Radiation attenuation shielding

• US 4,869,970 A
• Filed: 11/09/1987
• Issued: 09/26/1989
• Est. Priority Date: 07/14/1986
• Status: Expired due to Fees

• Current Assignee: Shipley Company, Inc.
• Original Assignee: Shipley Company, Inc.
• Inventors: Gulla, Michael, Benjamin, Terrell A., Farsi, Mark
• Primary Examiner(s): Rutledge, L. Dewayne
• Assistant Examiner(s): WYSZOMIERSKI, GEORGE P
• Application Number:
  US07/118,439
• Time in Patent Office: 687 Days
• Field of Search: 428/621, 428/666, 428/667, 428/675, 428/678, 428/680, 174/35 MS
• US Class Current: 428/621
• CPC Class Codes: C23C 18/50 with alloys based on iron, cobalt or nickel
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 3/244 Finish plating of conductors, especially of copper conductors, e.g. for pads or lands selective plating methods H05K3/243; finish plating of conductors made by printing techniques H05K3/246; solder as finish H05K3/3457, e.g. by plating H05K3/3473
• CPC Class Codes: Y10T 428/12535 with additional, spatially distinct nonmetal component
• CPC Class Codes: Y10T 428/1291 Next to Co-, Cu-, or Ni-base component
• CPC Class Codes: Y10T 428/12931 Co-, Fe-, or Ni-base components, alternative to each other
• CPC Class Codes: Y10T 428/12944 Ni-base component

Abstract

An electromagnetic radiation attenuating coating comprising an electronic housing base material coating with a first electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel and cobalt, and phosphorus rich in copper and a second electroless metal alloy of copper, a member from the group of nickel, cobalt and mixtures of nickel land cobalt, and phosphorus rich in nickel. The coating provides superior radiation attenuation and comprises fewer processing steps in its formation.

Claims

1. An electronic base material having an electromagnetic radiation attenuating coating, said base material having a dielectric surface coated with an electroless alloy metal coating where

a. a first electroless alloy metal coating in contact with the surface of the base material is an alloy of copper, a member selected from the group consisting of cobalt, nickel and mixtures of cobalt and nickel, and phosphorus with a predominant proportion of the metal copper, and

b. a second electroless alloy metal coating furthest remote from the surface of the base material is an alloy of copper, a member selected from the group consisting of cobalt, nickel and mixtures of cobalt and nickel and phosphorus with a predominant proportion of the metal nickel, cobalt or a mixture of the two, said first and second electroless alloy coatings being in contact with each other.

2. The electronic base material of claim 1 where the first electroless alloy metal coating has a copper concentration of at least 70 weight percent of the total alloy with nickel and phosphorus comprising the balance of the alloy.

3. The electronic base material of claim 2 where the copper concentration varies between 95 and 99 weight percent.

4. The electronic base material of claim 1 where the first electroless alloy metal coating has a copper concentration of at least 70 weight percent of the total alloy with cobalt and phosphorus comprising the balance of the alloy.

5. The electronic base material of claim 1 where the second electroless alloy metal coating has a concentration of the member selected from the group consisting of nickel, cobalt and mixtures thereof of at least 50 weight percent of the total alloy with copper and phosphorus comprising the balance of the alloy.

6. The electronic base material of claim 5 where the member from the group is nickel.

7. The electronic base material of claim 6 where the nickel concentration varies between 60 and 95 weight percent.

8. The electronic base material of claim 5 where the member from the group is cobalt.

9. The electronic base material of claim 8 where the cobalt concentration varies between 60 and 95 weight percent.

10. The electronic base material of claim 1 where the electromagnetic radiation attenuating coating is a single layer having a plurality of layers having a copper concentration gradient.

11. The electronic base material of claim 1 where the first layer in contact with the electronic base material is rich in copper and a second layer furthest remote from the surface of the electronic base material is rich in a member selected from the group consisting of nickel, cobalt and mixtures thereof.

12. The electronic base material of claim 1 where the top surface furthest remote from the electronic base material comprises a conversion coating of chromium and a member selected from the group consisting of nickel, cobalt and mixtures thereof.