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Bonding thermoplastic layers via electrical heating

  • US 4,871,412 A
  • Filed: 02/24/1988
  • Issued: 10/03/1989
  • Est. Priority Date: 03/02/1987
  • Status: Expired due to Fees
First Claim
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1. A method of bonding a thermoplastic layer to a substrate, the thermoplastic layer and the substrate each comprising at least one layer which consists of substantially unidirectional electrical conductors embedded in and individually coated with thermoplastic material, the method comprising placing said thermoplastic later in contact with said substrate;

  • and applying an alternating electromagnetic field so as to induce electric currents in conductors whereby heat generated by said currents passing through said conductors causes thermoplastic materials to bond said later to said substrate.

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