Bonding thermoplastic layers via electrical heating
First Claim
1. A method of bonding a thermoplastic layer to a substrate, the thermoplastic layer and the substrate each comprising at least one layer which consists of substantially unidirectional electrical conductors embedded in and individually coated with thermoplastic material, the method comprising placing said thermoplastic later in contact with said substrate;
- and applying an alternating electromagnetic field so as to induce electric currents in conductors whereby heat generated by said currents passing through said conductors causes thermoplastic materials to bond said later to said substrate.
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Accused Products
Abstract
A method of bonding a thermoplastic layer (22), such as APC-2, to a substrate (21) in which the thermoplastic layer (22) comprises electrical conductors such as carbon fibres, embedded in thermoplastic material such as PEEK. The method comprises placing the thermoplastic layer (22) in contact with the substrate (21); and inducing electric currents in the conductors whereby heat generated by the currents passing through the conductors causes thermoplastic material to bond the layer to the substrate.
36 Citations
9 Claims
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1. A method of bonding a thermoplastic layer to a substrate, the thermoplastic layer and the substrate each comprising at least one layer which consists of substantially unidirectional electrical conductors embedded in and individually coated with thermoplastic material, the method comprising placing said thermoplastic later in contact with said substrate;
- and applying an alternating electromagnetic field so as to induce electric currents in conductors whereby heat generated by said currents passing through said conductors causes thermoplastic materials to bond said later to said substrate.
- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
Specification