said pattern of adhesive.

13. The method of claim 12, further comprising the step of curing said adhesive applied in step (b) while said waste removing agent remains joined with said substrate.

14. A method for making electronic components by placing electrically conductive and semi-conductive patterns on a substrate comprising the steps of:

(a) a depositing a releasable layer of electrically conductive material on a substrate;

(b) applying an adhesive on a waste removing agent to a desired pattern;

(c) joining said waste removing agent and said substrate so that said adhesive on said waste removing agent contacts a portion of the conductive layer on said substrate and binds the portion to said waste removing agent;

(d) separating said waste removing agent and said substrate to remove a pattern of the conductive layer and to leave a desired remaining pattern of the conductive layer and establish electrical current paths, said removed pattern having the same configuration as the pattern of adhesive, said remaining pattern of the conductive layer being the negative of said pattern of adhesive;

(e) applying a layer of insulating material over said desired remaining conductive pattern, said insulating layer having at least one void and providing electrical insulation for the conductive layer which it covers;

(f) applying a layer of release agent over said insulating layer, said release layer having at least one void, said void intersecting the void in said insulating layer;

(g) depositing a second releasable layer of electrically conductive particles on the release layer and on said insulating layer, said second conductive layer making electrical contact with the first conductive layer through the voids in said insulating and release layers; and

(h) repeating steps (b) through (d).